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SN74LS170J4

Texas Instruments

SN74LS170J4 by Texas Instruments

SN74LS170J4 by Texas Instruments is a TTL technology IC with 16 terminals and a supply voltage of 5V. It operates b/w 0-70°C, housed in a ceramic rectangular package. Commonly used for memory functions in commercial applications due to its reliability and temperature range suitability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,826 parts In-Stock

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8,826

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Digiode

USA . 1,633 parts In-Stock

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1,633

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Distributors (Availability)

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Parana Technologies

USA . 1,398 parts In-Stock

1+ parts

$2.903

100+ parts

-

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$3.399

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1,398

$2.903

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$3.399

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DigiPath Technology Company

USA . 1,801 parts In-Stock

1+ parts

$3.197

100+ parts

$2.941

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1,801

$3.197

$2.941

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ChromeModa Solutions

Germany . 1,387 parts In-Stock

1+ parts

$3.262

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$2.675

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1,387

$3.262

$2.675

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IDEA Electronic Components Group

UK . 1,066 parts In-Stock

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$3.262

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$2.936

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1,066

$3.262

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$2.936

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One Stop Electronics

USA . 1,317 parts In-Stock

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$6.000

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1,317

$6.000

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AZTECH Wire

Italy . 273 parts In-Stock

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$18.102

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273

$18.102

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Corphita

USA . 1,149 parts In-Stock

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Overview

Unlock the power of seamless memory integration with the SN74LS170J4 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-notch quality and reliability. Ideal for various applications in the electronics industry, this memory IC offers unparalleled value with its high performance and efficiency. Say goodbye to compatibility issues and hello to seamless operation with the SN74LS170J4.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and high temperature resistance, resulting in better overall performance and reliability.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent and reliable operation of the memory IC.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this memory IC can withstand harsh environmental conditions without degrading performance.

Technology: TTL

TTL technology provides excellent noise immunity and fast switching speeds, making this memory IC ideal for high-speed applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections, making it easier to solder and ensuring long-term reliability of the memory IC.

Technical Specifications

Other Function Memory ICs SN74LS170J4 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS170J4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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