Loading...

TMS2708-35JDL

Texas Instruments

TMS2708-35JDL by Texas Instruments

TMS2708-35JDL by Texas Instruments is a 1KX8 MOS memory IC with 8192-bit density and 350 ns access time. It features 3-STATE output characteristics, operates b/w 0 to 70°C, and comes in a ceramic rectangular package. Ideal for applications requiring high-speed data storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,435

-

-

-

-

Digiode

USA . 2,913 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,913

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,208 parts In-Stock

1+ parts

$3.201

100+ parts

-

1k+ parts

$3.724

10k+ parts

-

1,208

$3.201

-

$3.724

-

DigiPath Technology Company

USA . 1,041 parts In-Stock

1+ parts

$3.525

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$3.525

-

-

-

ChromeModa Solutions

Germany . 2,013 parts In-Stock

1+ parts

$3.597

100+ parts

$2.950

1k+ parts

-

10k+ parts

-

2,013

$3.597

$2.950

-

-

IDEA Electronic Components Group

UK . 299 parts In-Stock

1+ parts

$3.597

100+ parts

-

1k+ parts

$3.237

10k+ parts

-

299

$3.597

-

$3.237

-

One Stop Electronics

USA . 1,580 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

$5.000

-

-

-

AZTECH Wire

Italy . 387 parts In-Stock

1+ parts

$19.337

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$19.337

-

-

-

Corphita

USA . 2,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,894

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the TMS2708-35JDL by Texas Instruments. Designed with precision and quality in mind, this memory IC offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this innovative product delivers value and efficiency like no other. Trust Texas Instruments, a renowned manufacturer with a proven track record of excellence, to meet all your memory IC needs. Upgrade to the TMS2708-35JDL today and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and resistance to heat, making it suitable for high-temperature environments.

No. of Terminals: 24

Having 24 terminals allows for versatile connection options and compatibility with various systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability and stability even in demanding conditions.

Organization: 1KX8

Organized in 1KX8 configuration, providing a good balance between memory capacity and data organization for efficient storage and retrieval.

Output Characteristics: 3-STATE

3-STATE output allows for high-speed data transfer and flexibility in controlling signals.

Technology: MOS

MOS technology offers low power consumption and high speed performance, making it a efficient choice for memory ICs.

No. of Words: 1024 words

1024 words capacity provides ample storage for data processing and system operation.

Memory Width: 8

Memory width of 8 bits allows for handling of larger data chunks efficiently.

No. of Words Code: 1K

1K words code ensures compatibility with standard memory configurations and systems.

Maximum Access Time: 350 ns

Fast maximum access time of 350 ns enables quick data retrieval and processing speed.

Technical Specifications

Other Function Memory ICs TMS2708-35JDL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

350 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2708-35JDL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20