Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MTFC2GMTEA-WT by Micron Technology is a 153-terminal memory IC with 17179869184 bit density. It operates b/w -25°C to 85°C, supporting power supplies of 1.8/3.3V and 3/3.3V. This square-shaped, surface-mountable IC in plastic/epoxy package is ideal for various applications requiring high memory capacity and temperature resilience.
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Vyrian
Digiode
Nova Conductors
Andel Nordic
$10.235
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AZTECH Wire
$11.850
Ampacity Inc.
$30.000
Corphita
Aranea Global
Microchip USA
This material provides durability and protection for the IC, making it suitable for various environmental conditions.
Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.
Support for multiple voltage options allows for compatibility with different system requirements, increasing flexibility in application design.
Having a high number of terminals facilitates complex connections and functionalities, making the IC versatile for various applications.
The grid array and fine pitch package style contribute to high signal integrity and reliability, essential for memory ICs to maintain data integrity.
With a high maximum operating temperature, this IC can function reliably even under demanding conditions, ensuring long-term performance.
The IC can operate in low-temperature environments without performance degradation, making it suitable for a wide range of operating conditions.
Bottom terminal position enhances thermal management and signal integrity, crucial for efficient operation and data transmission.
Ball terminals offer efficient electrical connections with reduced risk of solder joint failure, optimizing signal transmission and reliability.
High memory density enables storage of large amounts of data in a compact form, ideal for applications requiring extensive memory capacity and fast data access.
Other Function Memory ICs MTFC2GMTEA-WT attributes and parameters. Explore more Other Function Memory ICs devices from Micron Technology
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MTFC2GMTEA-WT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Packaging - Standard Pkg Label Chg 20/Feb/2019
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
PIC18F4550-I/ML
Microchip Technology
The Microchip Technology PIC18F4550-I/ML is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this chip offers efficient performance in compact designs.
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
Weitronic Enterprise
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
NXP Semiconductors
EU2B-YS303C
Idec
ROTARY SWITCH;
Changzhou Starsea Electronics
DS2411X
Maxim Integrated
DS2411X by Maxim Integrated is a 64-bit MEMORY CIRCUIT with 64x1 organization. It operates in ASYNCHRONOUS mode, with power supplies of 2/5V. This PLASTIC/EPOXY IC, in GRID ARRAY package style, is ideal for industrial applications requiring low standby current and fine pitch terminals.
TMS2150-45NT
Texas Instruments
TMS2150-45NT by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 45 ns access time, operating at 5V. It has 24 terminals in an IN-LINE package suitable for commercial applications requiring fast memory access and low standby current of 0.135A.
TMS27C32NE
Other Memory ICs;
TMS2400NC
TMS2400NC by Texas Instruments is a MOS technology memory IC with 28 terminals in an IN-LINE package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage and retrieval in industrial settings. The PLASTIC/EPOXY rectangular package with dual terminal position and 2.54mm pitch offers durability and ease of integration.
SN74ALS871FN3
Texas Instruments SN74ALS871FN3 is a TTL memory IC with 28 terminals in a square chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. Surface mountable, ideal for various electronic functions.
DC1920-F3
Analog Devices
DC1920-F3 by Analog Devices is a CMOS MEMORY CIRCUIT with METAL body, ROUND shape, and DISK BUTTON style. It operates b/w -55 °C to 100°C, has 2 terminals with TIN LEAD finish. Ideal for applications requiring Other Function Memory ICs in surface mount configurations.
WSF512K16-39H2I
White Electronic Designs
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; Package Equivalence Code: PGA66,11X11;
MR0A16AYS35R
Freescale Semiconductor
MR0A16AYS35R by Freescale Semiconductor is a 64KX16 memory circuit with a supply voltage of 3.3V. It operates in asynchronous mode and has a max access time of 35ns. This memory IC is commonly used in applications requiring high-speed data storage and retrieval.
CY8C24033-24PVXI
Cypress Semiconductor
CY8C24033-24PVXI by Cypress: 8KX1 memory circuit with 8192-bit density. Operates synchronously, industrial grade, -40 to 85°C range. Ideal for applications requiring small outline, shrink pitch package and CMOS technology.
TMS2564-35JL
TMS2564-35JL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 350 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial-grade temperature environments.
DS2401Z+
DS2401Z+ by Analog Devices is a CMOS memory circuit with 64-bit memory density. It operates asynchronously at a nominal voltage of 5V and has a small outline package style. It is commonly used in industrial applications requiring low-power memory storage.
TACT2151-25FN
TACT2151-25FN by Texas Instruments is a 1Kx11 memory circuit IC with 11264-bit memory density. It features a max access time of 25ns and operates b/w 0°C to 70°C. This CMOS technology chip carrier package is ideal for applications requiring fast data retrieval in commercial-grade environments.
TMS2564-35JDL
TMS2564-35JDL by Texas Instruments is an 8KX8 memory IC with 8192 words and 65536 bits. It operates in a temperature range of 0-70°C, featuring a max access time of 350 ns. Commonly used in applications requiring fast data retrieval and storage, it has a package style of IN-LINE and output characteristics of 3-STATE.
TACT2154-25FN
TACT2154-25FN by Texas Instruments is a 2Kx8 memory circuit IC with 16384-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 25ns. This CMOS technology chip carrier package is suitable for commercial applications requiring fast memory access.
TMS44C250-1SD
TMS44C250-1SD by Texas Instruments is a 256KX4 MEMORY CIRCUIT with 1048576 bit Memory Density. It operates at 5V, has a Max Access Time of 100ns, and consumes up to 110mA. This IC is ideal for applications requiring fast data access in commercial temperature environments.
TMX27C512-30
DS2401Z+T&R
DS2401Z+T&R by Analog Devices is a 64X1 memory circuit with a memory density of 64 bits. It operates asynchronously at a nominal voltage of 5V and has a small outline package style. This IC is commonly used in industrial applications requiring low power consumption and compact size.
M36W0R5020B0ZAQT
STMicroelectronics
M36W0R5020B0ZAQT by STMicroelectronics is a versatile memory IC featuring 2M words of mixed FLASH+SRAM with a max access time of 70 ns. It operates asynchronously at a nominal voltage of 1.8V, suitable for industrial applications. Its compact design (8x10 mm) ensures efficient space utilization in devices.
FM24CL64-S
Enhanced Memory Systems
CY15B102Q-SXE
Infineon Technologies
CY15B102Q-SXE by Infineon Technologies is a 256KX8 MEMORY CIRCUIT with SYNCHRONOUS operation and 3.3V nominal voltage. Ideal for AUTOMOTIVE applications, it features a small outline package style, operates in temperatures ranging from -40 to 125 °C, and has a memory density of 2097152 bit.
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MTFC16GLTDV-WT
Micron Technology
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA169,14X28,20;
MTFC16GLTAM-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B153;
MTFC32GLTDM-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA153,14X14,20;
MTFC16GJTEC-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MTFC32GJTED-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel;
MTFC32GLTDI-WT
MTFC4GMTEA-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
MTFC64GJTEF-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B169;
MTFC8GLTEA-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Supply Digital Components
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