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M36W216T85ZA1

STMicroelectronics

M36W216T85ZA1 by STMicroelectronics

M36W216T85ZA1 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage and operates b/w 2.7V to 3.3V. It features a density of 16Mbit and supports up to 1M x 16 organization, ideal for compact applications. Its commercial grade ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,154 parts In-Stock

1+ parts

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4,154

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Anansix

USA . 2,242 parts In-Stock

1+ parts

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1k+ parts

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2,242

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Vyrian

USA . 425 parts In-Stock

1+ parts

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425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 988 parts In-Stock

1+ parts

$2.393

100+ parts

-

1k+ parts

$2.154

10k+ parts

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988

$2.393

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$2.154

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MKK Technologies

India . 1,944 parts In-Stock

1+ parts

$4.500

100+ parts

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10k+ parts

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1,944

$4.500

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DigiPath Technology Company

USA . 1,944 parts In-Stock

1+ parts

$4.500

100+ parts

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1,944

$4.500

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Corphita

USA . 1,316 parts In-Stock

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1,316

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Parana Technologies

USA . 549 parts In-Stock

1+ parts

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100+ parts

$2.861

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549

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$2.861

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Overview

Unlock exceptional performance with the M36W216T85ZA1 memory IC from STMicroelectronics, a leader in innovative semiconductor solutions. Engineered for efficiency and reliability, this versatile memory is perfect for applications ranging from consumer electronics to industrial automation. Its compact design ensures seamless integration, while its robust temperature range guarantees dependable operation in diverse environments. Experience quality backed by STMicroelectronics’ commitment to excellence and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, making the product ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape is efficient for layout in circuit boards, enhancing versatility in design and improving assembly processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler design and faster data access times, providing better performance in systems requiring quick response.

Nominal Supply Voltage / Vsup: 3 V

A nominal supply voltage of 3 V is efficient for modern electronics, reducing power consumption while maintaining optimal performance.

No. of Terminals: 66

The 66 terminals support multiple connections for efficient data and power transfer, enhancing the integration of this memory IC in various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low profile and fine pitch design of the grid array facilitate high-density mounting on PCBs, making it suitable for high-performance applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this memory IC can function in a wider range of environments, ensuring reliability in demanding applications.

Organization: 1MX16

The 1MX16 organization provides a sufficient memory structure for various applications, enhancing data handling and processing capabilities.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows the IC to function in cooler environments, extending its usability across different climates.

Terminal Position: BOTTOM

The bottom terminal position offers better thermal management and simplifies handling during assembly, improving overall system performance.

Maximum Seated Height: 1.4 mm

A maximum seated height of 1.4 mm contributes to a compact design, helping to save space in sophisticated electronic devices.

Width: 8 mm

With a width of 8 mm, this IC is sufficiently narrow, allowing for flexibility in PCB layout and enabling high-density integration.

Minimum Supply Voltage (Vsup): 2.7 V

The capability to operate at a minimum supply voltage of 2.7 V enhances compatibility with a variety of power supply designs, making it versatile.

Length: 12 mm

A length of 12 mm contributes to a compact form factor, making it easier to fit into tight spaces within electronic devices.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this memory IC is suitable for use in standard consumer electronics, ensuring wide applicability.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed operation, which is essential for modern electronic applications.

Terminal Form: BALL

The ball terminal form enhances soldering and connection reliability, making installation simpler and more effective.

No. of Words: 1048576 words

Offering 1,048,576 words of memory capacity enables high data storage capabilities, suitable for demanding applications.

Memory Width: 16

A memory width of 16 bits supports efficient data processing and transfer, optimizing system performance for various applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for higher density connections without sacrificing performance, making it ideal for compact designs.

No. of Words Code: 1M

The 1M words code signifies significant memory capacity, enabling this product to support complex applications requiring extensive data.

Maximum Supply Voltage (Vsup): 3.3 V

A maximum supply voltage of 3.3 V enhances compatibility with various electronic devices and ensures stable operation under different conditions.

Memory Density: 16777216 bit

With a memory density of 16,777,216 bits, this IC offers substantial storage capabilities, making it suitable for data-intensive applications.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, this IC is specifically designed for data storage and retrieval needs, making it an essential component for modern electronic devices.

Technical Specifications

Other Function Memory ICs M36W216T85ZA1 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO CONTAINS 128K X 16 SRAM

JESD-30 Code:

R-PBGA-B66

Length:

12 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

66

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36W216T85ZA1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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