Loading...

S27KS0641DPBHI020

Infineon Technologies

S27KS0641DPBHI020 by Infineon Technologies

Infineon's S27KS0641DPBHI020 is a 8MX8 memory IC with 67108864 bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for industrial applications requiring high memory capacity in a compact GRID ARRAY package.

Median Price

$3.359

Lifecycle Status

EOL

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 245 parts In-Stock

1+ parts

$3.010

100+ parts

$2.550

1k+ parts

-

10k+ parts

-

245

$3.010

$2.550

-

-

Chip1Stop

Japan . 4,540 parts In-Stock

1+ parts

$3.631

100+ parts

$3.102

1k+ parts

$3.047

10k+ parts

-

4,540

$3.631

$3.102

$3.047

-

Arrow

USA . 224 parts In-Stock

1+ parts

$3.670

100+ parts

$3.160

1k+ parts

$3.044

10k+ parts

-

224

$3.670

$3.160

$3.044

-

Element14

Singapore . 245 parts In-Stock

1+ parts

$4.920

100+ parts

$3.730

1k+ parts

$3.520

10k+ parts

-

245

$4.920

$3.730

$3.520

-

Rochester

USA . 8,730 parts In-Stock

1+ parts

-

100+ parts

$2.760

1k+ parts

$2.470

10k+ parts

$2.320

8,730

-

$2.760

$2.470

$2.320

Verical

USA . 5,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.087

10k+ parts

$2.900

5,876

-

-

$3.087

$2.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 522 parts In-Stock

1+ parts

$2.518

100+ parts

-

1k+ parts

-

10k+ parts

-

522

$2.518

-

-

-

Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$3.535

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$3.535

-

-

-

Flip Electronics

USA . 3,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,175

-

-

-

-

Vyrian

USA . 2,059 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

-

-

-

-

ComSIT Distribution GmbH

Germany . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,218 parts In-Stock

1+ parts

$2.300

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

$2.300

-

-

-

Corphita

USA . 33 parts In-Stock

1+ parts

$2.385

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$2.385

-

-

-

Component Stockers USA

USA . 7,740 parts In-Stock

1+ parts

$3.100

100+ parts

$2.850

1k+ parts

$2.850

10k+ parts

-

7,740

$3.100

$2.850

$2.850

-

Modulus Dynamics

Lithuania . 3,307 parts In-Stock

1+ parts

$3.404

100+ parts

$3.268

1k+ parts

$3.132

10k+ parts

-

3,307

$3.404

$3.268

$3.132

-

Argo Parts USA

USA . 4,079 parts In-Stock

1+ parts

$3.535

100+ parts

-

1k+ parts

-

10k+ parts

-

4,079

$3.535

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.535

100+ parts

-

1k+ parts

$3.358

10k+ parts

$3.288

1,000

$3.535

-

$3.358

$3.288

Corohmni

South Africa . 514 parts In-Stock

1+ parts

$3.701

100+ parts

-

1k+ parts

-

10k+ parts

-

514

$3.701

-

-

-

Continental Prestige Electronics

USA . 926 parts In-Stock

1+ parts

$19.980

100+ parts

$18.380

1k+ parts

-

10k+ parts

-

926

$19.980

$18.380

-

-

Microchip USA

USA . 465 parts In-Stock

1+ parts

$29.900

100+ parts

$29.720

1k+ parts

$29.620

10k+ parts

$29.530

465

$29.900

$29.720

$29.620

$29.530

Robosynatics

Brazil . 4,389 parts In-Stock

1+ parts

-

100+ parts

$2.264

1k+ parts

$2.218

10k+ parts

$2.218

4,389

-

$2.264

$2.218

$2.218

Lucentia Tech

USA . 4,389 parts In-Stock

1+ parts

-

100+ parts

$2.264

1k+ parts

$2.218

10k+ parts

$2.218

4,389

-

$2.264

$2.218

$2.218

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the S27KS0641DPBHI020 by Infineon Technologies. Crafted with precision and expertise, this memory circuit offers unparalleled performance and reliability that exceeds industry standards. Ideal for a wide range of applications, this product provides seamless operation in challenging environments with its industrial temperature grade and high moisture sensitivity level. Experience the ultimate value and benefits that this advanced memory IC brings to your projects. Elevate your designs with the trusted quality and innovative features of Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the memory IC, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mountable makes the installation of this memory IC easier and more convenient in electronic circuits.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures efficient and synchronized data transfer within the memory circuit, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V provides a balance between power consumption and performance for the memory IC.

Organization: 8MX8

The 8MX8 organization indicates a high memory capacity of 64Mb, suitable for storing large amounts of data in the memory circuit.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows the memory IC to operate reliably in a wide range of temperature environments, making it versatile for industrial applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the memory IC efficient and reliable in various electronic systems.

Memory Density: 67108864 bit

With a high memory density of 67,108,864 bits, this memory IC can store a large amount of data, suitable for applications requiring extensive memory capacity.

Technical Specifications

Other Function Memory ICs S27KS0641DPBHI020 attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KS0641DPBHI020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20