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S70KS1281DPBHI020

Infineon Technologies

S70KS1281DPBHI020 by Infineon Technologies

Infineon's S70KS1281DPBHI020 is a 16MX8 memory IC with 134217728 bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for industrial applications, this grid array package has a very thin profile and operates b/w -40 to 85°C.

Median Price

$7.320

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 47 parts In-Stock

1+ parts

$7.320

100+ parts

$5.900

1k+ parts

$5.440

10k+ parts

$4.830

47

$7.320

$5.900

$5.440

$4.830

DigiKey

USA . 4 parts In-Stock

1+ parts

$7.810

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$7.810

-

-

-

Verical

USA . 338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.767

10k+ parts

$6.493

338

-

-

$6.767

$6.493

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$6.020

-

-

-

Digiode

USA . 149 parts In-Stock

1+ parts

$6.954

100+ parts

-

1k+ parts

-

10k+ parts

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149

$6.954

-

-

-

Vyrian

USA . 130 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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130

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,535 parts In-Stock

1+ parts

$2.494

100+ parts

$2.394

1k+ parts

$2.294

10k+ parts

-

3,535

$2.494

$2.394

$2.294

-

Ampacity Inc.

Singapore . 130 parts In-Stock

1+ parts

$5.750

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$5.750

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$5.900

100+ parts

-

1k+ parts

$5.664

10k+ parts

-

2,000

$5.900

-

$5.664

-

Continental Prestige Electronics

USA . 5,061 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

-

10k+ parts

$5.900

5,061

$6.020

-

-

$5.900

Corphita

USA . 436 parts In-Stock

1+ parts

$6.588

100+ parts

-

1k+ parts

-

10k+ parts

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436

$6.588

-

-

-

Component Stockers USA

USA . 500 parts In-Stock

1+ parts

$7.170

100+ parts

-

1k+ parts

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10k+ parts

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500

$7.170

-

-

-

AZTECH Wire

Italy . 220 parts In-Stock

1+ parts

$10.763

100+ parts

-

1k+ parts

-

10k+ parts

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220

$10.763

-

-

-

Microchip USA

USA . 320 parts In-Stock

1+ parts

$20.330

100+ parts

$20.040

1k+ parts

$19.890

10k+ parts

$19.750

320

$20.330

$20.040

$19.890

$19.750

QUARKTWIN TECHNOLOGY LTD

USA . 28,897 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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28,897

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Argo Parts USA

USA . 3,170 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,170

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Glotronic Ltd.

UK . 270 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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270

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-

Overview

Elevate your electronics with the S70KS1281DPBHI020 by Infineon Technologies. This cutting-edge memory IC boasts top-notch quality and reliability, thanks to its manufacturer's reputation for excellence. Ideal for a wide range of applications, this product offers seamless integration and optimal performance. With its advanced features and impressive specifications, customers can expect enhanced functionality and efficiency. Say goodbye to compromise and hello to innovation with the S70KS1281DPBHI020. Elevate your electronics with Infineon Technologies today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and versatile, providing good protection for the memory IC.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving time and ensuring reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise synchronization of data transfer, enhancing overall performance of the memory IC.

Nominal Supply Voltage / Vsup (V): 1.8

The nominal supply voltage of 1.8V provides efficient power consumption while maintaining stable operation.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE

The grid array and thin profile design make this memory IC suitable for compact electronic devices with limited space.

Memory Density: 134217728 bit

High memory density allows for storing a large amount of data in a small footprint, making this memory IC ideal for data-intensive applications.

Technical Specifications

Other Function Memory ICs S70KS1281DPBHI020 attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S70KS1281DPBHI020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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