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TMS2708JL

Texas Instruments

TMS2708JL by Texas Instruments

TMS2708JL by Texas Instruments is a 1KX8 OTP ROM memory IC with 8192-bit density and 450ns access time. It operates b/w 0-70°C, featuring a MOS technology in a ceramic rectangular package. Ideal for applications requiring fast data retrieval and storage in commercial-grade environments.

Median Price

$76.990

Lifecycle Status

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1k+

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Master Electronics

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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Digiode

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Right Parts Inc.

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IBS Electronics

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Odi Ramu Company

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Parana Technologies

USA . 2,182 parts In-Stock

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DigiPath Technology Company

USA . 1,606 parts In-Stock

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ChromeModa Solutions

Germany . 4,898 parts In-Stock

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IDEA Electronic Components Group

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Corphita

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Overview

Experience top-notch quality with the TMS2708JL by Texas Instruments, a leading manufacturer known for its exceptional products. This memory IC is perfect for a variety of applications in the technology industry. Offering reliability and efficiency, this product provides value and benefits to customers seeking high-performance solutions. Upgrade your systems with the TMS2708JL and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its excellent thermal conductivity and resistance to high temperatures, making it a durable and reliable material for electronic components.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and flexibility in circuit design.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance, enabling multiple memory devices to share a common data bus without conflict.

Technology: MOS

MOS (Metal-Oxide-Semiconductor) technology offers low power consumption and high speed performance, making the memory IC more efficient and reliable.

Memory IC Type: OTP ROM

OTP (One-Time Programmable) ROM provides permanent data storage without the need for constant power, ensuring data integrity and security.

Technical Specifications

Other Function Memory ICs TMS2708JL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2708JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

NSN

5962-01-097-7492, 5962010977492, 5962-01-150-5642, 5962011505642, 5962-01-150-5643, 5962011505643, 5962-01-156-7606, 5962011567606, 5962-01-102-5451, 5962011025451, 5962-01-102-3575, 5962011023575, 5962-14-399-5541, 5962143995541

NIIN

010977492, 011505642, 011505643, 011567606, 011025451, 011023575, 143995541

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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