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LC331632ML-70

Onsemi

LC331632ML-70 by Onsemi

LC331632ML-70 by Onsemi is a 32KX16 CMOS memory IC with 3-STATE output. It operates at temperatures b/w 0 to 70 °C and has a supply voltage of 5V. With a memory density of 524288 bits, it is commonly used in applications requiring small outline packages and common input/output types.

Median Price

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Lifecycle Status

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1k+

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Digiode

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Vyrian

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Problanco Electronics

Mexico . 6,122 parts In-Stock

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TANS Electronics

Latvia . 2,588 parts In-Stock

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Kulean Microsystems

USA . 1,011 parts In-Stock

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Corphita

USA . 988 parts In-Stock

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SupplyDigital Components

Austria . 799 parts In-Stock

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Corohmni

South Africa . 407 parts In-Stock

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UHIMA Technologies

Türkiye . 75 parts In-Stock

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Overview

Unlock the power of seamless data storage and retrieval with the LC331632ML-70 by Onsemi. Crafted with precision and reliability in mind, this memory IC boasts a 32KX16 organization and 3-STATE output characteristics. Perfect for a wide range of applications, this compact chip offers customers unparalleled value and efficiency. Say goodbye to slow access times and hello to a smoother user experience. Upgrade your products today with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, ensuring the safety of the memory ICs.

Surface Mount: YES

Surface mount capability makes the product easy to install and saves space on the PCB, improving overall design flexibility.

Input/Output Type: COMMON

Having a common input/output type simplifies the interface design and makes the memory IC easier to integrate into various systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of systems, providing flexibility in design.

No. of Terminals: 40

Having 40 terminals allows for efficient connectivity and communication with other components, enhancing the functionality of the memory IC.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the memory IC can perform reliably in various environmental conditions.

Organization: 32KX16

The 32KX16 organization provides a balance between storage capacity and data access speed, making it suitable for a wide range of applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high speed operation, making the memory IC efficient and reliable.

Technical Specifications

Other Function Memory ICs LC331632ML-70 attributes and parameters. Explore more Other Function Memory ICs devices from Onsemi

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G40

Memory Density:

524288 bit

Memory Width:

16

No. of Terminals:

40

No. of Words:

32768 words

No. of Words Code:

32K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP40,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

100 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LC331632ML-70 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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