Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MR0A08BYS35R by Everspin Technologies is a 128KX8 memory circuit with a CMOS technology. It operates asynchronously at a nominal voltage of 3.3V and has a max access time of 35ns. This memory IC is commonly used in applications that require high-speed data storage and retrieval.
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The use of plastic/epoxy material ensures durability and protection for the memory IC, making it a reliable choice.
Being surface mountable allows for easy installation and integration of the memory IC into various electronic devices, enhancing its versatility.
With a single function, this memory IC simplifies the system design, reducing complexity and enhancing overall efficiency.
The rectangular shape of the package provides compatibility with standard mounting techniques, facilitating seamless integration into electronic circuits.
The asynchronous operating mode allows for flexible and independent data transfer, making it well-suited for applications requiring asynchronous operations.
The nominal supply voltage of 3.3V ensures stable and efficient power delivery, contributing to the reliable performance of the memory IC.
With power supplies operating at 3.3V, this memory IC can be easily incorporated into existing systems, eliminating the need for additional voltage conversions.
The 44 terminals offer sufficient connectivity options, enabling seamless integration into a wide range of electronic circuits.
The small outline and thin profile of the package make it suitable for space-constrained applications, providing flexibility in design.
With a maximum operating temperature of 70°C, this memory IC can withstand demanding thermal conditions, ensuring reliable operation in various environments.
The organization of 128KX8 allows for storing and accessing a large amount of data efficiently, making it ideal for memory-intensive applications.
The minimum operating temperature of 0°C ensures that the memory IC performs reliably even in colder environments.
The dual terminal position provides flexibility in PCB layout, making it easier to route traces and enhance the overall design efficiency.
With a maximum seated height of 1.2mm, this memory IC is suitable for compact designs without compromising reliability.
The width of 10.16mm allows for efficient space utilization, making it suitable for applications with size constraints.
The minimum supply voltage of 3V allows for compatibility with a wide range of power sources, increasing the versatility of the memory IC.
The length of 18.41mm enables seamless integration, even in applications with limited available space.
Designed for commercial use, this memory IC meets industry standards and reliability requirements, making it a suitable choice for a wide range of applications.
Built using CMOS technology, this memory IC offers low power consumption, high noise immunity, and enhanced reliability, making it an optimal choice for various electronic systems.
The gull wing terminal form ensures ease of soldering and robust electrical connections, enhancing the overall reliability of the memory IC.
With a maximum supply current of 65mA, this memory IC operates efficiently, minimizing power consumption and enhancing energy efficiency.
The capacity to store 131072 words allows for the efficient storage of a large volume of data, making it suitable for data-intensive applications.
With a memory width of 8 bits, this memory IC facilitates efficient storage and retrieval of data, enhancing performance in applications demanding high-speed data handling.
The terminal pitch of 0.8mm enables high-density packaging and integration of the memory IC, making it suitable for applications requiring a compact design.
The encoding of 128K words offers ample memory capacity, allowing for efficient storage and retrieval of large volumes of data.
Having a moisture sensitivity level of 3 ensures a stable and reliable operation of the memory IC even in moderate humidity conditions.
With a maximum supply voltage of 3.6V, this memory IC can handle higher voltage signals, providing improved operational flexibility.
The high memory density of 1048576 bits enables efficient storage of a significant amount of data, making it suitable for memory-demanding applications.
Being a memory circuit, this IC specializes in storing and retrieving digital information efficiently, making it an ideal choice for memory-related applications.
With a maximum standby current of 0.007 Amp, this memory IC minimizes power consumption during idle periods, enhancing overall energy efficiency.
The maximum access time of 35ns ensures quick retrieval and transmission of data, improving system responsiveness and performance.
Other Function Memory ICs MR0A08BYS35R attributes and parameters. Explore more Other Function Memory ICs devices from Everspin Technologies
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MR0A08BYS35R Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Trace Code Chgs 20/Oct/2021 Mold Compound Update 15/Dec/2014
PCN Assembly/Origin - Mult Dev Site Add 27/Jul/2020
Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Vishay Sprague
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Microsemi
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
Silicon Standard
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
NXP Semiconductors
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
FDLL4148
Fairchild Semiconductor
Onsemi
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
Bytesonic Electronics
DS2401AP+
Analog Devices
MEMORY CIRCUIT;
SNC54170W
Texas Instruments SNC54170W is a MIL-STD-883 Class B (Modified) memory IC with 16 terminals and 5V supply voltage. It features TTL technology, operates b/w -55 to 125 °C, and is ideal for military applications requiring a ceramic package in a flatpack style.
MR25H256CDF
Everspin Technologies
MR25H256CDF by Everspin Technologies is a 32KX8 memory IC with CMOS technology. Operating at 3V, it has a temperature range of -40 to 85 °C and offers 262144 bits memory density. Ideal for industrial applications, this synchronous memory chip comes in a small outline package with surface mount capability.
DS14220-F50
DS14220-F50 by Analog Devices is a CMOS MEMORY CIRCUIT with 2048-bit memory density. It operates in an INDUSTRIAL temperature range (-40 to 85 °C) and has a supply voltage range of 2.8V to 6V. This ROUND, METAL package IC is ideal for applications requiring reliable non-volatile memory storage in harsh environments.
MR2A16AVYS35
Freescale Semiconductor
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 256KX16;
MTFDHBL512TDQ-1AT12ATYYTR
Micron Technology
TMS27C32-15NE
Other Memory ICs;
CY8C24033-24PVXI
Cypress Semiconductor
CY8C24033-24PVXI by Cypress: 8KX1 memory circuit with 8192-bit density. Operates synchronously, industrial grade, -40 to 85°C range. Ideal for applications requiring small outline, shrink pitch package and CMOS technology.
MR25H256MDC
MR25H256MDC by Everspin Technologies is a 262144-bit MEMORY CIRCUIT with 32KX8 organization, operating at 3.3V. This SMALL OUTLINE IC has a temperature range of -40 to 125 °C and is AEC-Q100 compliant, suitable for AUTOMOTIVE applications requiring reliable synchronous memory solutions.
TMS27PC49-45JL
AT88SC0104C-SH-T
Microchip Technology
AT88SC0104C-SH-T by Microchip Technology is a 1024-bit CRYPTO MEMORY IC with 128x8 organization. It operates in SYNCHRONOUS mode with a max access time of 35ns. Ideal for industrial applications, it has a temperature range of -40 to 85°C and requires a supply voltage b/w 2.7V to 5.5V.
DS28E80Q+TW
THGBMDG5D1LBAIT
Toshiba
The Toshiba THGBMDG5D1LBAIT is a 4GX8 memory IC with 34359738368-bit density and CMOS technology. It features a rectangular GRID ARRAY package with 153 terminals, suitable for applications requiring high memory capacity and efficient data processing in devices operating b/w -25°C to 85°C.
M28F221-70YN3
STMicroelectronics
M36W216BI70ZA1
M36W216BI70ZA1 by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16Mbit density with FLASH+SRAM technology. It operates at 3V and supports a max temp of 70 °C. Ideal for compact applications requiring efficient data storage and retrieval.
P1103
Intel
Intel P1103 is a 1KX1 MOS memory IC with 1024-bit density. It operates b/w 0-70°C, has 32 refresh cycles, and a max access time of 300ns. Ideal for applications requiring separate I/O type and commercial temperature grade.
TMX27PC256N45
SAA4955TJ
SAA4955TJ by NXP Semiconductors is a memory circuit IC with 245772x12 organization and 2949264 bit memory density. It operates synchronously at a nominal voltage of 3.3V and has a max access time of 21ns. This IC is commonly used in applications requiring small outline package style and commercial temperature grade.
DS1992L-F5
Maxim Integrated
DS1992L-F5 by Maxim Integrated is a 1KX1 MEMORY CIRCUIT with 1024 bit memory density. It operates in ASYNCHRONOUS mode at temperatures from -40 to 70 °C, powered by 2.8-6 V supplies. This METAL package IC is surface mountable and suitable for applications requiring reliable non-volatile data storage.
AT88SC0104CA-Y6H-T
AT88SC0104CA-Y6H-T by Microchip Technology is a CRYPTO MEMORY IC with 1024-bit memory density, operating at 3/3.3V. It features a synchronous mode, 128x8 organization, and max access time of 250ns. Ideal for secure applications requiring industrial-grade temperature range and small footprint in surface-mount designs.
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MR0A16ACYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MR0A16AYS35
MR0A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit memory density. Operating at 3.3V, it has an access time of 35ns and supports asynchronous mode. This PLASTIC/EPOXY IC in SMALL OUTLINE package is ideal for various commercial applications requiring high-speed memory functions.
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;
MR0A16ACYS35R
MR0A16AYS35R
MR0A16AYS35R by Freescale Semiconductor is a 64KX16 memory circuit with a supply voltage of 3.3V. It operates in asynchronous mode and has a max access time of 35ns. This memory IC is commonly used in applications requiring high-speed data storage and retrieval.
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Length: 18.41 mm;
MR0A08BCYS35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words Code: 128K;
MR0A16AVYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MR0A08BMA35R
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
MR0A08BSO35R
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MR0A08BSO35
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
MR0A08BCSO35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
MR0A08BCSO35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
MR0A08BCYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
MR0A08BMA35
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;
MR0A08BMYS35R
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
MR0A08BMYS35
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Functions: 1;
MR0A08BYS35
MR0A08BYS35 by Everspin: 128KX8 memory IC with 3.3V supply, 35ns access time, and 1048576 bit density. Ideal for commercial applications requiring fast asynchronous operation in a small outline package.
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