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SMJ2564-45JM

Texas Instruments

SMJ2564-45JM by Texas Instruments

The Texas Instruments SMJ2564-45JM is an 8Kx8 OTP ROM memory IC with 65536-bit memory density. It operates in a temperature range of -55 to 125°C, featuring a max access time of 450ns. Commonly used in military-grade applications due to its MOS technology and 3-STATE output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,770 parts In-Stock

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Digiode

USA . 3,455 parts In-Stock

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Electronic Expediters

USA . 17 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 5 parts In-Stock

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Parana Technologies

USA . 489 parts In-Stock

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$3.558

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$4.081

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489

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DigiPath Technology Company

USA . 264 parts In-Stock

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$3.918

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ChromeModa Solutions

Germany . 1,229 parts In-Stock

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$3.998

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$3.278

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IDEA Electronic Components Group

UK . 954 parts In-Stock

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$3.998

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$3.598

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AZTECH Wire

Italy . 845 parts In-Stock

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$9.743

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One Stop Electronics

USA . 476 parts In-Stock

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$29.000

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Corphita

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Overview

Unlock the power of innovation with the SMJ2564-45JM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in every product they produce. The SMJ2564-45JM falls under the category of Other Function Memory ICs, offering a wide range of applications for various electronic devices. Customers can trust in the value and benefits this product brings, with advantages such as high performance, durability, and efficiency. Experience seamless operation and enhanced functionality with the SMJ2564-45JM, a true testament to Texas Instruments' commitment to excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers high thermal conductivity and excellent resistance to heat, making it suitable for high temperature environments.

Screening Level: 38535Q/M;38534H;883B

This screening level ensures reliability and quality in military applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into electronic systems.

Input/Output Type: COMMON

Common input/output type simplifies connectivity and interoperability with other devices.

No. of Terminals: 28

With 28 terminals, this product offers sufficient connectivity options for various applications.

Package Style (Meter): IN-LINE

The in-line package style provides easy installation and secure positioning within a circuit.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Organization: 8KX8

The 8Kx8 organization allows for efficient data storage and retrieval.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in signal processing and control.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance in cold environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and increased reliability in connections.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure durability and performance under extreme conditions.

Technology: MOS

MOS technology provides low power consumption and high-speed operation, ideal for memory applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for secure and stable connections on a PCB.

No. of Words: 8192 words

With 8192 words, this product offers ample memory capacity for storing data and instructions.

Memory Width: 8

A memory width of 8 bits enables efficient data processing and manipulation.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy soldering and PCB mounting.

No. of Words Code: 8K

The 8K word code provides easy identification and compatibility with other systems.

Memory Density: 65536 bit

With a memory density of 65536 bits, this product offers high storage capacity in a compact form factor.

Memory IC Type: OTP ROM

OTP ROM memory IC type allows for secure and permanent data storage, ideal for critical applications.

Maximum Access Time: 450 ns

The fast maximum access time ensures quick data retrieval and processing.

Technical Specifications

Other Function Memory ICs SMJ2564-45JM attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SMJ2564-45JM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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