Loading...

SN74AS870NTP3

Texas Instruments

SN74AS870NTP3 by Texas Instruments

SN74AS870NTP3 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. Operating temperature range of 0-70°C makes it suitable for commercial applications. Its rectangular shape and through-hole terminal form provide versatility for various memory functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,909

-

-

-

-

Digiode

USA . 3,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,910

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 900 parts In-Stock

1+ parts

$3.576

100+ parts

-

1k+ parts

$4.097

10k+ parts

-

900

$3.576

-

$4.097

-

One Stop Electronics

USA . 1,180 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,180

$4.000

-

-

-

ChromeModa Solutions

Germany . 1,987 parts In-Stock

1+ parts

$4.018

100+ parts

$3.295

1k+ parts

-

10k+ parts

-

1,987

$4.018

$3.295

-

-

IDEA Electronic Components Group

UK . 139 parts In-Stock

1+ parts

$4.018

100+ parts

-

1k+ parts

$3.616

10k+ parts

-

139

$4.018

-

$3.616

-

AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$10.636

100+ parts

-

1k+ parts

-

10k+ parts

-

437

$10.636

-

-

-

Corphita

USA . 4,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,341

-

-

-

-

DigiPath Technology Company

USA . 1,349 parts In-Stock

1+ parts

-

100+ parts

$3.623

1k+ parts

-

10k+ parts

-

1,349

-

$3.623

-

-

Overview

Unlock the power of advanced technology with the SN74AS870NTP3 by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers a wide range of innovative solutions for various applications. This Other Function Memory IC is designed to deliver outstanding performance, making it ideal for a variety of commercial projects. Experience seamless operation and superior functionality with this product, providing customers with unmatched value and benefits. Trust Texas Instruments to provide you with cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the memory ICs, ensuring they are safe from damage and can operate efficiently for a long period of time.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this memory IC into various electronic devices and circuit boards, allowing for flexibility in design and layout.

No. of Terminals: 24

Having 24 terminals allows for a higher level of connectivity and functionality, making this memory IC suitable for more complex applications and systems.

Package Style (Meter): IN-LINE

The in-line package style enables easy installation and maintenance of the memory IC, making it a convenient choice for users and technicians.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this memory IC can withstand heat and perform reliably in various environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this memory IC can function effectively even in colder conditions, increasing its versatility and reliability.

Terminal Position: DUAL

Dual terminal positions provide flexibility in connection and installation, allowing for easier integration into different systems and devices.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that this memory IC is optimized for typical operating conditions in commercial electronic devices and applications.

Technology: TTL

Utilizing TTL technology offers fast response times and reliable performance, making this memory IC suitable for applications that require high-speed data processing.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy soldering and connection, ensuring a secure and stable interface for the memory IC within a circuit board or device.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm allows for easy integration and compatibility with standard electronic components and PCB layouts, making this memory IC a versatile choice for various designs.

Technical Specifications

Other Function Memory ICs SN74AS870NTP3 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS870NTP3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20