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S27KL0641DABHI020

Infineon Technologies

S27KL0641DABHI020 by Infineon Technologies

S27KL0641DABHI020 by Infineon Technologies is a 8MX8 MEMORY CIRCUIT with 67108864 bit Memory Density. It operates at 3V, has a temperature range of -40 to 85 °C, and features SYNCHRONOUS mode. Suitable for industrial applications, it comes in a GRID ARRAY package style with very thin profile.

Median Price

$3.087

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,129 parts In-Stock

1+ parts

$4.740

100+ parts

$3.780

1k+ parts

$3.383

10k+ parts

$3.263

2,129

$4.740

$3.780

$3.383

$3.263

Rochester

USA . 10,931 parts In-Stock

1+ parts

-

100+ parts

$2.760

1k+ parts

$2.470

10k+ parts

$2.320

10,931

-

$2.760

$2.470

$2.320

Verical

USA . 9,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.087

10k+ parts

$2.900

9,548

-

-

$3.087

$2.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$3.313

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$3.313

-

-

-

Digiode

USA . 274 parts In-Stock

1+ parts

$4.503

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$4.503

-

-

-

Flip Electronics

USA . 10,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,171

-

-

-

-

Vyrian

USA . 752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

752

-

-

-

-

Bas Electronics GmbH & Co. KG

Germany . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,498 parts In-Stock

1+ parts

$2.879

100+ parts

-

1k+ parts

-

10k+ parts

-

4,498

$2.879

-

-

-

Ampacity Inc.

Singapore . 1,193 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,193

$3.060

-

-

-

Semicontronic

India . 1,079 parts In-Stock

1+ parts

$3.060

100+ parts

$2.984

1k+ parts

$2.968

10k+ parts

-

1,079

$3.060

$2.984

$2.968

-

Modulus Dynamics

Lithuania . 349 parts In-Stock

1+ parts

$3.313

100+ parts

$3.180

1k+ parts

$3.048

10k+ parts

-

349

$3.313

$3.180

$3.048

-

Corohmni

South Africa . 313 parts In-Stock

1+ parts

$3.313

100+ parts

-

1k+ parts

-

10k+ parts

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313

$3.313

-

-

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Argo Parts USA

USA . 4,532 parts In-Stock

1+ parts

$3.690

100+ parts

-

1k+ parts

-

10k+ parts

-

4,532

$3.690

-

-

-

Continental Prestige Electronics

USA . 1,130 parts In-Stock

1+ parts

$3.690

100+ parts

-

1k+ parts

-

10k+ parts

$3.616

1,130

$3.690

-

-

$3.616

Corphita

USA . 455 parts In-Stock

1+ parts

$4.266

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$4.266

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the S27KL0641DABHI020 by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and reliability in their products. This Memory IC is versatile and can be applied in various settings, offering unmatched performance and efficiency. Experience seamless operation and enhanced functionality with this innovative product, providing you with the value and benefits you need to stay ahead in today's fast-paced world. Elevate your projects with the S27KL0641DABHI020 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides durability and protection for the memory IC, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures coordinated data transfers and accurate timing, improving overall system performance and reliability.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage of 3V, making it compatible with many systems and power sources.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE

Grid array package with a very thin profile allows for dense packing and efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range of -40 to 85°C ensures reliable performance in harsh environments and wide operating conditions.

Memory Density: 67108864 bit

High memory density of 67108864 bits allows for storing a large amount of data in a compact package, suitable for memory-intensive applications.

Memory IC Type: MEMORY CIRCUIT

Specialized memory circuit design ensures efficient data storage and retrieval, meeting the requirements of memory-specific tasks.

Technical Specifications

Other Function Memory ICs S27KL0641DABHI020 attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KL0641DABHI020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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