Loading...

FM33256B-GTR

Infineon Technologies

FM33256B-GTR by Infineon Technologies

FM33256B-GTR by Infineon Technologies is a 32KX8 EEPROM+FLASH memory IC with CMOS technology. Operating in synchronous mode, it has a memory density of 262144 bit and supports an organization of 32768 words. This small outline package is ideal for industrial applications requiring a temperature range from -40 to 85 °C.

Median Price

$10.490

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35,000

-

-

-

-

Rochester

USA . 11,999 parts In-Stock

1+ parts

-

100+ parts

$10.490

1k+ parts

$9.380

10k+ parts

$8.830

11,999

-

$10.490

$9.380

$8.830

Verical

USA . 11,010 parts In-Stock

1+ parts

-

100+ parts

$13.113

1k+ parts

$11.725

10k+ parts

$11.037

11,010

-

$13.113

$11.725

$11.037

DigiKey

USA . 9,769 parts In-Stock

1+ parts

-

100+ parts

$6.600

1k+ parts

-

10k+ parts

-

9,769

-

$6.600

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 1,900 parts In-Stock

1+ parts

$10.719

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

$10.719

-

-

-

Digiode

USA . 387 parts In-Stock

1+ parts

$11.096

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$11.096

-

-

-

Vyrian

USA . 12,207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,207

-

-

-

-

Flip Electronics

USA . 9,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,769

-

-

-

-

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 250 parts In-Stock

1+ parts

$4.353

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$4.353

-

-

-

Modulus Dynamics

Lithuania . 5,240 parts In-Stock

1+ parts

$4.426

100+ parts

$4.249

1k+ parts

$4.072

10k+ parts

-

5,240

$4.426

$4.249

$4.072

-

Semicontronic

India . 16,513 parts In-Stock

1+ parts

$9.930

100+ parts

$9.682

1k+ parts

$9.632

10k+ parts

-

16,513

$9.930

$9.682

$9.632

-

Corphita

USA . 720 parts In-Stock

1+ parts

$10.512

100+ parts

-

1k+ parts

-

10k+ parts

-

720

$10.512

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,621

-

-

-

-

Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,200

-

-

-

-

Lixinc

USA . 6,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,723

-

-

-

-

Metaverse IC Inc.

Canada . 5,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,696

-

-

-

-

Microchip USA

USA . 4,772 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,772

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Futuretech Components

Singapore . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Continental Prestige Electronics

USA . 1,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,856

-

-

-

-

Argo Parts USA

USA . 1,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

-

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Unlock the full potential of your electronic devices with the FM33256B-GTR from Infineon Technologies. Known for its high-quality products, Infineon Technologies brings you a cutting-edge memory circuit that combines EEPROM and FLASH technologies for unparalleled performance. Ideal for a wide range of applications, this small outline IC offers reliability and efficiency, operating in synchronous mode with an impressive 32KX8 organization. With a wide temperature range and industrial-grade technology, the FM33256B-GTR ensures optimal functionality even in challenging conditions. Upgrade your devices today with this innovative memory solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and resistant to heat and moisture, making it suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving time and space during assembly.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, optimizing space on the PCB for other components.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and data transfer, enhancing overall system performance.

Mixed Memory Type: EEPROM+FLASH

The combination of EEPROM and FLASH memory provides both non-volatile and reprogrammable storage options for versatile data storage needs.

No. of Terminals: 14

The ample number of terminals allows for a secure and reliable connection, reducing the risk of signal loss or interference.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space, making it ideal for compact electronic devices and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this memory IC can withstand rigorous operating conditions without overheating.

Organization: 32KX8

The 32KX8 organization provides a large memory capacity and efficient data retrieval for complex applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in harsh cold environments.

Terminal Finish: PURE TIN

The pure tin terminal finish offers excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and offer redundancy for improved signal integrity.

Maximum Seated Height: 1.727 mm

The low seated height allows for a slim and compact profile, ideal for space-constrained applications.

Width: 3.8985 mm

The narrow width makes this memory IC suitable for applications where board space is limited.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature allows for proper soldering and ensures reliable connections.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this memory IC can withstand the soldering process without undergoing damage.

Length: 8.6483 mm

The compact length of this memory IC suits applications where space is limited, without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this memory IC suitable for use in rugged environments with fluctuating temperatures.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support, making it suitable for applications where durability is crucial.

No. of Words: 32768 words

The large number of words offers ample memory capacity for storing data and instructions in various applications.

Memory Width: 8

The memory width of 8 bits allows for efficient data processing and retrieval for a wide range of applications.

Terminal Pitch: 1.27 mm

The standard terminal pitch offers compatibility with common PCB layouts and facilitates easy soldering.

No. of Words Code: 32K

The optimized word code ensures efficient memory utilization and seamless integration into existing systems.

Moisture Sensitivity Level (MSL): 3

With moisture sensitivity level 3, this memory IC is suitable for reflow soldering processes and ensures reliability in humid environments.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance provides versatility in power source options and enhances compatibility with different systems.

Memory Density: 262144 bit

The high memory density allows for storing a large amount of data in a compact form factor, ideal for data-intensive applications.

Memory IC Type: MEMORY CIRCUIT

The memory circuit type ensures efficient data storage and retrieval, making it a reliable choice for various electronic devices and systems.

Technical Specifications

Other Function Memory ICs FM33256B-GTR attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.6483 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Mixed Memory Type:

EEPROM+FLASH

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Trade Compliance

FM33256B-GTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6