Loading...

TMS4020NC

Texas Instruments

TMS4020NC by Texas Instruments

TMS4020NC by Texas Instruments is a 1KX2 MOS memory IC with 2048-bit density. It features separate I/O, open-drain output, and operates b/w -25°C to 70°C. Commonly used in applications requiring high-density memory storage with dual-terminal positions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,684

-

-

-

-

Vyrian

USA . 4,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,584

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 776 parts In-Stock

1+ parts

$3.192

100+ parts

-

1k+ parts

$3.715

10k+ parts

-

776

$3.192

-

$3.715

-

DigiPath Technology Company

USA . 71 parts In-Stock

1+ parts

$3.515

100+ parts

-

1k+ parts

-

10k+ parts

-

71

$3.515

-

-

-

ChromeModa Solutions

Germany . 3,533 parts In-Stock

1+ parts

$3.587

100+ parts

$2.941

1k+ parts

-

10k+ parts

-

3,533

$3.587

$2.941

-

-

IDEA Electronic Components Group

UK . 1,174 parts In-Stock

1+ parts

$3.587

100+ parts

-

1k+ parts

$3.228

10k+ parts

-

1,174

$3.587

-

$3.228

-

AZTECH Wire

Italy . 438 parts In-Stock

1+ parts

$16.339

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$16.339

-

-

-

One Stop Electronics

USA . 988 parts In-Stock

1+ parts

$26.000

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$26.000

-

-

-

Corphita

USA . 3,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,869

-

-

-

-

Overview

Discover the TMS4020NC by Texas Instruments, a top-quality Other Function Memory IC designed to meet your needs. With a reputation for excellence, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile product is perfect for a wide range of applications, offering exceptional value and benefits to customers. Experience the advantage of reliable performance and innovative features with the TMS4020NC. Unlock new possibilities and elevate your projects with this exceptional memory IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product long-lasting.

Package Shape: RECTANGULAR

Rectangular shape allows for easy and efficient integration into various electronic devices.

Input/Output Type: SEPARATE

Separate input/output type allows for independent control of input and output signals, enhancing flexibility in usage.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options and compatibility with a wide range of systems.

Package Style (Meter): IN-LINE

In-line package style offers convenience for installation and space-saving benefits in system design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product ensures reliable performance under normal operating conditions.

Organization: 1KX2

1KX2 organization structure allows for efficient storage and retrieval of data, enhancing overall memory management.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristics provide versatility and compatibility with a variety of circuit configurations.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature of -25°C ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal position offers improved connectivity options and enhances signal transmission efficiency.

Technology: MOS

MOS technology ensures high speed and low power consumption, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for secure and stable connections, ensuring reliable performance in various applications.

No. of Words: 1024 words

Supporting 1024 words enables efficient storage and retrieval of data, making the product suitable for memory-intensive applications.

Memory Width: 2

A memory width of 2 enables efficient data transfer and processing, enhancing overall system performance.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy integration and compatibility with standard electronic components and PCBs.

No. of Words Code: 1K

Having a code for 1K words simplifies addressing and management of memory locations, enhancing usability and efficiency.

Memory Density: 2048 bit

With a memory density of 2048 bit, the product offers ample storage capacity for data-intensive applications.

Refresh Cycles: 1024

Supporting 1024 refresh cycles ensures data integrity and reliability, making the product suitable for continuous operation.

Technical Specifications

Other Function Memory ICs TMS4020NC attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDIP-T24

Memory Density:

2048 bit

Memory Width:

2

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

1KX2

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Refresh Cycles:

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS4020NC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19