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FM33256B-G

Infineon Technologies

FM33256B-G by Infineon Technologies

FM33256B-G by Infineon Technologies is a 32KX8 EEPROM+FLASH memory IC with 32768 words and 262144 bit memory density. Operating in synchronous mode, it has a supply voltage range of 2.7V to 3.6V, making it suitable for industrial applications requiring reliable non-volatile memory storage in a small outline package.

Median Price

$13.800

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 2 parts In-Stock

1+ parts

$29.910

100+ parts

$8.910

1k+ parts

$8.790

10k+ parts

-

2

$29.910

$8.910

$8.790

-

Rochester

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$10.490

1k+ parts

$9.380

10k+ parts

$8.830

56

-

$10.490

$9.380

$8.830

Verical

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$13.800

1k+ parts

-

10k+ parts

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56

-

$13.800

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 573 parts In-Stock

1+ parts

$11.096

100+ parts

-

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573

$11.096

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$13.991

100+ parts

-

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100

$13.991

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-

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TME

Poland . 3 parts In-Stock

1+ parts

$21.900

100+ parts

$15.400

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-

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3

$21.900

$15.400

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Chip Stock

USA . 14,173 parts In-Stock

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14,173

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Vyrian

USA . 75 parts In-Stock

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75

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Flip Electronics

USA . 39 parts In-Stock

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39

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 87 parts In-Stock

1+ parts

$3.826

100+ parts

$3.673

1k+ parts

$3.520

10k+ parts

-

87

$3.826

$3.673

$3.520

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Aztec Data Supply Inc.

USA . 71 parts In-Stock

1+ parts

$3.952

100+ parts

-

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71

$3.952

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Corohmni

South Africa . 26 parts In-Stock

1+ parts

$5.544

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26

$5.544

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Semicontronic

India . 75 parts In-Stock

1+ parts

$9.930

100+ parts

$9.682

1k+ parts

$9.632

10k+ parts

-

75

$9.930

$9.682

$9.632

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Corphita

USA . 74 parts In-Stock

1+ parts

$10.512

100+ parts

-

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74

$10.512

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$13.711

100+ parts

-

1k+ parts

$13.163

10k+ parts

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1,000

$13.711

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$13.163

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Continental Prestige Electronics

USA . 4,508 parts In-Stock

1+ parts

$13.991

100+ parts

-

1k+ parts

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10k+ parts

$13.711

4,508

$13.991

-

-

$13.711

AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$14.080

100+ parts

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622

$14.080

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Microchip USA

USA . 2,952 parts In-Stock

1+ parts

$31.390

100+ parts

$30.940

1k+ parts

$30.720

10k+ parts

$30.490

2,952

$31.390

$30.940

$30.720

$30.490

QUARKTWIN TECHNOLOGY LTD

USA . 20,729 parts In-Stock

1+ parts

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20,729

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Lixinc

USA . 13,894 parts In-Stock

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Kepictronics

USA . 7,132 parts In-Stock

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7,132

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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S.R.D Solutions

India . 1,800 parts In-Stock

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1,800

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Perfect Parts

USA . 1,724 parts In-Stock

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1,724

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Argo Parts USA

USA . 592 parts In-Stock

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592

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Metaverse IC Inc.

Canada . 280 parts In-Stock

1+ parts

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280

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Overview

Unlock the power of cutting-edge technology with the FM33256B-G by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality memory ICs that are versatile and reliable. This product is perfect for a wide range of applications, from consumer electronics to industrial automation. Its innovative design and advanced features provide customers with exceptional value and performance. Experience seamless operation and enhanced functionality with the FM33256B-G, setting new standards in memory circuit technology. Elevate your projects with this high-quality, efficient solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the memory IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient soldering onto circuit boards, saving time and effort in assembly.

Operating Mode: SYNCHRONOUS

Enhances data transfer efficiency and synchronization in communication with other components.

Memory Type: EEPROM+FLASH

Combination of EEPROM and FLASH memory provides flexibility and versatility for data storage and retrieval.

Temperature Grade: INDUSTRIAL

Can operate effectively in harsh industrial environments with varying temperature ranges.

Technology: CMOS

Utilizes low power consumption and high noise immunity for efficient memory operations.

Technical Specifications

Other Function Memory ICs FM33256B-G attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.6483 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Mixed Memory Type:

EEPROM+FLASH

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Trade Compliance

FM33256B-G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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