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S27KL0641DABHB020

Infineon Technologies

S27KL0641DABHB020 by Infineon Technologies

Infineon's S27KL0641DABHB020 is a 8MX8 MEMORY CIRCUIT with 67108864 bit Memory Density. It operates at 3V, -40 to 105 °C, and has AEC-Q100 Screening Level for INDUSTRIAL applications. The PLASTIC/EPOXY GRID ARRAY IC is SYNCHRONOUS with 24 terminals in a RECTANGULAR package style.

Median Price

$4.128

Lifecycle Status

EOL

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,140 parts In-Stock

1+ parts

$4.150

100+ parts

$3.376

1k+ parts

-

10k+ parts

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1,140

$4.150

$3.376

-

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Arrow

USA . 442 parts In-Stock

1+ parts

$4.526

100+ parts

$4.106

1k+ parts

$3.826

10k+ parts

$3.787

442

$4.526

$4.106

$3.826

$3.787

Rochester

USA . 91,329 parts In-Stock

1+ parts

-

100+ parts

$3.320

1k+ parts

$2.970

10k+ parts

$2.790

91,329

-

$3.320

$2.970

$2.790

Verical

USA . 442 parts In-Stock

1+ parts

-

100+ parts

$4.106

1k+ parts

$3.826

10k+ parts

$3.787

442

-

$4.106

$3.826

$3.787

Distributors (In-Stock)

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Digiode

USA . 93 parts In-Stock

1+ parts

$3.506

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93

$3.506

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Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$3.884

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84

$3.884

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Vyrian

USA . 22,997 parts In-Stock

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22,997

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Chip Stock

USA . 17,614 parts In-Stock

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Flip Electronics

USA . 1,355 parts In-Stock

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1,355

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DigiKey Marketplace

USA . 89 parts In-Stock

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LWI Electronics Inc

India . 38 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,748 parts In-Stock

1+ parts

$2.707

100+ parts

$2.599

1k+ parts

$2.490

10k+ parts

-

3,748

$2.707

$2.599

$2.490

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Ampacity Inc.

Singapore . 22,765 parts In-Stock

1+ parts

$2.870

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$2.870

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Corphita

USA . 87 parts In-Stock

1+ parts

$3.321

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87

$3.321

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Component Stockers USA

USA . 4,199 parts In-Stock

1+ parts

$3.730

100+ parts

$3.430

1k+ parts

$3.430

10k+ parts

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4,199

$3.730

$3.430

$3.430

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Argo Parts USA

USA . 4,461 parts In-Stock

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$3.826

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$3.826

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Continental Prestige Electronics

USA . 1,590 parts In-Stock

1+ parts

$3.826

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$3.749

1,590

$3.826

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-

$3.749

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.884

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1,000

$3.884

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Futuretech Components

Singapore . 6,562 parts In-Stock

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6,562

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Microchip USA

USA . 4,355 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Infinite Electronics LLP (Excess)

. 340 parts In-Stock

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340

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Kepictronics

USA . 184 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Akira Global LLC

USA . 4 parts In-Stock

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Overview

Elevate your products and innovate with the S27KL0641DABHB020 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers high-quality memory ICs that are versatile and reliable. Ideal for a wide range of applications, this product offers seamless performance and efficiency for your projects. With its advanced features and cutting-edge technology, the S27KL0641DABHB020 provides exceptional value and benefits to customers looking for top-tier memory solutions. Experience the advantage of Infineon's expertise and elevate your designs with this powerful memory circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to mount on a PCB, saves space and simplifies the assembly process.

Screening Level: AEC-Q100

Meets automotive electronic component standards, ensuring reliability and quality.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers for efficient performance.

Nominal Supply Voltage (Vsup): 3V

Compatible with most standard voltage requirements, versatile for different systems.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments, ensuring reliable operation.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, ideal for industrial applications.

Technology: CMOS

Low power consumption and high noise immunity, efficient for memory circuits.

Memory Width: 8

Provides standard data width for compatibility with various systems.

Memory Density: 67108864 bit

High storage capacity, suitable for storing large amounts of data.

Technical Specifications

Other Function Memory ICs S27KL0641DABHB020 attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KL0641DABHB020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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