Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MR0A08BYS35R by Everspin Technologies is a 128KX8 memory circuit with a CMOS technology. It operates asynchronously at a nominal voltage of 3.3V and has a max access time of 35ns. This memory IC is commonly used in applications that require high-speed data storage and retrieval.
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The use of plastic/epoxy material ensures durability and protection for the memory IC, making it a reliable choice.
Being surface mountable allows for easy installation and integration of the memory IC into various electronic devices, enhancing its versatility.
With a single function, this memory IC simplifies the system design, reducing complexity and enhancing overall efficiency.
The rectangular shape of the package provides compatibility with standard mounting techniques, facilitating seamless integration into electronic circuits.
The asynchronous operating mode allows for flexible and independent data transfer, making it well-suited for applications requiring asynchronous operations.
The nominal supply voltage of 3.3V ensures stable and efficient power delivery, contributing to the reliable performance of the memory IC.
With power supplies operating at 3.3V, this memory IC can be easily incorporated into existing systems, eliminating the need for additional voltage conversions.
The 44 terminals offer sufficient connectivity options, enabling seamless integration into a wide range of electronic circuits.
The small outline and thin profile of the package make it suitable for space-constrained applications, providing flexibility in design.
With a maximum operating temperature of 70°C, this memory IC can withstand demanding thermal conditions, ensuring reliable operation in various environments.
The organization of 128KX8 allows for storing and accessing a large amount of data efficiently, making it ideal for memory-intensive applications.
The minimum operating temperature of 0°C ensures that the memory IC performs reliably even in colder environments.
The dual terminal position provides flexibility in PCB layout, making it easier to route traces and enhance the overall design efficiency.
With a maximum seated height of 1.2mm, this memory IC is suitable for compact designs without compromising reliability.
The width of 10.16mm allows for efficient space utilization, making it suitable for applications with size constraints.
The minimum supply voltage of 3V allows for compatibility with a wide range of power sources, increasing the versatility of the memory IC.
The length of 18.41mm enables seamless integration, even in applications with limited available space.
Designed for commercial use, this memory IC meets industry standards and reliability requirements, making it a suitable choice for a wide range of applications.
Built using CMOS technology, this memory IC offers low power consumption, high noise immunity, and enhanced reliability, making it an optimal choice for various electronic systems.
The gull wing terminal form ensures ease of soldering and robust electrical connections, enhancing the overall reliability of the memory IC.
With a maximum supply current of 65mA, this memory IC operates efficiently, minimizing power consumption and enhancing energy efficiency.
The capacity to store 131072 words allows for the efficient storage of a large volume of data, making it suitable for data-intensive applications.
With a memory width of 8 bits, this memory IC facilitates efficient storage and retrieval of data, enhancing performance in applications demanding high-speed data handling.
The terminal pitch of 0.8mm enables high-density packaging and integration of the memory IC, making it suitable for applications requiring a compact design.
The encoding of 128K words offers ample memory capacity, allowing for efficient storage and retrieval of large volumes of data.
Having a moisture sensitivity level of 3 ensures a stable and reliable operation of the memory IC even in moderate humidity conditions.
With a maximum supply voltage of 3.6V, this memory IC can handle higher voltage signals, providing improved operational flexibility.
The high memory density of 1048576 bits enables efficient storage of a significant amount of data, making it suitable for memory-demanding applications.
Being a memory circuit, this IC specializes in storing and retrieving digital information efficiently, making it an ideal choice for memory-related applications.
With a maximum standby current of 0.007 Amp, this memory IC minimizes power consumption during idle periods, enhancing overall energy efficiency.
The maximum access time of 35ns ensures quick retrieval and transmission of data, improving system responsiveness and performance.
Other Function Memory ICs MR0A08BYS35R attributes and parameters. Explore more Other Function Memory ICs devices from Everspin Technologies
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MR0A08BYS35R Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Trace Code Chgs 20/Oct/2021 Mold Compound Update 15/Dec/2014
PCN Assembly/Origin - Mult Dev Site Add 27/Jul/2020
Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
BAV99
Philips Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
Transys Electronics
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
Taitron Components
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
M36LLR8760B1ZAQE
M36LLR8760B1ZAQE by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C, ideal for compact applications. With 88 terminals in a fine-pitch grid array, it ensures efficient performance in various electronic devices.
FM3808-70-T
Ramtron International
FM3808-70-T by Ramtron Int. is a 32KX8 MEMORY CIRCUIT IC with 262144 bit MEMORY DENSITY. Operating at SYNCHRONOUS mode, it has a supply voltage range of 4.5V to 5.5V and temp range of -40°C to 85°C. Ideal for industrial applications requiring high memory density in compact form factor.
M36LLR8860D1ZAQ
M36LLR8860D1ZAQ by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M x 16 organization and a mixed FLASH+PSRAM type. It operates at a nominal voltage of 1.8V with a max temp of 85 °C, ideal for compact applications. Its grid array design ensures efficient space utilization in electronic devices.
SN74S262N1
SN74S262N1 by Texas Instruments is a TTL Memory Circuit IC with 20 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. The PLASTIC/EPOXY rectangular package makes it ideal for memory circuit functions.
TMX27C512-45
Other Memory ICs;
ST25DV64K-IER6T3
ST25DV64K-IER6T3 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and is suitable for industrial applications requiring small outline, thin profile ICs.
S27KS0641DPBHI020
Infineon Technologies
Infineon's S27KS0641DPBHI020 is a 8MX8 memory IC with 67108864 bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for industrial applications requiring high memory capacity in a compact GRID ARRAY package.
47C16-I/SN
Microchip Technology
47C16-I/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 2KX8 organization. It operates at a voltage range of 4.5V to 5.5V and has a memory density of 16384 bits. This small outline package is ideal for industrial applications requiring fast access times and reliable data storage.
M36P0R9070E0ZAQF
M36P0R9070E0ZAQF by STMicroelectronics is a CMOS memory IC with a 32M x 16 organization, operating at 1.8V. It features a thin profile grid array package and supports asynchronous mode, making it ideal for compact electronic applications. With a temp range of -30 °C to 85 °C, it's suitable for commercial use.
TMS27C32-2NE
DS90922R-L00
Analog Devices
DS90922R-L00 by Analog Devices is a CMOS MEMORY CIRCUIT with 2 terminals in a ROUND METAL package. It features TIN LEAD finish and THROUGH-HOLE terminal form. Ideal for applications requiring Other Function Memory ICs in CYLINDRICAL package style.
AT88SC25616C-MJ
AT88SC25616C-MJ by Microchip Technology is a 32KX8 CMOS CRYPTO MEMORY IC with 262144 bit memory density. It operates in SYNCHRONOUS mode with a max access time of 35 ns. Ideal for secure applications requiring fast data processing at temperatures b/w 0-70°C.
47C04-I/ST
47C04-I/ST by Microchip Technology is a CMOS memory IC with EEPROM+SRAM, 512X8 organization, and 4096-bit memory density. It operates synchronously at temperatures ranging from -40 to 85°C. This small outline package with 0.65mm terminal pitch is ideal for industrial applications requiring fast access times.
XC17S20PD8C
Xilinx
The Xilinx XC17S20PD8C is a 178144-bit memory circuit IC with synchronous operation and 3-STATE output. It operates at a max clock frequency of 10 MHz, suitable for applications requiring high-speed memory access. With a package style of IN-LINE and through-hole terminal form, it is commonly used in commercial-grade systems needing reliable memory storage.
M28F221-80YN5
SN74170JP4
SN74170JP4 by Texas Instruments is a TTL memory IC with 16 terminals, operating at 5V. It has a rectangular ceramic package and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring reliable memory functions in electronic circuits.
TACT2151-25FN
TACT2151-25FN by Texas Instruments is a 1Kx11 memory circuit IC with 11264-bit memory density. It features a max access time of 25ns and operates b/w 0°C to 70°C. This CMOS technology chip carrier package is ideal for applications requiring fast data retrieval in commercial-grade environments.
47C04-E/SN
47C04-E/SN by Microchip Technology is a small outline memory IC with 512x8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. Ideal for automotive applications, it has a supply voltage range of 4.5V to 5.5V and operates in temperatures from -40°C to 125°C.
TMS27C291-50J
SN74LS170NP3
SN74LS170NP3 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. Ideal for commercial applications, it operates b/w 0°C to 70°C and features an in-line package style.
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MR0A16ACYS35
Freescale Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MR0A16AYS35
MR0A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit memory density. Operating at 3.3V, it has an access time of 35ns and supports asynchronous mode. This PLASTIC/EPOXY IC in SMALL OUTLINE package is ideal for various commercial applications requiring high-speed memory functions.
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;
MR0A16ACYS35R
MR0A16AYS35R
MR0A16AYS35R by Freescale Semiconductor is a 64KX16 memory circuit with a supply voltage of 3.3V. It operates in asynchronous mode and has a max access time of 35ns. This memory IC is commonly used in applications requiring high-speed data storage and retrieval.
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Length: 18.41 mm;
MR0A08BCYS35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words Code: 128K;
MR0A16AVYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MR0A08BMA35R
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
MR0A08BSO35R
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MR0A08BSO35
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
MR0A08BCSO35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
MR0A08BCSO35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
MR0A08BCYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
MR0A08BMA35
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;
MR0A08BMYS35R
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
MR0A08BMYS35
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Functions: 1;
MR0A08BYS35
MR0A08BYS35 by Everspin: 128KX8 memory IC with 3.3V supply, 35ns access time, and 1048576 bit density. Ideal for commercial applications requiring fast asynchronous operation in a small outline package.
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