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SNJ54ALS871FK

Texas Instruments

SNJ54ALS871FK by Texas Instruments

SNJ54ALS871FK by Texas Instruments is a MILITARY-grade TTL IC with 28 terminals in a CHIP CARRIER package. It operates b/w -55°C to 125°C, making it suitable for harsh environments. This IC is ideal for applications requiring high reliability and performance in military and aerospace systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,447 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,447

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Digiode

USA . 4,070 parts In-Stock

1+ parts

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4,070

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 531 parts In-Stock

1+ parts

$4.468

100+ parts

-

1k+ parts

$4.902

10k+ parts

-

531

$4.468

-

$4.902

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DigiPath Technology Company

USA . 386 parts In-Stock

1+ parts

$4.920

100+ parts

$4.526

1k+ parts

-

10k+ parts

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386

$4.920

$4.526

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ChromeModa Solutions

Germany . 6,316 parts In-Stock

1+ parts

$5.020

100+ parts

$4.116

1k+ parts

-

10k+ parts

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6,316

$5.020

$4.116

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$5.020

100+ parts

-

1k+ parts

$4.518

10k+ parts

-

1,078

$5.020

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$4.518

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$18.644

100+ parts

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894

$18.644

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One Stop Electronics

USA . 1,495 parts In-Stock

1+ parts

$26.000

100+ parts

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1,495

$26.000

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Corphita

USA . 3,707 parts In-Stock

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3,707

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SNJ54ALS871FK. As a leading manufacturer in the industry, Texas Instruments delivers excellence in the category of Other Function Memory ICs. This product offers exceptional value to customers with its innovative technology and military-grade temperature grade, making it ideal for a wide range of applications. Trust Texas Instruments to provide you with cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material offers excellent durability and protection, making this product suitable for a wide range of operating conditions.

Surface Mount: YES

Being surface mountable, this product is easily and securely mounted onto a PCB, saving space and enabling efficient assembly processes.

Screening Level: 38535Q/M;38534H;883B

The high screening level ensures that this product meets stringent quality and reliability standards, making it a reliable choice for critical applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it ideal for applications with limited board real estate.

No. of Terminals: 28

With 28 terminals, this product offers a high level of connectivity and versatility, making it suitable for complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and lightweight, making this product ideal for portable electronic devices and applications where size and weight are important considerations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures and harsh environmental conditions, ensuring reliable performance in a variety of applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature indicates that this product can operate effectively in cold environments, offering versatility and reliability in different operating conditions.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, facilitating efficient installation and maintenance of the product.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this product offers rugged construction and superior performance, making it suitable for defense and aerospace applications.

Technology: TTL

Utilizing TTL technology, this product offers fast response times and low power consumption, making it suitable for high-speed digital applications.

Terminal Form: NO LEAD

With a no-lead terminal form, this product is environmentally friendly and complies with regulations concerning hazardous materials, making it a sustainable choice.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and secure connections, ensuring reliable performance and compatibility with standard PCB layouts.

Technical Specifications

Other Function Memory ICs SNJ54ALS871FK attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N28

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Memory ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54ALS871FK Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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