Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Length: 8 mm;
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Other Function Memory ICs S27KL0641DABHV030 attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies
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S27KL0641DABHV030 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Loras Industries
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
Plessey Semiconductors Discrete Components Div
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Rfe International
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Lite-on Semiconductor
Toshiba
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
M28F221-80XN3
STMicroelectronics
Other Memory ICs;
DS2502R+U
Analog Devices
Other Memory ICs; Peak Reflow Temperature (C): 260; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
M36W216TI85ZA1
M36W216TI85ZA1 from STMicroelectronics is a low-profile, asynchronous mixed memory IC featuring 16Mbit density with Flash+SRAM technology. It operates at 3V, supports up to 70 °C, and has a max access time of 85ns. Ideal for compact applications requiring efficient data storage and retrieval.
MR25H256ACDFR
Everspin Technologies
MR25H256ACDFR by Everspin: 32KX8 SPI BUS SERIAL EEPROM with 262144 bit memory density, operates at 3V, -40 to 85 °C. Ideal for industrial applications requiring small outline, heat sink package with synchronous operation.
DS1207-G2C
Analog Devices' DS1207-G2C is a CMOS MEMORY CIRCUIT with SYNCHRONOUS operation. It has an operating temperature range of 0-70 °C and TIN LEAD terminal finish. Ideal for applications requiring high-speed memory functions in COMMERCIAL grade environments.
FM25L256-GC
Infineon Technologies
DS2401Z+T&R
DS2401Z+T&R by Analog Devices is a 64X1 memory circuit with a memory density of 64 bits. It operates asynchronously at a nominal voltage of 5V and has a small outline package style. This IC is commonly used in industrial applications requiring low power consumption and compact size.
TMS4C1070-30DJ
Texas Instruments
TMS4C1070-30DJ by Texas Instruments is a 20-terminal memory circuit IC with 5V nominal voltage. It operates in commercial temperature grade range of 0-70°C, with max access time of 25ns. This small outline package IC is suitable for various applications requiring fast memory access and low standby current consumption.
SN74ACT2151-22FN
SN74ACT2151-22FN by Texas Instruments is a 1Kx12 MEMORY CIRCUIT IC with 22ns access time, operating at 5V. It comes in a PLASTIC/EPOXY chip carrier package with 28 terminals and J BEND terminal form. Ideal for applications requiring fast memory access in commercial temperature environments.
DS1204U-XXX
DS1204U-XXX by Analog Devices is a 256-bit MEMORY CIRCUIT with 256x1 organization. Operating at 5V, it has SYNCHRONOUS mode and CMOS technology. Ideal for applications requiring special shape package in commercial temperature range of 0-70 °C.
M36W108T120ZN1
M36W108T120ZN1 from STMicroelectronics is a versatile memory IC featuring 1M x 8 organization, operating at 3/3.3V with a max access time of 120 ns. Its thin profile and asynchronous mode make it ideal for compact applications. This CMOS device supports both FLASH and SRAM technologies.
NMB1XXD128GPSU4
Intel
The Intel NMB1XXD128GPSU4 is a CMOS memory circuit with 128GX8 organization, offering 1099511627776 bit memory density. With a rectangular package shape and dual terminal position, it operates b/w 0-85 °C, suitable for high-density memory applications.
M36W108T100ZN5T
M36W108T100ZN5T by STMicroelectronics is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. Operating in asynchronous mode, it has a supply voltage range of 2.7V to 3.6V and temperature range of -20 °C to 85°C. This rectangular GRID ARRAY package is suitable for various applications requiring high-density memory solutions.
M36LLR8860D1ZAQF
M36LLR8860D1ZAQF by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates efficiently at temperatures from -25 °C to 85 °C and supports surface mount applications. Ideal for compact devices, it offers high-density storage in a small footprint.
TMS2564-45JDL
TMS2564-45JDL by Texas Instruments is an 8KX8 MOS memory IC with 65536 bit density and 450 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a DUAL terminal position. Ideal for applications requiring fast data retrieval in commercial temperature environments.
TMS27PC291-35N
M36P0R9070E0ZAQE
M36P0R9070E0ZAQE by STMicroelectronics is a CMOS memory IC with a 32M x 16 organization, operating at 1.8V. It features a thin profile grid array package and operates asynchronously within -30 °C to 85 °C. Ideal for compact electronic applications requiring efficient data storage.
TACT2151-25N
TACT2151-25N by Texas Instruments is a 1KX11 memory circuit IC with 11264-bit memory density. It operates at temperatures b/w 0°C to 70°C, offering a max access time of 25ns. This CMOS technology IC comes in an IN-LINE package style and is ideal for applications requiring high-speed memory functions.
M28F221-80XN6
AT88SC0104CA-SH
Microchip Technology
AT88SC0104CA-SH by Microchip Technology is a CRYPTO MEMORY IC with 1024 bit memory density. It operates at 3/3.3V, has an organization of 128X8, and a max access time of 250ns. This small outline package is ideal for secure applications requiring synchronous operation in industrial temperature environments.
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S27KL0641DABHI020
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
S27KL0641DABHB020
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
S27KS0641DPBHI020
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;
S27KL0641DABHB033
S27KS0641DABHA030
S27KL0641DABHA023
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;
S27KS0641DABHA033
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
S27KL0641DABHV023
S27KL0641DABHB030
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
S27KL0641DABHV033
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words;
S27KL0641DABHA033
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Memory Width: 8;
S27KL0641DABHI023
S27KL0641DABHI030
S27KL0641DABHI033
S27KL0641DABHA020
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24;
S27KL0641DABHA030
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm;
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