Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MTFC16GLTAM-WT by Micron Technology is a memory IC with 137TB density, operating at -25 to 85°C. It has 153 terminals in a square package shape for surface mounting. Ideal for applications requiring high memory capacity and reliable performance in various temperature conditions.
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Andel Nordic
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Aztec Data Supply Inc.
$2.215
Corohmni
$5.784
Ampacity Inc.
$12.000
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Continental Prestige Electronics
PLASTIC/EPOXY is a durable and lightweight material, ensuring the product is robust and easy to handle.
Surface mount capability allows for easy installation and space-saving on circuit boards.
Supports multiple power supply options, allowing for flexibility in different circuit configurations.
Square package shape helps in efficient use of PCB space and allows for easy alignment during assembly.
High number of terminals provide connectivity options for complex circuit designs.
Grid array and fine pitch package style enables high-density packaging for increased memory density.
Operating at a high temperature range ensures product reliability in various environmental conditions.
Withstanding low temperatures ensures product functionality in cold environments.
Bottom terminal position simplifies the mounting process and improves PCB layout.
Ball terminal form provides secure connections and allows for high-speed data transfer.
Small terminal pitch enables high-density integration and precise connections on the PCB.
High memory density allows for storage of large amounts of data in a compact form factor.
Other Function Memory ICs MTFC16GLTAM-WT attributes and parameters. Explore more Other Function Memory ICs devices from Micron Technology
JESD-30 Code:
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MTFC16GLTAM-WT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LP2950CDT-3.3G
Onsemi
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
Yageo
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
General Diode
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NC7WZ17P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
Panjit International
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
BAV99-7-F
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
BSS138K-13
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
TMS2708-35JDL
Texas Instruments
TMS2708-35JDL by Texas Instruments is a 1KX8 MOS memory IC with 8192-bit density and 350 ns access time. It features 3-STATE output characteristics, operates b/w 0 to 70°C, and comes in a ceramic rectangular package. Ideal for applications requiring high-speed data storage in commercial-grade environments.
M36W216BI85ZA1T
STMicroelectronics
M36W216BI85ZA1T from STMicroelectronics is a low-profile, asynchronous memory IC featuring 16Mbit density with FLASH+SRAM technology. It operates at 3V and supports a max access time of 85ns. Ideal for commercial applications requiring efficient data storage and retrieval.
TMS4C1050-6SD
TMS4C1050-6SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in commercial grade applications requiring reliable memory storage solutions.
DS2411R+T&R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 1;
TMS4100NC
TMS4100NC by Texas Instruments is a MOS memory IC with 28 terminals in an IN-LINE package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage in electronic devices. The rectangular PLASTIC/EPOXY body and DUAL terminal position enhance its durability and ease of integration.
M36W108T120ZM5T
M36W108T120ZM5T by STMicroelectronics is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. Operating in asynchronous mode, it has a supply voltage range of 2.7V to 3.6V and temperature range from -20 °C to 85°C. This low-profile grid array package is suitable for various memory circuit applications.
SN74LS601ADWR
SN74LS601ADWR by Texas Instruments is a 64KX1 memory circuit IC with TTL technology. It operates asynchronously at a supply voltage range of 4.75V to 5.25V, suitable for commercial temperature grades. This small outline package with gull wing terminals is ideal for applications requiring 65536-bit memory density in various electronic devices.
CY8C20110-SX2I
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
TMS44C250-1SD
TMS44C250-1SD by Texas Instruments is a 256KX4 MEMORY CIRCUIT with 1048576 bit Memory Density. It operates at 5V, has a Max Access Time of 100ns, and consumes up to 110mA. This IC is ideal for applications requiring fast data access in commercial temperature environments.
M36W108T100ZN5
M36W108T100ZN5 from STMicroelectronics is a mixed FLASH+SRAM memory IC with a 1MX8 organization, ideal for asynchronous applications. It operates b/w 2.7V and 3.6V, featuring a max access time of 100ns and a temp range of -20 °C to 85°C. Its compact design (9.8mm x 11.8mm) suits space-constrained devices.
DS14220-F50
Analog Devices
DS14220-F50 by Analog Devices is a CMOS MEMORY CIRCUIT with 2048-bit memory density. It operates in an INDUSTRIAL temperature range (-40 to 85 °C) and has a supply voltage range of 2.8V to 6V. This ROUND, METAL package IC is ideal for applications requiring reliable non-volatile memory storage in harsh environments.
TMS2501NC
TMS2501NC by Texas Instruments is a MOS memory circuit IC with 24 terminals in an in-line rectangular package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage and retrieval. The through-hole terminal form and 2.54mm pitch enhance its ease of integration into electronic systems.
DS2411P/TR
Dallas Semiconductor
DS2411P/TR by Dallas Semiconductor is a 64-bit MEMORY CIRCUIT with 6 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.5-5.25V and consumes 0.1mA max current in a SMALL OUTLINE package suitable for industrial applications.
DS1993L-F5
DS1993L-F5 by Maxim Integrated is a 4Kx1 memory circuit with CMOS technology. Operating at 3/5V, it has a max access time of 15000ns and memory density of 4096 bits. This round disk button IC is used in applications requiring asynchronous operation and a temperature range from -40 to 70°C.
TACT2152-25N3
TACT2152-25N3 by Texas Instruments is a 2Kx8 memory circuit IC with 16384-bit memory density. It operates at a max access time of 25ns and has a nominal voltage of 5V. This CMOS technology IC is commonly used in applications requiring fast memory access and reliable data storage.
SMJ27C128-17J
Other Memory ICs;
M36W108T100ZN6
M36W108T100ZN6 by STMicroelectronics is a versatile memory IC featuring 1M x 8 organization, operating in asynchronous mode. It supports a supply voltage range of 2.7V to 3.6V and operates within -40 °C to 85°C, making it ideal for industrial applications. Its thin profile and surface mount design enhance space efficiency in electronic devices.
DS6207-XXX
DS6207-XXX by Analog Devices is a CMOS MEMORY CIRCUIT with 5 terminals in a RECTANGULAR package. It operates SYNCHRONOUSLY and has TIN LEAD terminal finish. Ideal for applications requiring Other Function Memory ICs in SPECIAL SHAPE packages.
SN74LS170FN3
SN74LS170FN3 by Texas Instruments is a TTL technology IC with 20 terminals in a square chip carrier package. It operates at temperatures b/w 0°C to 70°C and has a nominal voltage of 5V. This memory IC is commonly used in commercial applications requiring other function memory capabilities.
DS6204U-3
DS6204U-3 by Analog Devices is a 256x1 memory circuit IC with 256-bit memory density. Operating b/w 0 °C to 70°C, it uses CMOS technology and has a rectangular package style with 5 terminals. Ideal for commercial applications requiring special shape package styles.
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MTFC16GLTDV-WT
Micron Technology
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA169,14X28,20;
MTFC32GLTDM-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA153,14X14,20;
MTFC16GJTEC-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MTFC2GMTEA-WT
MTFC32GJTED-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel;
MTFC32GLTDI-WT
MTFC4GMTEA-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
MTFC64GJTEF-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B169;
MTFC8GLTEA-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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