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SN74LS170NP3

Texas Instruments

SN74LS170NP3 by Texas Instruments

SN74LS170NP3 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. Ideal for commercial applications, it operates b/w 0°C to 70°C and features an in-line package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,360 parts In-Stock

1+ parts

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3,360

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Digiode

USA . 2,779 parts In-Stock

1+ parts

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2,779

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,621 parts In-Stock

1+ parts

$2.809

100+ parts

-

1k+ parts

$3.294

10k+ parts

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1,621

$2.809

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$3.294

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DigiPath Technology Company

USA . 1,395 parts In-Stock

1+ parts

$3.093

100+ parts

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1,395

$3.093

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ChromeModa Solutions

Germany . 2,363 parts In-Stock

1+ parts

$3.156

100+ parts

$2.588

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2,363

$3.156

$2.588

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IDEA Electronic Components Group

UK . 221 parts In-Stock

1+ parts

$3.156

100+ parts

-

1k+ parts

$2.840

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221

$3.156

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$2.840

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AZTECH Wire

Italy . 791 parts In-Stock

1+ parts

$12.109

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791

$12.109

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One Stop Electronics

USA . 237 parts In-Stock

1+ parts

$21.000

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237

$21.000

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Corphita

USA . 565 parts In-Stock

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565

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Overview

Enhance your electronic projects with the SN74LS170NP3 by Texas Instruments, a top-quality Other Function Memory IC that offers unmatched reliability and performance. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Perfect for a wide range of applications, this IC provides exceptional value and benefits to customers looking for a reliable solution. Upgrade your designs with the SN74LS170NP3 and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Having a nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can perform reliably in a wide range of environmental conditions.

Technology: TTL

Utilizing TTL technology ensures high-speed performance and compatibility with other TTL devices, making this IC a reliable choice for various applications.

Technical Specifications

Other Function Memory ICs SN74LS170NP3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Other Memory ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS170NP3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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