Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36D0R6040B0ZAIT from STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and PSRAM technologies for efficient data storage. Ideal for applications requiring compact, high-density memory solutions in thin-profile packages.
Median Price
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Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Anansix
IDEA Electronic Components Group
$3.032
$2.729
MKK Technologies
$5.702
DigiPath Technology Company
Corphita
Parana Technologies
$3.626
The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product reliable for various applications.
Surface mount capability allows for compact design and easy integration into modern electronic assemblies.
A rectangular shape is optimal for efficient space utilization on printed circuit boards (PCBs).
Asynchronous operation increases flexibility in data processing tasks, beneficial for varied application requirements.
Combining FLASH and PSRAM offers versatility, enabling both non-volatile storage and fast access memory in one IC.
Low nominal supply voltage ensures energy efficiency, making it suitable for battery-operated devices.
Consistent power requirements simplify design and integration into low-power systems.
A higher number of terminals provides more connectivity options, enhancing circuit design flexibility.
Thin profile with fine pitch is beneficial for high-density applications where space is at a premium.
The ability to operate at high temperatures allows the IC to function in demanding environments.
This memory organization supports various data storage structures, catering to a wide range of applications.
Wide operating temperature range ensures reliability in both extreme cold and warm conditions.
Tin-lead terminal finish ensures excellent solderability for reliable electrical connections.
Bottom terminal positioning allows for efficient thermal management and PCB layout optimization.
A low seated height contributes to compact design and improved compatibility with other components.
Compact width aids in space-constrained designs and opens up possibilities for miniaturized electronic products.
Operating at a low minimum supply voltage is ideal for energy-sensitive applications.
Short length assists in fitting the IC into compact configurations without sacrificing performance.
CMOS technology provides low power consumption and high speed, making it suitable for modern applications.
Ball terminal form enhances packaging density and provides excellent electrical performance.
Low maximum supply current denotes energy efficiency, an important factor for battery-powered devices.
A substantial number of words enhances data storage capacity, useful for data-intensive applications.
A memory width of 16 bits allows for efficient data processing and transmission speeds.
Tighter terminal pitch enables higher density design, accommodating more functionality in less space.
The 4M word size indicates a robust data handling capability, suitable for various memory-intensive applications.
A higher maximum supply voltage ensures compatibility with a wide range of electronic circuits.
High memory density allows for substantial data storage, perfect for applications like smartphones and IoT devices.
Designed specifically as a memory circuit, it is optimized for performance and reliability.
Extremely low standby current ensures minimal energy consumption when not in active use.
Fast access time of 70 ns contributes to quicker data retrieval, enhancing the overall system performance.
Other Function Memory ICs M36D0R6040B0ZAIT attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36D0R6040B0ZAIT Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
2N2222A
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
Multicomp Pro
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
Philips Semiconductors
Surge Components
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
47L64-I/SN
47L64-I/SN by Microchip Technology is a small outline memory IC with 8KX8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is suitable for industrial applications requiring a memory density of 65536 bit, fast access time of 550 ns, and a supply voltage range from 2.7V to 3.6V.
FM24C04A-S
Enhanced Memory Systems
Other Memory ICs;
LC331632ML-80
LC331632ML-80 by Onsemi is a 32KX16 CMOS memory IC with 3-STATE output, operating at temperatures from 0 to 70 °C. It has a supply voltage of 5V and max access time of 80ns. This small outline package with gull wing terminals is ideal for applications requiring common I/O type memory solutions.
DS28E80Q+T
Analog Devices
MEMORY CIRCUIT; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
SN7489J
Texas Instruments
SN7489J by Texas Instruments is a 16x4 memory circuit IC with CMOS technology. It operates asynchronously at 5V, with open-collector output and a max access time of 60ns. Ideal for applications requiring parallel memory storage in commercial temperature environments.
ST25DV16K-IER6T3
STMicroelectronics
ST25DV16K-IER6T3 by STMicroelectronics is a 16KX1 MEMORY CIRCUIT with 16384 bit Memory Density. It operates at 3.3V, -40 to 85 °C temperature range, in SYNCHRONOUS mode. Ideal for industrial applications requiring small outline, thin profile ICs with shrink pitch package style.
MT29C4G96MAZAPCJG-5IT
Micron Technology
Micron Technology's MT29C4G96MAZAPCJG-5IT is a 256MX16 memory IC with 4294967296 bit memory density. Operating at 1.8V, it features synchronous mode and industrial temperature grade. Suitable for applications requiring high memory capacity and fast data processing in compact devices.
M36W108T100ZN5
M36W108T100ZN5 from STMicroelectronics is a mixed FLASH+SRAM memory IC with a 1MX8 organization, ideal for asynchronous applications. It operates b/w 2.7V and 3.6V, featuring a max access time of 100ns and a temp range of -20 °C to 85°C. Its compact design (9.8mm x 11.8mm) suits space-constrained devices.
M30082040108X0PWAY
Integrated Device Technology
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-N8; No. of Words Code: 1M;
TMS27PC291-35FN
DS28C50Q+T
MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260;
TMS27C32-15NE4
M36W0R5020T0ZAQE
M36W0R5020T0ZAQE by STMicroelectronics is a versatile memory IC featuring 2M words of mixed FLASH+SRAM with a max access time of 70 ns. It operates asynchronously at a nominal voltage of 1.8V, suitable for industrial applications. Its compact design (8x10 mm) ensures efficient space utilization in electronic devices.
FM3808-70-T
Ramtron International
FM3808-70-T by Ramtron Int. is a 32KX8 MEMORY CIRCUIT IC with 262144 bit MEMORY DENSITY. Operating at SYNCHRONOUS mode, it has a supply voltage range of 4.5V to 5.5V and temp range of -40°C to 85°C. Ideal for industrial applications requiring high memory density in compact form factor.
DM74S472N/A+
M36W216B100ZA6
M36W216B100ZA6 from STMicroelectronics is a low-profile, asynchronous memory IC with a 16-bit width and a density of 16Mbit. It operates b/w -40 °C to 85 °C, making it ideal for industrial applications. This surface-mount device features a compact design with 66 terminals.
SN74S262NP1
SN74S262NP1 by Texas Instruments is a TTL memory circuit IC with 20 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, suitable for commercial applications. The through-hole terminals are spaced at 2.54mm pitch, making it ideal for various function memory circuits.
SMJ27C128-15J
SNC54LS170W
SNC54LS170W by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL IC with 16 terminals and a supply voltage of 5V. Its ceramic package can operate b/w -55°C to 125°C, making it suitable for military-grade applications requiring reliable memory functions in harsh environments. This rectangular flatpack IC is surface mountable and ideal for use in rugged electronic systems where high temperature tolerance and durability are essential.
SN74ALS871NP3
SN74ALS871NP3 by Texas Instruments is a TTL technology IC with 24 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring other function memory ICs. The through-hole terminals have a pitch of 2.54mm, providing reliable connectivity in various electronic devices.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36DR232B120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M36DR232A100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns;
M36D0R6040T0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00011 Amp;
M36DR232B100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;
M36DR232A120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M36DR232A100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
M36DR232B120ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8/2;
M36D0R6040B0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36DR232A120ZA6
M36D0R6040T0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36DR232B100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
M36DR232A120ZA6T
M36D0R6040T0ZAIT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANIZED AS 1M X 16;
M36DR232B120ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36DR232A100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA66,8X12,32;
M36D0R6040B0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 4M;
M36D0R6040B0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 12 mm;
M36D0R6040T0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
M36DR232B100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Numonyx
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
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