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M36D0R6040B0ZAIF

STMicroelectronics

M36D0R6040B0ZAIF by STMicroelectronics

M36D0R6040B0ZAIF by STMicroelectronics is a versatile memory IC featuring 4M words of mixed FLASH+PSRAM, operating at 1.8V with a max temp of 85 °C. Its asynchronous mode and compact grid array design make it ideal for space-constrained applications. With a fast access time of 70 ns, it's perfect for high-performance devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,384 parts In-Stock

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1,384

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Vyrian

USA . 1,358 parts In-Stock

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1,358

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Anansix

USA . 1,107 parts In-Stock

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1,107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 729 parts In-Stock

1+ parts

$4.212

100+ parts

-

1k+ parts

$3.791

10k+ parts

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729

$4.212

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$3.791

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MKK Technologies

India . 1,288 parts In-Stock

1+ parts

$7.920

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1,288

$7.920

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DigiPath Technology Company

USA . 1,288 parts In-Stock

1+ parts

$7.920

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1,288

$7.920

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Corphita

USA . 237 parts In-Stock

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237

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Parana Technologies

USA . 91 parts In-Stock

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$5.036

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91

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$5.036

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Overview

Unlock unparalleled performance with the M36D0R6040B0ZAIF memory IC from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality flash and PSRAM mixed memory provides exceptional reliability and efficiency for diverse applications, from automotive to industrial systems. With its compact design and low power consumption, it enhances your devices while ensuring longevity. Elevate your projects with trusted technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the IC reliable in various applications.

Surface Mount: YES

Surface mount technology enables compact design and ease of integration into modern electronic circuit boards.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, facilitating efficient layout and design.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access without the need for clock synchronization, enhancing performance.

Mixed Memory Type: FLASH+PSRAM

The combination of FLASH and PSRAM provides versatility, allowing for both persistent storage and fast access to volatile memory.

Nominal Supply Voltage / Vsup: 1.8

Operating at a low nominal voltage reduces power consumption, ideal for energy-efficient applications.

Power Supplies (V): 1.8

The requirement for a 1.8V power supply simplifies the design and is compatible with a wide range of modern processors.

No. of Terminals: 67

A higher number of terminals provides flexibility for diverse connectivity options in complex applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design aid in high-density applications, maximizing the available board space.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures reliability in demanding environments, making it suitable for industrial applications.

Organization: 4MX16

The 4M x 16 organization provides ample storage with efficient data handling capabilities for various applications.

Minimum Operating Temperature: -30 °C

This wide operating temperature range makes the product suitable for harsh environments and outdoor applications.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish enhances the solderability and ensures robust connections on the PCB.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better thermal management and compact designs in multi-layer PCBs.

Maximum Seated Height: 1.2 mm

A low seated height enables better stackability and integration in space-constrained applications.

Width: 8 mm

An 8 mm width contributes to the compactness of the design, ideal for portable devices and systems.

Minimum Supply Voltage (Vsup): 1.7 V

A low minimum supply voltage ensures compatibility with a range of battery-operated devices.

Length: 12 mm

With a length of 12 mm, the IC is appropriately sized for integration into small form-factor devices.

Technology: CMOS

CMOS technology allows for low power consumption and high density, making it suitable for modern electronic applications.

Terminal Form: BALL

Ball-shaped terminals enhance reliability and ease of soldering during the assembly process.

Maximum Supply Current: 26 mA

The current specification allows for efficient power use, making the product suitable for low-power applications.

No. of Words: 4194304 words

A substantial word count indicates considerable data storage capabilities, supporting various applications.

Memory Width: 16

A 16-bit memory width enhances data transfer efficiency, improving overall system performance.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch supports high-density PCB designs while ensuring manufacturability.

No. of Words Code: 4M

The 4M word coding reflects the memory capacity, suitable for applications requiring significant data storage.

Maximum Supply Voltage (Vsup): 1.95 V

A maximum supply voltage of 1.95V allows compatibility with various circuit designs in modern electronics.

Memory Density: 67108864 bit

High memory density supports complex applications and large data processing requirements.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, it is optimized for storage applications, enhancing performance.

Maximum Standby Current: 0.00011 Amp

Very low standby current improves energy efficiency, extending battery life in portable devices.

Maximum Access Time: 70 ns

A maximum access time of 70 ns ensures fast data retrieval, critical for high-performance applications.

Technical Specifications

Other Function Memory ICs M36D0R6040B0ZAIF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

PSRAM IS ORGANIZED AS 1M X 16

JESD-30 Code:

R-PBGA-B67

JESD-609 Code:

e1

Length:

12 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+PSRAM

No. of Functions:

1

No. of Terminals:

67

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA67,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00011 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36D0R6040B0ZAIF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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