Loading...

SMJ2708-35JM

Texas Instruments

SMJ2708-35JM by Texas Instruments

The Texas Instruments SMJ2708-35JM is a 1Kx8 OTP ROM memory IC with 8192-bit density and 350ns access time. Operating in a temperature range of -55°C to 125°C, it features a MOS technology and offers 3-STATE output characteristics. Ideal for military-grade applications requiring reliable memory storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,720

-

-

-

-

Digiode

USA . 4,823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,823

-

-

-

-

Electronic Expediters

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,095 parts In-Stock

1+ parts

$4.214

100+ parts

-

1k+ parts

$4.650

10k+ parts

-

2,095

$4.214

-

$4.650

-

ChromeModa Solutions

Germany . 5,704 parts In-Stock

1+ parts

$4.735

100+ parts

$3.883

1k+ parts

-

10k+ parts

-

5,704

$4.735

$3.883

-

-

IDEA Electronic Components Group

UK . 2,206 parts In-Stock

1+ parts

$4.735

100+ parts

-

1k+ parts

$4.262

10k+ parts

-

2,206

$4.735

-

$4.262

-

AZTECH Wire

Italy . 653 parts In-Stock

1+ parts

$8.613

100+ parts

-

1k+ parts

-

10k+ parts

-

653

$8.613

-

-

-

One Stop Electronics

USA . 1,575 parts In-Stock

1+ parts

$26.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,575

$26.000

-

-

-

Corphita

USA . 4,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,435

-

-

-

-

DigiPath Technology Company

USA . 1,630 parts In-Stock

1+ parts

-

100+ parts

$4.269

1k+ parts

-

10k+ parts

-

1,630

-

$4.269

-

-

Overview

Unlock unparalleled performance and reliability with the SMJ2708-35JM by Texas Instruments, a leader in semiconductor manufacturing. This top-tier Other Function Memory IC boasts cutting-edge technology tailored for military-grade applications. Experience the seamless integration of 1Kx8 organization and 8192-bit memory density, providing unrivaled speed and efficiency. Elevate your projects with the value and quality that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal resistance and durability, making this product suitable for high-temperature and harsh environments.

Screening Level: 38535Q/M;38534H;883B

This product has been screened and tested to meet rigorous military standards, ensuring reliability and quality.

Package Shape: RECTANGULAR

Rectangular packages are typically easier to handle and install, making this product user-friendly.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding thermal conditions without compromising performance.

Organization: 1KX8

The organization of 1KX8 means that this memory IC can store 1024 words with a width of 8 bits, providing ample storage capacity.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for efficient control of the output signals, enhancing flexibility in data transmission.

Technology: MOS

MOS technology offers low power consumption and high speed operation, making this memory IC energy-efficient and fast.

Memory IC Type: OTP ROM

OTP ROM (One-Time Programmable Read-Only Memory) ensures that the data stored in the memory is secure and cannot be altered, making this product ideal for storing critical information.

Maximum Access Time: 350 ns

With a maximum access time of 350 ns, this memory IC can quickly retrieve data, improving overall system performance.

Technical Specifications

Other Function Memory ICs SMJ2708-35JM attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

Maximum Access Time:

350 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

1KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SMJ2708-35JM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 16