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SN74LS170D3

Texas Instruments

SN74LS170D3 by Texas Instruments

SN74LS170D3 by Texas Instruments is a TTL technology memory IC with 16 terminals, operating at 5V. It has a small outline package shape and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring reliable memory functions in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,787 parts In-Stock

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8,787

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Digiode

USA . 3,659 parts In-Stock

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3,659

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,838 parts In-Stock

1+ parts

$4.191

100+ parts

-

1k+ parts

$4.631

10k+ parts

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1,838

$4.191

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$4.631

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DigiPath Technology Company

USA . 1,289 parts In-Stock

1+ parts

$4.615

100+ parts

$4.246

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1,289

$4.615

$4.246

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IDEA Electronic Components Group

UK . 1,949 parts In-Stock

1+ parts

$4.709

100+ parts

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$4.238

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1,949

$4.709

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$4.238

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ChromeModa Solutions

Germany . 75 parts In-Stock

1+ parts

$4.709

100+ parts

$3.861

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75

$4.709

$3.861

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AZTECH Wire

Italy . 236 parts In-Stock

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$8.769

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236

$8.769

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One Stop Electronics

USA . 1,022 parts In-Stock

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$30.000

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1,022

$30.000

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Corphita

USA . 1,639 parts In-Stock

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1,639

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Overview

Unlock a world of possibilities with the Texas Instruments SN74LS170D3, a premium quality Other Function Memory IC that offers unparalleled performance and reliability. Manufactured by industry-leading Texas Instruments, this product is designed to meet the highest standards of excellence. From industrial automation to consumer electronics, this versatile component is perfect for a wide range of applications. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SN74LS170D3. Elevate your projects with top-tier quality and innovation today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the memory IC, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this memory IC is compatible with standard power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 70 °C

The memory IC can operate efficiently at temperatures up to 70°C, ensuring reliable performance even in demanding conditions.

Technology: TTL

Utilizing TTL technology provides fast and efficient data processing, suitable for applications requiring high-speed performance.

Technical Specifications

Other Function Memory ICs SN74LS170D3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS170D3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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