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TMS2564-35JL

Texas Instruments

TMS2564-35JL by Texas Instruments

TMS2564-35JL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 350 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,878 parts In-Stock

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Vyrian

USA . 3,701 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 69 parts In-Stock

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69

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Q Components

USA . 12 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1 parts In-Stock

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Parana Technologies

USA . 1,927 parts In-Stock

1+ parts

$5.245

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$5.863

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1,927

$5.245

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$5.863

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DigiPath Technology Company

USA . 1,632 parts In-Stock

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$5.775

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$5.313

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1,632

$5.775

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

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$5.893

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$5.304

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$5.893

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$5.304

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ChromeModa Solutions

Germany . 1,015 parts In-Stock

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$5.893

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$4.832

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One Stop Electronics

USA . 850 parts In-Stock

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$11.000

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850

$11.000

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AZTECH Wire

Italy . 896 parts In-Stock

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$14.345

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Corphita

USA . 566 parts In-Stock

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Overview

Discover the superior quality and reliability of the TMS2564-35JL by Texas Instruments, a leading manufacturer in the industry. This versatile memory IC is perfect for a wide range of applications, offering customers unmatched value and benefits. With its high performance and 3-state output characteristics, this product provides seamless operation and enhanced efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your system with the TMS2564-35JL and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides good thermal conductivity and insulation, ensuring stable performance.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards and compact design.

Input/Output Type: COMMON

Common input/output type simplifies circuit design and compatibility with other components.

No. of Terminals: 28

Having 28 terminals provides flexibility and connectivity options in the circuit.

Package Style (Meter): IN-LINE

In-line package style is space-saving and easy to mount on the PCB.

Maximum Operating Temperature: 70 °C

Operating temperature up to 70°C ensures reliability in various environmental conditions.

Organization: 8KX8

Organized as 8Kx8, providing high memory capacity and data storage capabilities.

Output Characteristics: 3-STATE

3-state output allows for efficient data transfer and multitasking capabilities.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures functionality in colder environments.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and simplifies circuit layout.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes this product suitable for standard commercial applications.

Technology: MOS

MOS technology ensures high speed and low power consumption for efficient performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and robust connections on the PCB.

No. of Words: 8192 words

With 8192 words, this memory IC has ample storage capacity for data processing.

Memory Width: 8

Memory width of 8 bits allows for efficient data handling and processing.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54mm provides ease of soldering and assembly on the circuit board.

No. of Words Code: 8K

With a code of 8K, this memory IC offers a specific word count for memory storage.

Memory Density: 65536 bit

High memory density of 65536 bits enables storing large amounts of data in a compact space.

Maximum Access Time: 350 ns

Fast maximum access time of 350 nanoseconds ensures quick data retrieval and processing.

Technical Specifications

Other Function Memory ICs TMS2564-35JL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

350 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

Memory Density:

65536 bit

Memory Width:

8

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2564-35JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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