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S70KL1281DABHI020

Infineon Technologies

S70KL1281DABHI020 by Infineon Technologies

S70KL1281DABHI020 by Infineon Technologies is a 16MX8 MEMORY CIRCUIT with 134217728 bit memory density. It operates in SYNCHRONOUS mode at temperatures ranging from -40 to 85 °C, suitable for INDUSTRIAL applications. This PLASTIC/EPOXY IC has a GRID ARRAY package style, measures 8mm x 6mm x 1mm, and features a BALL terminal form.

Median Price

$5.862

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 131 parts In-Stock

1+ parts

$7.330

100+ parts

$5.910

1k+ parts

$5.440

10k+ parts

$4.830

131

$7.330

$5.910

$5.440

$4.830

Rochester

USA . 8,244 parts In-Stock

1+ parts

-

100+ parts

$4.690

1k+ parts

$4.200

10k+ parts

$3.950

8,244

-

$4.690

$4.200

$3.950

Verical

USA . 8,232 parts In-Stock

1+ parts

-

100+ parts

$5.862

1k+ parts

$5.250

10k+ parts

$4.938

8,232

-

$5.862

$5.250

$4.938

Flip Electronics (Authorized)

USA . 3,325 parts In-Stock

1+ parts

-

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-

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-

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3,325

-

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Distributors (In-Stock)

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Digiode

USA . 408 parts In-Stock

1+ parts

$4.959

100+ parts

-

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-

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-

408

$4.959

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.740

100+ parts

-

1k+ parts

-

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10

$5.740

-

-

-

Vyrian

USA . 720 parts In-Stock

1+ parts

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720

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Flip Electronics

USA . 621 parts In-Stock

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621

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 411 parts In-Stock

1+ parts

$3.952

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$3.952

-

-

-

Aztec Data Supply Inc.

USA . 18,827 parts In-Stock

1+ parts

$4.120

100+ parts

-

1k+ parts

-

10k+ parts

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18,827

$4.120

-

-

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Modulus Dynamics

Lithuania . 2,327 parts In-Stock

1+ parts

$4.331

100+ parts

$4.158

1k+ parts

$3.985

10k+ parts

-

2,327

$4.331

$4.158

$3.985

-

Ampacity Inc.

Singapore . 1,190 parts In-Stock

1+ parts

$4.440

100+ parts

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1,190

$4.440

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Semicontronic

India . 1,058 parts In-Stock

1+ parts

$4.440

100+ parts

$4.329

1k+ parts

$4.307

10k+ parts

-

1,058

$4.440

$4.329

$4.307

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Corphita

USA . 507 parts In-Stock

1+ parts

$4.698

100+ parts

-

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507

$4.698

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Continental Prestige Electronics

USA . 3,029 parts In-Stock

1+ parts

$5.740

100+ parts

-

1k+ parts

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10k+ parts

$5.625

3,029

$5.740

-

-

$5.625

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.740

100+ parts

-

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1,000

$5.740

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 6,058 parts In-Stock

1+ parts

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6,058

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Argo Parts USA

USA . 2,778 parts In-Stock

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2,778

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Microchip USA

USA . 221 parts In-Stock

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221

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Overview

Experience the next level of performance and reliability with the S70KL1281DABHI020 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality memory ICs that provide seamless operation in various applications. With its industrial-grade technology and innovative design, this memory circuit offers customers unparalleled value and benefits. Whether you need it for automotive, industrial, or consumer electronics, Infineon's S70KL1281DABHI020 is the perfect choice for your memory needs. Unlock the power of advanced memory solutions and elevate your products to new heights with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is known for its durability, making this product suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred in a synchronized manner, improving overall performance and reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption, enhancing the efficiency of the memory circuit and prolonging battery life.

Technical Specifications

Other Function Memory ICs S70KL1281DABHI020 attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S70KL1281DABHI020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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