Loading...

M36D0R6040T0ZAIF

STMicroelectronics

M36D0R6040T0ZAIF by STMicroelectronics

M36D0R6040T0ZAIF by STMicroelectronics is a versatile memory IC featuring 4M words of mixed FLASH+PSRAM, operating at 1.8V with a max temp of 85 °C. Its asynchronous mode and thin profile make it ideal for compact applications. With a fast access time of 70 ns, it's perfect for high-performance devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,428

-

-

-

-

Vyrian

USA . 1,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,829

-

-

-

-

Anansix

USA . 196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

196

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,759 parts In-Stock

1+ parts

$2.418

100+ parts

-

1k+ parts

$2.176

10k+ parts

-

1,759

$2.418

-

$2.176

-

MKK Technologies

India . 1,752 parts In-Stock

1+ parts

$4.546

100+ parts

-

1k+ parts

-

10k+ parts

-

1,752

$4.546

-

-

-

DigiPath Technology Company

USA . 1,752 parts In-Stock

1+ parts

$4.546

100+ parts

-

1k+ parts

-

10k+ parts

-

1,752

$4.546

-

-

-

Corphita

USA . 2,806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,806

-

-

-

-

Parana Technologies

USA . 207 parts In-Stock

1+ parts

-

100+ parts

$2.891

1k+ parts

-

10k+ parts

-

207

-

$2.891

-

-

Overview

Unlock the future of memory solutions with the M36D0R6040T0ZAIF from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers an exceptional blend of FLASH and PSRAM technologies that empower your devices with speed and reliability. Ideal for a wide range of applications—from consumer electronics to industrial systems—this advanced memory IC ensures efficient performance in demanding environments, providing customers unparalleled value and peace of mind. Experience excellence today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, suitable for various environments.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and easier integration into modern electronic designs.

Package Shape: RECTANGULAR

The rectangular shape enables better layout flexibility on circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for quicker access times, improving overall system performance.

Mixed Memory Type: FLASH+PSRAM

Combining FLASH and PSRAM offers a versatile solution for applications requiring both non-volatile storage and DRAM.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage supports energy-efficient designs, ideal for battery-powered applications.

Power Supplies (V): 1.8

Consistent operating power at 1.8V reduces complexity in power supply design and extends battery life.

No. of Terminals: 67

A higher number of terminals provides greater connectivity options, enhancing the device's integration capabilities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Thin profile and fine pitch allow for compact designs while maintaining performance, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Operating at high temperatures improves reliability in demanding conditions, making it suitable for industrial applications.

Organization: 4MX16

Efficient memory organization supports faster data access and improved performance in data-intensive applications.

Minimum Operating Temperature: -30 °C

Wide temperature range makes this memory IC fit for low-temperature environments, such as outdoor or automotive applications.

Terminal Finish: TIN SILVER COPPER

Durable terminal finish enhances conductivity and long-term reliability in electronic connections.

Terminal Position: BOTTOM

Bottom terminal position allows for streamlined integration in products, optimizing space on the circuit board.

Maximum Seated Height: 1.2 mm

Low seated height enables the design of slim electronic devices without compromising on performance.

Width: 8 mm

Compact width facilitates space-saving designs while maintaining effective performance.

Minimum Supply Voltage (Vsup): 1.7 V

Minimum supply voltage flexibility allows for a wider range of applications, accommodating diverse power sources.

Length: 12 mm

Short length supports effective routing on PCBs, making it easier to incorporate in diverse designs.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed access, ideal for modern applications.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and improves thermal performance during operation.

Maximum Supply Current: 26 mA

Low maximum supply current prevents overheating and contributes to energy efficiency in the overall system.

No. of Words: 4194304 words

Ample memory words allow for substantial data storage, making it suitable for complex applications.

Memory Width: 16

A memory width of 16 bits supports efficient data processing, enhancing performance in critical tasks.

Terminal Pitch: 0.8 mm

Narrow terminal pitch optimizes board space, enabling more components to fit in the same area.

No. of Words Code: 4M

4M words code signifies effective data handling capability, supporting large-scale applications.

Maximum Supply Voltage (Vsup): 1.95 V

A maximum supply voltage of 1.95V adds flexibility in power design, allowing for compatibility with various circuits.

Memory Density: 67108864 bit

High memory density ensures extensive storage capabilities, making it ideal for data-heavy applications.

Memory IC Type: MEMORY CIRCUIT

Classified as a memory circuit, this IC is designed for reliable data storage solutions in a variety of applications.

Maximum Standby Current: 0.00011 Amp

Extremely low standby current minimizes power loss when not in use, enhancing energy efficiency.

Maximum Access Time: 70 ns

Fast access time of 70ns supports high-speed applications, ensuring efficient data retrieval and processing.

Technical Specifications

Other Function Memory ICs M36D0R6040T0ZAIF attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

PSRAM IS ORGANIZED AS 1M X 16

JESD-30 Code:

R-PBGA-B67

JESD-609 Code:

e1

Length:

12 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Mixed Memory Type:

FLASH+PSRAM

No. of Functions:

1

No. of Terminals:

67

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA67,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00011 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

M36D0R6040T0ZAIF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20