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LC331632M-70

Onsemi

LC331632M-70 by Onsemi

LC331632M-70 by Onsemi is a 32KX16 CMOS memory IC with 3-STATE output, operating at temperatures from 0 to 70 °C. It has a supply voltage of 5V and standby current of 0.002A, suitable for applications requiring high memory density and fast access times in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,237 parts In-Stock

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Digiode

USA . 2,170 parts In-Stock

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Kulean Microsystems

USA . 2,761 parts In-Stock

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Problanco Electronics

Mexico . 1,506 parts In-Stock

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SupplyDigital Components

Austria . 1,285 parts In-Stock

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Corphita

USA . 965 parts In-Stock

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UHIMA Technologies

Türkiye . 525 parts In-Stock

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Corohmni

South Africa . 475 parts In-Stock

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TANS Electronics

Latvia . 208 parts In-Stock

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Overview

Enhance your electronic devices with the LC331632M-70 by Onsemi, a high-quality Other Function Memory IC that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the demands of various applications, providing customers with value and benefits that go beyond expectations. With its common input/output type and 3-STATE output characteristics, this IC delivers seamless operation and efficiency. Upgrade your projects with the LC331632M-70 and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the memory ICs.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with many standard electronic systems.

No. of Terminals: 40

Having 40 terminals allows for sufficient connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this memory IC can function reliably in various environments.

Organization: 32KX16

The organization of 32KX16 provides a good balance between memory capacity and data width for efficient data storage.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity for optimal performance.

Technical Specifications

Other Function Memory ICs LC331632M-70 attributes and parameters. Explore more Other Function Memory ICs devices from Onsemi

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G40

Memory Density:

524288 bit

Memory Width:

16

No. of Terminals:

40

No. of Words:

32768 words

No. of Words Code:

32K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP40,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

100 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LC331632M-70 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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