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SN74AS870JTP4

Texas Instruments

SN74AS870JTP4 by Texas Instruments

SN74AS870JTP4 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0-70°C, suitable for commercial applications. The ceramic package body and rectangular shape make it ideal for various memory functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,803 parts In-Stock

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Digiode

USA . 1,420 parts In-Stock

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1,420

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Distributors (Availability)

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Parana Technologies

USA . 1,587 parts In-Stock

1+ parts

$4.605

100+ parts

-

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$5.073

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1,587

$4.605

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$5.073

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DigiPath Technology Company

USA . 495 parts In-Stock

1+ parts

$5.071

100+ parts

$4.665

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495

$5.071

$4.665

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ChromeModa Solutions

Germany . 3,711 parts In-Stock

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$5.174

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$4.243

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$5.174

$4.243

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IDEA Electronic Components Group

UK . 2,162 parts In-Stock

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$5.174

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$4.657

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2,162

$5.174

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$4.657

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One Stop Electronics

USA . 363 parts In-Stock

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$16.000

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363

$16.000

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AZTECH Wire

Italy . 671 parts In-Stock

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$19.192

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671

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Corphita

USA . 4,501 parts In-Stock

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Overview

Unlock the power of reliable memory solutions with the SN74AS870JTP4 by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers exceptional performance in the realm of Other Function Memory ICs. Designed with precision and durability in mind, this product offers customers unparalleled value and benefits. Whether you're looking to enhance your electronic devices or streamline your operations, the SN74AS870JTP4 is the perfect choice for all your memory needs. Trust Texas Instruments to provide cutting-edge solutions for all your technological requirements.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity, making it suitable for applications where heat dissipation is crucial.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and provides a compact design for space-constrained applications.

No. of Terminals: 24

Having 24 terminals allows for a higher level of connectivity and versatility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to integrate into existing circuit layouts and ensures a neat and organized setup.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures reliable performance in a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal positioning enables better stability and connectivity, reducing the risk of signal loss or interference.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial electronics applications.

Technology: TTL

TTL (Transistor-Transistor Logic) technology provides fast switching speeds and low power consumption, enhancing the overall performance of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminal form makes it easy to solder the IC onto a circuit board, ensuring a secure and durable connection.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy alignment and soldering, simplifying the assembly process for the end user.

Technical Specifications

Other Function Memory ICs SN74AS870JTP4 attributes and parameters. Explore more Other Function Memory ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS870JTP4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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