Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MTFC16GLTAM-WT by Micron Technology is a memory IC with 137TB density, operating at -25 to 85°C. It has 153 terminals in a square package shape for surface mounting. Ideal for applications requiring high memory capacity and reliable performance in various temperature conditions.
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Digiode
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Nova Conductors
Andel Nordic
$2.011
$1.930
Aztec Data Supply Inc.
$2.215
Corohmni
$5.784
Ampacity Inc.
$12.000
AZTECH Wire
$12.839
A-Z Elektronik GmbH
Argo Parts USA
Aranea Global
Authorized Procurement Solutions
Corphita
Microchip USA
Continental Prestige Electronics
PLASTIC/EPOXY is a durable and lightweight material, ensuring the product is robust and easy to handle.
Surface mount capability allows for easy installation and space-saving on circuit boards.
Supports multiple power supply options, allowing for flexibility in different circuit configurations.
Square package shape helps in efficient use of PCB space and allows for easy alignment during assembly.
High number of terminals provide connectivity options for complex circuit designs.
Grid array and fine pitch package style enables high-density packaging for increased memory density.
Operating at a high temperature range ensures product reliability in various environmental conditions.
Withstanding low temperatures ensures product functionality in cold environments.
Bottom terminal position simplifies the mounting process and improves PCB layout.
Ball terminal form provides secure connections and allows for high-speed data transfer.
Small terminal pitch enables high-density integration and precise connections on the PCB.
High memory density allows for storage of large amounts of data in a compact form factor.
Other Function Memory ICs MTFC16GLTAM-WT attributes and parameters. Explore more Other Function Memory ICs devices from Micron Technology
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MTFC16GLTAM-WT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Weitronic Enterprise
EU2B-YS2J03C
Idec
ROTARY SWITCH;
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M36W108T120ZN1
M36W108T120ZN1 from STMicroelectronics is a versatile memory IC featuring 1M x 8 organization, operating at 3/3.3V with a max access time of 120 ns. Its thin profile and asynchronous mode make it ideal for compact applications. This CMOS device supports both FLASH and SRAM technologies.
TMS27PC32-25NE
Texas Instruments
Other Memory ICs;
TMS2564JL
TMS2564JL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 450 ns access time. It features a MOS technology, operates b/w 0-70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial-grade environments.
TMS44C250-1DZ
TMS44C250-1DZ by Texas Instruments is a 256Kx4 memory IC with 1048576-bit density. It operates at 5V, has a max access time of 100ns, and consumes up to 110mA. This CMOS technology-based chip is ideal for commercial applications requiring fast memory access in small outline packages.
DS2411R+U
Analog Devices
MEMORY CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed;
SSDSA2BW160G301
Intel
Intel's SSDSA2BW160G301 is a MICROELECTRONIC ASSEMBLY with 160GX8 organization, operating in ASYNCHRONOUS mode. It offers 171798691840 words capacity, 1374389534720 bit memory density, and CMOS technology. Ideal for commercial applications requiring high-speed data processing at temperatures ranging from 0 to 70 °C.
M36LLR8860D1ZAQE
M36LLR8860D1ZAQE by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM. It operates at 1.8V with a max temp of 85 °C and includes 88 terminals in a compact grid array package. Ideal for high-performance applications requiring efficient data storage.
TACT2151-25JD
TACT2151-25JD by Texas Instruments is a 1KX11 memory circuit IC with 11264-bit memory density. It operates at a max temperature of 70°C and has an access time of 25ns. This CMOS technology IC is ideal for applications requiring high-speed memory functions in commercial-grade environments.
DS1992L-F5/E00
MEMORY CIRCUIT;
SN74170JP4
SN74170JP4 by Texas Instruments is a TTL memory IC with 16 terminals, operating at 5V. It has a rectangular ceramic package and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring reliable memory functions in electronic circuits.
TMS4C1060-40SD
TMS4C1060-40SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 30ns access time, and 45mA max supply current. It operates b/w 0-70°C in commercial applications requiring reliable memory storage solutions.
TMS2150-4JL
TMS2150-4JL by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 5V supply, 45ns access time, and 145mA max current. It is ideal for commercial applications requiring fast memory operations in a ceramic rectangular package with through-hole terminals.
XC17S20PD8C
Xilinx
The Xilinx XC17S20PD8C is a 178144-bit memory circuit IC with synchronous operation and 3-STATE output. It operates at a max clock frequency of 10 MHz, suitable for applications requiring high-speed memory access. With a package style of IN-LINE and through-hole terminal form, it is commonly used in commercial-grade systems needing reliable memory storage.
SN74S262N3
SN74S262N3 by Texas Instruments is a TTL memory circuit IC with 20 terminals in an in-line package. Operating temperature range is 0-70°C, suitable for commercial applications. Its through-hole terminal form and rectangular shape make it ideal for various function memory circuits.
TMS27C32-2NE4
TMS27C32-120NE4
DS1653
DS1653 by Analog Devices is a CMOS MEMORY CIRCUIT with 16 terminals, operating at 0-70 °C. It has a supply voltage of 5V and comes in PLASTIC/EPOXY package. Ideal for applications requiring reliable memory storage in commercial-grade environments.
TMS27C32-25NE
DS1204V
Analog Devices' DS1204V is a CMOS memory IC with 5V supply, 5 terminals, and 6mA max current. It operates from 0 to 70 °C, ideal for commercial applications requiring reliable non-volatile memory storage in microelectronic assemblies.
ER1400
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MTFC16GLTDV-WT
Micron Technology
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA169,14X28,20;
MTFC32GLTDM-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA153,14X14,20;
MTFC16GJTEC-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MTFC2GMTEA-WT
MTFC32GJTED-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel;
MTFC32GLTDI-WT
MTFC4GMTEA-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
MTFC64GJTEF-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B169;
MTFC8GLTEA-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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