Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36DR232B120ZA6T from STMicroelectronics is a low-profile, asynchronous memory IC featuring a mixed FLASH+SRAM design with 2M words and 16-bit width. It operates b/w -40 °C to 85°C, powered by 1.8-2.2V. Ideal for industrial applications requiring compact memory solutions.
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$3.555
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Corphita
Parana Technologies
$2.260
The use of plastic/epoxy enhances durability and provides protection against environmental factors, making it suitable for industrial applications.
Surface-mount technology enables a compact design and simplifies assembly, leading to reduced space requirements on circuit boards.
The rectangular shape provides an efficient layout, optimizing the space on the PCB for other components.
Asynchronous operation allows for more flexible timing control and can improve performance in specific applications where immediate access is required.
Combining FLASH and SRAM provides both non-volatile and volatile storage options, making it versatile for various applications.
Dual power supply options allow for efficient energy management and compatibility with modern low-power designs.
A higher number of terminals supports more connections for data and power, enhancing functionality and performance.
The low profile and fine pitch design enables high-density mounting, which saves space and improves thermal performance.
A maximum operating temperature of 85 °C ensures reliability in a wide range of operating conditions, especially in industrial environments.
The memory organization allows for efficient data management and retrieval, which is crucial for performance in memory-intensive applications.
A minimum operating temperature of -40 °C ensures the IC functions well in extreme environments, making it suitable for rugged applications.
Tin-lead terminal finish provides good solderability and enhances long-term reliability of the connections.
Bottom terminal positioning can provide shorter connection paths, improving electrical performance.
A low seated height allows for thin profiles in device designs, which is beneficial for portable and space-constrained applications.
A compact width aids in saving space on the PCB, allowing for a more efficient design in battery-powered and portable electronics.
Lower minimum supply voltage enhances energy efficiency and extends battery life in portable devices.
This length provides a balanced size for integration into various electronic devices while maintaining performance.
An industrial temperature grade ensures reliability in harsh conditions, making this product suitable for various industrial applications.
CMOS technology offers low power consumption and high-speed operation, crucial for modern electronic devices.
Ball terminal form provides a reliable connection and facilitates efficient soldering, enhancing assembly efficiency.
A maximum supply current of 40 mA indicates low power consumption, which is appropriate for battery-operated devices.
With over 2 million words of storage capacity, this IC can handle large data sets, suitable for comprehensive applications.
A memory width of 16 bits enhances data throughput, conducive for performance-sensitive applications.
A 0.8 mm terminal pitch allows for compact layouts while still ensuring reliable soldering and connection.
A coding of 2M words confirms high capacity, making this memory IC suitable for data-intensive applications.
The maximum supply voltage of 2.2 V fits well into low-power systems, essential for energy-efficient designs.
High memory density enables extensive data storage capability, ideal for complex applications requiring significant data processing.
Classifying it as a memory circuit highlights its essential function in storing and retrieving data for various applications.
Very low standby current ensures minimal power consumption when not in use, extending battery life in portable devices.
Fast access time of 120 ns enables quick data retrieval, enhancing overall system performance.
Other Function Memory ICs M36DR232B120ZA6T attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36DR232B120ZA6T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Texas Instruments
LM317T by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. Operating temperature ranges from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. With a max output current of 1.5A, this through-hole package regulator is ideal for power supply designs where adjustable voltage levels are needed.
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
NXP Semiconductors
LL4148
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Toshiba
ULN-2803A
Vishay Sprague
Vishay Sprague's ULN-2803A is an 8-bit peripheral driver with a max supply voltage of 3V. Featuring open-collector output characteristics, it offers built-in transient protections and operates b/w -20°C to 85°C. Ideal for applications requiring sink current flow direction, this rectangular-shaped driver has a terminal pitch of 2.54mm and turn-on/off time of 1us.
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
Temic Semiconductors
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
LM358D-T
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M36W216BI70ZA6
STMicroelectronics
M36W216BI70ZA6 from STMicroelectronics is a low-profile, asynchronous memory IC featuring 16Mbit density with FLASH+SRAM technology. It operates b/w -40 °C to 85 °C and requires a supply voltage of 2.7V to 3.3V. Ideal for industrial applications, it offers fast access times of 70ns.
M36W216B85ZA6
M36W216B85ZA6 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage and operates b/w -40 °C to 85 °C. It features a 1M x 16 organization and comes in a compact rectangular package. Ideal for industrial applications requiring reliable data storage.
TMS27PC32-25JL4
Other Memory ICs;
SN74AS870NT3
SN74AS870NT3 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With a rectangular plastic/epoxy body, it is commonly used in memory functions requiring dual terminal positions.
TACT2151-25FN
TACT2151-25FN by Texas Instruments is a 1Kx11 memory circuit IC with 11264-bit memory density. It features a max access time of 25ns and operates b/w 0°C to 70°C. This CMOS technology chip carrier package is ideal for applications requiring fast data retrieval in commercial-grade environments.
MR2A16AVMA35
Everspin Technologies
MR2A16AVMA35 by Everspin Technologies is a 256Kx16 memory IC with 35ns access time, operating at 3.3V. It features a low profile grid array package suitable for industrial applications requiring fast asynchronous operation and high memory density.
M36LLR8860T1ZAQT
M36LLR8860T1ZAQT by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
NMC27C16Q-55
NMC27C16Q-55 by Texas Instruments is a 2Kx8 OTP ROM memory IC with 16384-bit density. It operates at 5V, has a max access time of 550ns, and features 3-STATE output characteristics. This CMOS technology device is commonly used in applications requiring non-volatile memory storage.
TMX27C512-30
SN74S478N
SN74S478N by Texas Instruments is a 1Kx8 MEMORY CIRCUIT IC with 8192 bit memory density. It operates at 5V, has an access time of 70ns, and supports asynchronous mode. This RECTANGULAR package with PLASTIC/EPOXY body material is ideal for commercial applications requiring reliable memory storage.
M27C256B
Koa Speer Electronics
TMS27C32-2NL4
TMS27P32A30
TMS2758-JL0
TMS2758-JL0 by Texas Instruments is a 1Kx8 MOS memory IC with 8192-bit density and 450ns access time. It features 3-STATE output characteristics, operates b/w 0°C to 70°C, and has a rectangular ceramic package. Ideal for applications requiring common I/O type and commercial temperature grade.
M36W216B85ZA6T
M36W216B85ZA6T from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features a 1M x 16 organization and operates in temperatures ranging from -40 °C to 85 °C. Ideal for industrial applications, it offers reliable performance in compact designs.
47L16-E/ST
Microchip Technology
47L16-E/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for automotive applications due to its thin profile, wide temperature range (-40 to 125°C), and high memory density of 16384 bits.
M36P0R9060E0ZACF
M36P0R9060E0ZACF from STMicroelectronics is a synchronous memory IC featuring a mixed FLASH+PSRAM configuration with 32M words and a max access time of 70 ns. It operates at a nominal voltage of 1.8V, suitable for compact applications. Its thin profile and grid array design make it ideal for space-constrained devices.
TMS27C128-45J
MR0A08BCYS35R
MR0A08BCYS35R by Everspin Tech: 128KX8 memory IC with 1048576 bit density, operates at 3.3V, and has a max access time of 35 ns. Ideal for industrial applications requiring fast asynchronous memory operations in a compact small outline package.
XC17S30PD8I
Xilinx
XC17S30PD8I by Xilinx is a 247968-bit MEMORY CIRCUIT with 3-STATE output characteristics. Operating at 10 MHz clock frequency, it has an industrial temperature grade and synchronous mode. Commonly used in applications requiring reliable memory storage and retrieval within the industrial sector.
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M36DR232B120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M36DR232A100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns;
M36D0R6040T0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00011 Amp;
M36DR232B100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;
M36DR232A120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M36DR232A100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
M36D0R6040B0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36DR232A120ZA6
M36D0R6040T0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36DR232B100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
M36DR232A120ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8/2;
M36D0R6040T0ZAIT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANIZED AS 1M X 16;
M36DR232B120ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36D0R6040B0ZAIT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA67,8X12,32;
M36DR232A100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA66,8X12,32;
M36D0R6040B0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 4M;
M36D0R6040B0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 12 mm;
M36D0R6040T0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
M36DR232B100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Numonyx
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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