Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36DR232A120ZA6 from STMicroelectronics is a low-profile, asynchronous mixed memory IC featuring 2M words of FLASH+SRAM. It operates b/w -40 °C to 85°C with a supply voltage range of 1.65V to 2.2V and boasts a max access time of 120 ns, ideal for industrial applications. Its compact design (8mm x 12mm) ensures efficient space utilization in electronic devices.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Anansix
Digiode
IDEA Electronic Components Group
$4.731
$4.258
MKK Technologies
$8.896
DigiPath Technology Company
Corphita
Parana Technologies
$5.656
The use of plastic/epoxy ensures durability and resistance to environmental factors, making the memory IC suitable for various applications.
Surface mount capabilities allow for efficient use of PCB space, facilitating compact designs and reducing overall product size.
A rectangular shape provides a standard footprint that is compatible with a variety of circuit board layouts, ensuring flexibility in design.
Asynchronous operation allows for quicker access to data since operations aren't tied to a clock cycle, enhancing system responsiveness.
Combining FLASH and SRAM offers the benefits of non-volatile memory alongside fast access times, suitable for diverse application needs.
Low power supply requirements enhance energy efficiency, making this memory IC ideal for battery-powered devices.
A higher number of terminals allows for more data inputs/outputs, increasing versatility in connectivity options for complex applications.
This package style supports high-density mounting, suitable for modern electronics where space is at a premium.
Operating at higher temperatures ensures reliability in industrial and harsh environment applications.
This organization supports 2 megawords of data, suitable for applications requiring a considerable amount of memory.
This wide temperature range guarantees reliable performance in extreme conditions, appealing to industrial users.
Tin-lead finishing offers good solderability and corrosion resistance, providing reliable connections over time.
Bottom terminal positioning allows for a more compact design and better thermal performance in high-density applications.
A low profile reduces the overall height of devices, making it suitable for slim product designs.
Compact width supports space-saving designs, suitable for modern electronics where dimensions are critical.
Low minimum supply voltage enhances compatibility with low-power operations, making it ideal for battery-operated devices.
The length contributes to a compact form factor, which is desired in space-constrained applications.
Designed for industrial use, ensuring dependable operation in demanding environments.
CMOS technology provides high-speed processing and low power consumption, ideal for power-sensitive applications.
Ball terminal form allows for reliable connections in high-density packaging, improving assembly yield.
Higher current handling capabilities allow this memory IC to perform well under load, suited for demanding applications.
With over 2 million words, this memory IC provides substantial storage for applications needing significant data capacity.
A 16-bit wide memory interface enhances data throughput, making it suitable for high-performance applications.
Narrow terminal pitch enables higher packing density on PCBs, supporting more compact design layouts.
The capacity of 2M words caters to various applications, ensuring sufficient memory resource for diverse tasks.
A maximum supply voltage of 2.2V ensures compatibility with multiple power configurations, enhancing design flexibility.
With a high memory density, this IC is capable of storing large amounts of data, making it ideal for data-intensive applications.
Classified as a memory circuit, this IC excels in data retention and quick access, reinforcing its role in a variety of electronic devices.
Very low standby current enhances energy efficiency, making this IC suitable for low-power applications and battery extensions.
A maximum access time of 120 ns ensures quick data retrieval, enhancing the overall system performance.
Other Function Memory ICs M36DR232A120ZA6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36DR232A120ZA6 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
C1206C104M5RACTU
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
EU2B-YS3103F
Idec
ROTARY SWITCH;
BAV99
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
Bytesonic Electronics
TMS27PC291-50J
Texas Instruments
Other Memory ICs;
M36LLR8860D1ZAQE
STMicroelectronics
M36LLR8860D1ZAQE by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM. It operates at 1.8V with a max temp of 85 °C and includes 88 terminals in a compact grid array package. Ideal for high-performance applications requiring efficient data storage.
TMS4023NC
TMS4023NC by Texas Instruments is a 1KX1 MOS memory IC with 1024-bit density and 32 refresh cycles. It features 3-STATE output characteristics, operates b/w -25 to 70 °C, and has a rectangular PLASTIC/EPOXY package. Commonly used in applications requiring high-speed data storage with a terminal pitch of 2.54 mm.
27C64
Thomson-csf Compsants Specific
M36LLR8860B1ZAQE
M36LLR8860B1ZAQE by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C, ideal for compact electronic applications. With an 88-terminal grid array design, it ensures efficient space utilization in advanced devices.
TMS27PC64-120N
TMS27C49-45TL
DC1920-F3
Analog Devices
DC1920-F3 by Analog Devices is a CMOS MEMORY CIRCUIT with METAL body, ROUND shape, and DISK BUTTON style. It operates b/w -55 °C to 100°C, has 2 terminals with TIN LEAD finish. Ideal for applications requiring Other Function Memory ICs in surface mount configurations.
SNJ54ALS871JD
SNJ54ALS871JD by Texas Instruments is a MILITARY-grade TTL IC with 24 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for harsh environments. This IC is commonly used in applications requiring high reliability and performance under extreme temperature conditions.
TMS2716-30JL
TMS2716-30JL by Texas Instruments is a 2KX8 memory IC with 16384-bit density and 300 ns access time. It features 3-STATE output characteristics, operates b/w 0 to 70 °C, and has a RECTANGULAR CERAMIC package style. Ideal for commercial applications requiring fast data retrieval in a compact IN-LINE package.
S27KL0641DABHI020
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
TMS27P32N25
TMS27PC240-12FLN
TMS2564-45JDL
TMS2564-45JDL by Texas Instruments is an 8KX8 MOS memory IC with 65536 bit density and 450 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a DUAL terminal position. Ideal for applications requiring fast data retrieval in commercial temperature environments.
WSF512K16-39H2I
White Microelectronics
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Shape: SQUARE; Memory Density: 8388608 bit; Technology: CMOS;
DS1993L-F5-C01
MEMORY CIRCUIT;
TMS27C32-15NE4
M36W0R6030B0ZAQT
M36W0R6030B0ZAQT from STMicroelectronics is a versatile memory IC featuring 4M x 16 mixed FLASH+SRAM technology. It operates asynchronously with a supply voltage range of 1.7-1.95V and supports industrial applications at temperatures from -40 °C to 85 °C. With a compact design (8x10mm) and low power consumption, it's ideal for space-constrained environments.
5962-01-218-1995
The Texas Instruments 5962-01-218-1995 is a MOS memory circuit IC with 24 terminals in an in-line rectangular package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage and retrieval. The through-hole terminals spaced at 2.54mm pitch ensure secure connections in electronic devices.
TMX27C512-30
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36DR232B120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M36DR232A100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns;
M36D0R6040T0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00011 Amp;
M36DR232B100ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;
M36DR232A120ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M36DR232A100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
M36DR232B120ZA6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8/2;
M36D0R6040B0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36D0R6040T0ZAIE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36DR232B100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
M36DR232A120ZA6T
M36D0R6040T0ZAIT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANIZED AS 1M X 16;
M36DR232B120ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36D0R6040B0ZAIT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA67,8X12,32;
M36DR232A100ZA6C
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA66,8X12,32;
M36D0R6040B0ZAI
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 4M;
M36D0R6040B0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 12 mm;
M36D0R6040T0ZAIF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 67; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
M36DR232B100ZA6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Numonyx
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Words: 2097152 words;
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