Loading...

TMS2708-45JDL

Texas Instruments

TMS2708-45JDL by Texas Instruments

TMS2708-45JDL by Texas Instruments is a 1KX8 MOS memory IC with 8192-bit density. It features 3-STATE output, operates b/w 0 to 70°C, and has a max access time of 450 ns. Ideal for applications requiring high-speed data storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,641

-

-

-

-

Digiode

USA . 2,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,455

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 335 parts In-Stock

1+ parts

$1.906

100+ parts

-

1k+ parts

$2.444

10k+ parts

-

335

$1.906

-

$2.444

-

DigiPath Technology Company

USA . 208 parts In-Stock

1+ parts

$2.099

100+ parts

-

1k+ parts

-

10k+ parts

-

208

$2.099

-

-

-

ChromeModa Solutions

Germany . 822 parts In-Stock

1+ parts

$2.142

100+ parts

$1.756

1k+ parts

-

10k+ parts

-

822

$2.142

$1.756

-

-

IDEA Electronic Components Group

UK . 389 parts In-Stock

1+ parts

$2.142

100+ parts

-

1k+ parts

$1.928

10k+ parts

-

389

$2.142

-

$1.928

-

AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$7.591

100+ parts

-

1k+ parts

-

10k+ parts

-

694

$7.591

-

-

-

One Stop Electronics

USA . 1,165 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,165

$10.000

-

-

-

Corphita

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

296

-

-

-

-

Overview

Elevate your electronic projects with the TMS2708-45JDL by Texas Instruments, a high-quality memory IC that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this memory IC is perfect for a wide range of applications. With its advanced technology and 3-STATE output characteristics, this product provides exceptional value and benefits to customers looking for top-tier memory solutions. Upgrade your projects today with the TMS2708-45JDL and experience the advantages of quality craftsmanship and cutting-edge design.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties and durability, making the memory ICs suitable for a wide range of operating temperatures and environments.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and flexibility in integrating the memory IC into different circuit designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this memory IC can function reliably even in warmer environments without any risk of overheating.

Organization: 1KX8

With an organization of 1KX8, this memory IC can store 1024 words with a width of 8 bits each, providing sufficient memory capacity for various applications.

Output Characteristics: 3-STATE

The 3-state output characteristics allow the memory IC to have three output states: high impedance, logic high, and logic low, providing versatility in signal control.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch facilitates easy integration and connection of the memory IC within a circuit board configuration, making it user-friendly for designers.

Memory Density: 8192 bit

With a memory density of 8192 bits, this memory IC offers a high storage capacity, ideal for applications requiring a large amount of data storage.

Maximum Access Time: 450 ns

The fast maximum access time of 450 nanoseconds ensures quick retrieval and processing of data, making the memory IC suitable for high-speed applications.

Technical Specifications

Other Function Memory ICs TMS2708-45JDL attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2708-45JDL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20