Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36D0R6040B0ZAIT from STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and PSRAM technologies for efficient data storage. Ideal for applications requiring compact, high-density memory solutions in thin-profile packages.
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Anansix
IDEA Electronic Components Group
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$5.702
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Parana Technologies
$3.626
The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product reliable for various applications.
Surface mount capability allows for compact design and easy integration into modern electronic assemblies.
A rectangular shape is optimal for efficient space utilization on printed circuit boards (PCBs).
Asynchronous operation increases flexibility in data processing tasks, beneficial for varied application requirements.
Combining FLASH and PSRAM offers versatility, enabling both non-volatile storage and fast access memory in one IC.
Low nominal supply voltage ensures energy efficiency, making it suitable for battery-operated devices.
Consistent power requirements simplify design and integration into low-power systems.
A higher number of terminals provides more connectivity options, enhancing circuit design flexibility.
Thin profile with fine pitch is beneficial for high-density applications where space is at a premium.
The ability to operate at high temperatures allows the IC to function in demanding environments.
This memory organization supports various data storage structures, catering to a wide range of applications.
Wide operating temperature range ensures reliability in both extreme cold and warm conditions.
Tin-lead terminal finish ensures excellent solderability for reliable electrical connections.
Bottom terminal positioning allows for efficient thermal management and PCB layout optimization.
A low seated height contributes to compact design and improved compatibility with other components.
Compact width aids in space-constrained designs and opens up possibilities for miniaturized electronic products.
Operating at a low minimum supply voltage is ideal for energy-sensitive applications.
Short length assists in fitting the IC into compact configurations without sacrificing performance.
CMOS technology provides low power consumption and high speed, making it suitable for modern applications.
Ball terminal form enhances packaging density and provides excellent electrical performance.
Low maximum supply current denotes energy efficiency, an important factor for battery-powered devices.
A substantial number of words enhances data storage capacity, useful for data-intensive applications.
A memory width of 16 bits allows for efficient data processing and transmission speeds.
Tighter terminal pitch enables higher density design, accommodating more functionality in less space.
The 4M word size indicates a robust data handling capability, suitable for various memory-intensive applications.
A higher maximum supply voltage ensures compatibility with a wide range of electronic circuits.
High memory density allows for substantial data storage, perfect for applications like smartphones and IoT devices.
Designed specifically as a memory circuit, it is optimized for performance and reliability.
Extremely low standby current ensures minimal energy consumption when not in active use.
Fast access time of 70 ns contributes to quicker data retrieval, enhancing the overall system performance.
Other Function Memory ICs M36D0R6040B0ZAIT attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36D0R6040B0ZAIT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJ2RKF1002X
Panasonic
Panasonic's ERJ2RKF1002X is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance and operating temperature range of -55 to 155 °C.
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Weitron Technology
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
Laube Technology
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
LD1117S33TR
STMicroelectronics
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
47C16T-I/SN
Microchip Technology
47C16T-I/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with an organization of 2KX8 and a memory density of 16384 bit. It operates at a nominal voltage of 5V and has a max access time of 400 ns. This memory circuit is commonly used in industrial applications requiring reliable data storage.
TMS27C256-30
Other Memory ICs;
TMS2508-25JL
TMS2508-25JL by Texas Instruments is a 1Kx8 MOS memory IC with 8192-bit density and 250ns access time. It features 3-STATE output, operates b/w 0 to 70°C, and has a rectangular ceramic package. Ideal for applications requiring common I/O type in commercial-grade environments.
M36W216BI85ZA1T
M36W216BI85ZA1T from STMicroelectronics is a low-profile, asynchronous memory IC featuring 16Mbit density with FLASH+SRAM technology. It operates at 3V and supports a max access time of 85ns. Ideal for commercial applications requiring efficient data storage and retrieval.
TMS27PC32-12NE4
ST25DV04K-IER6S3
ST25DV04K-IER6S3 by STMicroelectronics is a 4Kx1 memory circuit with 4096-bit memory density. It operates synchronously at 3.3V, suitable for industrial applications. This small outline IC has a rectangular shape, Gull Wing terminals, and can withstand temperatures from -40 to 85°C.
S27KL0641DABHB020
Infineon Technologies
Infineon's S27KL0641DABHB020 is a 8MX8 MEMORY CIRCUIT with 67108864 bit Memory Density. It operates at 3V, -40 to 105 °C, and has AEC-Q100 Screening Level for INDUSTRIAL applications. The PLASTIC/EPOXY GRID ARRAY IC is SYNCHRONOUS with 24 terminals in a RECTANGULAR package style.
TACT2151-25JD
TACT2151-25JD by Texas Instruments is a 1KX11 memory circuit IC with 11264-bit memory density. It operates at a max temperature of 70°C and has an access time of 25ns. This CMOS technology IC is ideal for applications requiring high-speed memory functions in commercial-grade environments.
SN74LS170N1
SN74LS170N1 by Texas Instruments is a TTL technology IC with 16 terminals and a supply voltage of 5V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The package style is in-line rectangular plastic/epoxy, ideal for various memory functions.
DS2401P+
Analog Devices
DS2401P+ by Analog Devices is a 64-bit MEMORY CIRCUIT with CMOS technology. It operates at 5V, has 6 terminals, and supports asynchronous mode. Ideal for industrial applications requiring small outline memory ICs with a temperature range of -40 to 85°C.
IRMCF171TR
MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 3;
ATSHA204A-SSHDA-B
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SN74LS170FN3
SN74LS170FN3 by Texas Instruments is a TTL technology IC with 20 terminals in a square chip carrier package. It operates at temperatures b/w 0°C to 70°C and has a nominal voltage of 5V. This memory IC is commonly used in commercial applications requiring other function memory capabilities.
TMS2708-35JDL
TMS2708-35JDL by Texas Instruments is a 1KX8 MOS memory IC with 8192-bit density and 350 ns access time. It features 3-STATE output characteristics, operates b/w 0 to 70°C, and comes in a ceramic rectangular package. Ideal for applications requiring high-speed data storage in commercial-grade environments.
M36W0R6030T0ZAQE
M36W0R6030T0ZAQE by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and SRAM technologies for efficient data storage in industrial applications. With a max temp of 85 °C and access time of 70ns, it ensures reliable performance.
SNC54AS870JT
SNC54AS870JT by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL memory IC with 24 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for military applications requiring high temperature resilience and reliability. The CERAMIC package body material ensures durability in harsh environments.
DS1204U-G01
Analog Devices' DS1204U-G01 is a 128-bit MEMORY CIRCUIT with SYNCHRONOUS operation at 5V. It has a temperature range of 0-70 °C, making it ideal for COMMERCIAL applications. This RECTANGULAR IC features a CMOS technology and is organized as 128X1, suitable for various electronic devices.
MR2A16AVYS35
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
SN54HC670J
SN54HC670J by Texas Instruments is a CMOS memory IC with 16 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, suitable for military-grade applications. With power supplies ranging from 2V to 6V, it offers reliable performance in various electronic systems.
SN74AS871JD4
SN74AS871JD4 by Texas Instruments is a TTL memory IC with 28 terminals in an IN-LINE package. Operating temperature range of 0-70°C, ideal for commercial applications. Features ceramic body material and rectangular shape, suitable for various electronic functions.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36DR232B120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M36DR232A100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns;
M36D0R6040T0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00011 Amp;
M36DR232B100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;
M36DR232A120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M36DR232A100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
M36DR232B120ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8/2;
M36D0R6040B0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36DR232A120ZA6
M36D0R6040T0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36DR232B100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
M36DR232A120ZA6T
M36D0R6040T0ZAIT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANIZED AS 1M X 16;
M36DR232B120ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36DR232A100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA66,8X12,32;
M36D0R6040B0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 4M;
M36D0R6040B0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 12 mm;
M36D0R6040T0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
M36DR232B100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Numonyx
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
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