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EPCQ128ASI16N

Intel

EPCQ128ASI16N by Intel

EPCQ128ASI16N by Intel is a 16MX8 NOR type memory IC with 3-STATE output, operating at up to 100 MHz clock frequency. It features a small outline package style, suitable for industrial applications requiring high-speed synchronous operation and a memory density of 134217728 bits.

Median Price

$42.630

Lifecycle Status

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9

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Verical

USA . 132 parts In-Stock

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$42.630

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$41.370

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$40.540

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Digiode

USA . 453 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Vyrian

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Touchstone Systems

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Cyclops Electronics Ltd

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Semi Source

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Bristol Electronics

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MARBEL Systems

Belgium . 12,520 parts In-Stock

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$3.528

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Texas Native Microelectronics

USA . 223 parts In-Stock

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$4.055

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$3.893

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$3.771

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$3.568

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$3.568

Aztec Data Supply Inc.

USA . 3,744 parts In-Stock

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$4.360

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Kenton Components

USA . 450 parts In-Stock

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Qasali Group International

UK . 90 parts In-Stock

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$10.948

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$10.182

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$9.635

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Vigor

Singapore . 220 parts In-Stock

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$18.000

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Corohmni

South Africa . 389 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Modulus Dynamics

Lithuania . 200 parts In-Stock

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Semicontronic

India . 1,897 parts In-Stock

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Ampacity Inc.

Singapore . 1,778 parts In-Stock

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Lixinc

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Argo Parts USA

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Alle Elektronik GmbH

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Netroflash

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A-Z Elektronik GmbH

Germany . 468 parts In-Stock

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RC Electronics

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Speed Components Ltd (Excess)

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Overview

Unlock the power of Intel technology with the EPCQ128ASI16N, a high-quality other function memory IC designed to meet industrial-grade standards. With its small outline package shape and 16MX8 organization, this synchronous operating mode device offers reliable performance in a wide range of applications. From embedded systems to telecommunications equipment, this NOR type memory circuit provides customers with seamless integration, fast data access, and low power consumption. Experience the benefits of Intel's cutting-edge technology and elevate your projects to the next level with the EPCQ128ASI16N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the memory IC, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space in the design.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred and processed efficiently, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V offers a balance between power consumption and performance.

No. of Terminals: 16

Having 16 terminals allows for various connections and configurations, making the memory IC versatile in its applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this memory IC can withstand high temperature environments without compromising functionality.

Organization: 16MX8

The 16MX8 organization indicates a high memory density and efficient data organization, making it suitable for storage-intensive applications.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for tristate operation, enabling flexibility in data output control.

Minimum Operating Temperature: -40 °C

Being able to operate at temperatures as low as -40°C ensures reliability and stability in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin terminal finish provides good solderability and ensures reliable connections for the memory IC.

Technical Specifications

Other Function Memory ICs EPCQ128ASI16N attributes and parameters. Explore more Other Function Memory ICs devices from Intel

Specs

Maximum Clock Frequency (fCLK):

100 MHz

Minimum Data Retention Time:

20

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.65 mm

Maximum Standby Current:

.00006 Amp

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

7.5 mm

Trade Compliance

EPCQ128ASI16N Memory ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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