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SN74AS871NP1

Texas Instruments

SN74AS871NP1 by Texas Instruments

SN74AS871NP1 by Texas Instruments is a TTL technology IC with 28 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The rectangular plastic/epoxy body and through-hole terminals make it ideal for various memory functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,991 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,991

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Digiode

USA . 3,537 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,537

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,605 parts In-Stock

1+ parts

$4.946

100+ parts

-

1k+ parts

$5.485

10k+ parts

-

1,605

$4.946

-

$5.485

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DigiPath Technology Company

USA . 847 parts In-Stock

1+ parts

$5.446

100+ parts

$5.010

1k+ parts

-

10k+ parts

-

847

$5.446

$5.010

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ChromeModa Solutions

Germany . 1,792 parts In-Stock

1+ parts

$5.557

100+ parts

$4.557

1k+ parts

-

10k+ parts

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1,792

$5.557

$4.557

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IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$5.557

100+ parts

-

1k+ parts

$5.001

10k+ parts

-

712

$5.557

-

$5.001

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One Stop Electronics

USA . 1,051 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

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10k+ parts

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1,051

$9.000

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AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$17.579

100+ parts

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1k+ parts

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10k+ parts

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548

$17.579

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Corphita

USA . 1,767 parts In-Stock

1+ parts

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1,767

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Overview

Unleash the power of cutting-edge technology with the SN74AS871NP1 by Texas Instruments. Crafted with precision and expertise, this memory IC boasts unparalleled quality and reliability, setting it apart from the rest. Ideal for a wide range of applications, this versatile product delivers exceptional performance and efficiency. Whether you're a tech enthusiast or a seasoned professional, this innovative solution offers unmatched value, benefits, and advantages that will elevate your projects to new heights. Trust in Texas Instruments to deliver excellence with every product, and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making it ideal for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit boards and provides a compact design, saving space in electronic devices.

No. of Terminals: 28

With 28 terminals, this memory IC offers versatile connectivity options, allowing for complex circuit configurations and extensive data storage capabilities.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and replacement processes, making this memory IC user-friendly and convenient for maintenance purposes.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, enhancing the durability and longevity of this memory IC.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this memory IC can function effectively in cold environments without any performance issues, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position allows for secure and stable connections, reducing the risk of signal interference or disconnection, resulting in consistent and reliable data transfer.

Temperature Grade: COMMERCIAL

Designed for commercial use, this memory IC meets industry standards for performance and reliability, making it a trusted choice for electronic manufacturers and businesses.

Technology: TTL

Utilizing TTL technology ensures fast and efficient data processing, offering high-speed performance and low power consumption, making this memory IC ideal for demanding applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection to the circuit board, enhancing the overall durability and reliability of this memory IC.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this memory IC offers easy installation and alignment on standard PCBs, allowing for quick and hassle-free integration into electronic devices.

Technical Specifications

Other Function Memory ICs SN74AS871NP1 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS871NP1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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