Loading...

DLPR100DWC

Texas Instruments

DLPR100DWC by Texas Instruments

DLPR100DWC by Texas Instruments is a memory circuit IC with 2MX8 organization, 8-bit memory width, and 16777216 bit memory density. It operates at temperatures ranging from -40 to 85 °C and has a max standby current of 0.00005 Amp. Ideal for industrial applications requiring small outline package style and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,893

-

-

-

-

Digiode

USA . 3,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,575

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 660 parts In-Stock

1+ parts

$0.956

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$0.956

-

-

-

Northwest PG Solutions

USA . 475 parts In-Stock

1+ parts

$1.052

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$1.052

-

-

-

Parana Technologies

USA . 113 parts In-Stock

1+ parts

$2.633

100+ parts

-

1k+ parts

$3.121

10k+ parts

-

113

$2.633

-

$3.121

-

DigiPath Technology Company

USA . 1,573 parts In-Stock

1+ parts

$2.899

100+ parts

$2.667

1k+ parts

-

10k+ parts

-

1,573

$2.899

$2.667

-

-

ChromeModa Solutions

Germany . 1,413 parts In-Stock

1+ parts

$2.958

100+ parts

$2.426

1k+ parts

-

10k+ parts

-

1,413

$2.958

$2.426

-

-

IDEA Electronic Components Group

UK . 1,136 parts In-Stock

1+ parts

$2.958

100+ parts

-

1k+ parts

$2.662

10k+ parts

-

1,136

$2.958

-

$2.662

-

AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$13.632

100+ parts

-

1k+ parts

-

10k+ parts

-

664

$13.632

-

-

-

One Stop Electronics

USA . 1,214 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$28.000

-

-

-

Corphita

USA . 4,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,481

-

-

-

-

Microchip USA

USA . 289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

289

-

-

-

-

Overview

Upgrade your electronic devices with the DLPR100DWC by Texas Instruments, a high-quality memory IC that delivers exceptional performance and reliability. Manufactured by a trusted industry leader, this product boasts a wide range of applications in various electronic systems. With its compact design and advanced features, the DLPR100DWC offers unparalleled value, benefits, and advantages to customers seeking top-notch memory solutions. Enhance your products with cutting-edge technology and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the memory IC, ensuring a longer lifespan.

No. of Terminals: 8

Having 8 terminals allows for efficient connectivity and communication within the memory IC, enhancing its performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this memory IC can withstand demanding industrial environments without overheating.

Memory Width: 8

A memory width of 8 allows for fast data transfer and processing, making this memory IC suitable for high-performance applications.

Memory Density: 16777216 bit

High memory density of 16777216 bits ensures ample storage capacity for large volumes of data, making this memory IC ideal for storage-intensive tasks.

Technical Specifications

Other Function Memory ICs DLPR100DWC attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

No. of Words:

2097152 words

No. of Words Code:

2M

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Standby Current:

.00005 Amp

Sub-Category:

OTP ROMs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

DLPR100DWC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7