Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36LLR8860T1ZAQT by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
Median Price
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Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Anansix
IDEA Electronic Components Group
$4.410
$3.969
MKK Technologies
$8.292
DigiPath Technology Company
Corphita
Parana Technologies
$5.272
Durable and lightweight material ensures reliability and longevity of the memory IC.
Enables compact design and easy integration into modern electronic circuits.
Optimizes space within devices, making it suitable for a variety of applications.
Enables faster data access and improved performance for high-speed applications.
Combines the benefits of both memory types, offering flexibility in data storage and execution.
Low voltage operation improves power efficiency, making it ideal for battery-powered devices.
Reduces overall power consumption while maintaining stable performance.
Provides ample connectivity options, enhancing versatility for various designs.
Ensures a compact footprint, suitable for space-constrained applications.
Allows operation in a wide temperature range, making it reliable in demanding environments.
Provides a balanced data organization that supports high-performance applications.
Operational in extreme conditions, thus offering versatility for various applications.
Ensures robust soldering and connection reliability during manufacturing and operation.
Facilitates efficient circuit board design, improving layout and performance.
Low-profile design minimizes space usage, ideal for slim devices.
Compact size facilitates versatility in various PCB layouts.
Allows operation with lower voltage supplies, enhancing compatibility with modern low-power designs.
Space-efficient dimensions make it suitable for various applications without compromising performance.
Ensures low power consumption and high noise immunity, enhancing performance in digital applications.
Ball grid array provides better thermal and electrical performance compared to conventional packages.
Offers a balance between power consumption and performance for sustained operation.
High memory capacity, suitable for applications requiring extensive data storage.
Wide data bus enables efficient data transfer rates, enhancing overall system performance.
Fine pitch allows for high-density circuit designs, improving space utilization.
Indicates a significant data capacity, making it feasible for high-demand applications.
Supports higher voltage levels, allowing for improved performance in demanding applications.
High density enhances data storage capabilities, essential for complex applications.
Versatile design allows it to serve multiple memory functions, making it ideal for diverse applications.
Extremely low standby current supports energy-efficient designs, prolonging battery life in portable devices.
Other Function Memory ICs M36LLR8860T1ZAQT attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36LLR8860T1ZAQT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
DS18B20+
Analog Devices
DS18B20+ by Analog Devices is a 12-bit temperature sensor with 3.3/5V supply, -55 to 125°C range, and ±0.50°C accuracy. It features a 1-Wire interface for digital output and is commonly used in applications requiring precise temperature monitoring in various industries.
Jinan Jingheng Electronics
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
Kec
RC0402FR-071KL
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
Bytesonic Electronics
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317BD2TG
Onsemi
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
ULN2803ADWG4
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
CY8C24033-24PVXI
Cypress Semiconductor
CY8C24033-24PVXI by Cypress: 8KX1 memory circuit with 8192-bit density. Operates synchronously, industrial grade, -40 to 85°C range. Ideal for applications requiring small outline, shrink pitch package and CMOS technology.
M36W108T100ZN5T
STMicroelectronics
M36W108T100ZN5T by STMicroelectronics is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. Operating in asynchronous mode, it has a supply voltage range of 2.7V to 3.6V and temperature range of -20 °C to 85°C. This rectangular GRID ARRAY package is suitable for various applications requiring high-density memory solutions.
MR2A16AVMA35R
Everspin Technologies
MR2A16AVMA35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. It operates asynchronously at a nominal voltage of 3.3V, suitable for industrial applications. This low-profile, fine-pitch grid array package has 48 terminals and offers a memory density of 4,194,304 bits.
CT1000MX500SSD1
Micron Technology
Micron Technology's CT1000MX500SSD1 is a RECTANGULAR memory IC with 1TX8 organization and CMOS technology. It operates ASYNCHRONOUSLY at temperatures b/w 0-70 °C, offering a memory density of 8796093022208 bit. Ideal for commercial applications requiring high-speed data processing in compact devices.
TMS27C32NE
Other Memory ICs;
TMX27PC256N45
SN74HC670N1
SN74HC670N1 by Texas Instruments is a CMOS memory IC with 16 terminals, operating b/w -40°C to 85°C. It has a voltage range of 2-6V and comes in an industrial-grade rectangular package suitable for various applications requiring other function memory ICs.
M36W0R5020T0ZAQE
M36W0R5020T0ZAQE by STMicroelectronics is a versatile memory IC featuring 2M words of mixed FLASH+SRAM with a max access time of 70 ns. It operates asynchronously at a nominal voltage of 1.8V, suitable for industrial applications. Its compact design (8x10 mm) ensures efficient space utilization in electronic devices.
M36LLR8860D1ZAQF
M36LLR8860D1ZAQF by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates efficiently at temperatures from -25 °C to 85 °C and supports surface mount applications. Ideal for compact devices, it offers high-density storage in a small footprint.
XC17S40XLSO20I
Xilinx
The Xilinx XC17S40XLSO20I is a 3.3V memory circuit IC with 330696 bits, operating synchronously at up to 10MHz. It features a small outline package with 20 terminals and is ideal for industrial applications requiring common I/O type and 3-STATE output characteristics.
DS1207-001
Analog Devices' DS1207-001 is a CMOS MEMORY CIRCUIT with SYNCHRONOUS operation. It has a temp range of 0-70 °C, TIN LEAD terminals, and RECTANGULAR package shape. Ideal for commercial applications requiring Other Function Memory ICs in special shape packages.
WSF128K16-37G1UM
White Electronic Designs
MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFP; Package Shape: SQUARE; JESD-30 Code: S-CQFP-G68;
S71KL512SC0BHV003
Infineon Technologies
S71KL512SC0BHV003 by Infineon Technologies is a 64MX8 memory IC with 536Mbit density. Operating at 3V, it features synchronous mode and CMOS technology. Ideal for industrial applications, this very thin profile GRID ARRAY package has 24 terminals and operates b/w -40 to 105°C.
TMX27PC128N45
TMS4C1070-60DJ
TMS4C1070-60DJ by Texas Instruments is a 20-terminal memory IC with CMOS technology, operating at 5V. It has a max access time of 50ns and standby current of 0.01Amp. This small outline package is ideal for commercial applications requiring fast memory circuits.
M24SR64-YMN6T/2
M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.
TMS27C32-25NL
TMS4C1050-4N
TMS4C1050-4N by Texas Instruments is a 16-terminal MEMORY CIRCUIT IC with 5V supply, 30ns access time, and 70°C max temp. It is used in commercial-grade applications requiring reliable memory storage and operates on CMOS technology.
CY8C20110-SX2IT
MEMORY CIRCUIT;
TC518512FL-80
Toshiba
Toshiba's TC518512FL-80 is a 512KX8 memory IC with 3-STATE output, operating at 5V. It has a max access time of 80ns and consumes up to 60mA. Ideal for applications requiring high memory density and fast data retrieval in commercial temperature environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36L0R7050T0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M36L0R7050B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36L0R7040B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M36L0R7040T0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 8M;
M36L0R7050L1ZAME
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
M36L0R7040B0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
M36L0R7050B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words;
M36L0R7050T0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B88;
M36L0R7050B0ZAQT
M36L0R7040T0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
M36L0R7040T0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36L0R7050L1ZAMF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36L0R7050T0ZAQE
M36L0R7050B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
M36L0R7050T0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
M36L0R7050U1ZAMF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36L0R7050U1ZAME
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36L0R7040B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
M36L0R7040B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M36L0R7040T0ZAQF
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