Loading...

MT9P401I12STC-DR

Onsemi

MT9P401I12STC-DR by Onsemi

The Onsemi MT9P401I12STC-DR image sensor features 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging such as surveillance cameras, industrial inspection systems, and medical devices.

Median Price

$27.400

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,233 parts In-Stock

1+ parts

$27.400

100+ parts

$26.850

1k+ parts

$26.300

10k+ parts

-

2,233

$27.400

$26.850

$26.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,431 parts In-Stock

1+ parts

$26.030

100+ parts

-

1k+ parts

-

10k+ parts

-

2,431

$26.030

-

-

-

Vyrian

USA . 3,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,794

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$9.020

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$9.020

-

-

-

Corphita

USA . 1,817 parts In-Stock

1+ parts

$24.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,817

$24.660

-

-

-

Corohmni

South Africa . 450 parts In-Stock

1+ parts

$27.400

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$27.400

-

-

-

Problanco Electronics

Mexico . 8,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,200

-

-

-

-

Kulean Microsystems

USA . 7,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,214

-

-

-

-

SupplyDigital Components

Austria . 6,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,619

-

-

-

-

TANS Electronics

Latvia . 5,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,208

-

-

-

-

UHIMA Technologies

Türkiye . 385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

385

-

-

-

-

Perfect Parts

USA . 224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

224

-

-

-

-

Overview

Capture every moment with the high-quality MT9P401I12STC-DR image sensor by Onsemi. As a leader in the industry, Onsemi delivers cutting-edge technology that guarantees superior performance and reliability. Perfect for a wide range of applications, this image sensor offers unparalleled value and benefits to customers seeking top-notch imaging solutions. Experience crystal-clear images and seamless functionality with the MT9P401I12STC-DR, setting a new standard in image sensor excellence.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Smaller pixel size allows for higher resolution images with more detail and clarity.

Maximum Supply Voltage: 1.9 V

Low maximum supply voltage helps in reducing power consumption and improving efficiency.

Master Clock: 96 MHz

High master clock speed enables fast data transfer and processing for capturing quick moving objects.

Body Width: 10 inch

Compact body width makes it suitable for use in space-constrained devices or applications.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensor type offers high image quality, low noise, and low power consumption.

Body Height: 1.25 mm

Slim body height allows for easy integration into thin devices or equipment.

Package Shape or Style: SQUARE

Square package shape provides uniform mounting and alignment, simplifying the assembly process.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures stable operation even in low power scenarios.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environments without risk of damage.

Horizontal Pixel: 2592

High horizontal pixel count results in detailed and sharp images with high resolution.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures functionality in cold or harsh conditions.

Maximum Operating Current: 80 mA

Low operating current consumption helps in extending battery life in portable devices.

Dynamic Range: 70.1 dB

Wide dynamic range allows for capturing both bright and dark areas in an image with optimal exposure.

Vertical Pixel: 1944

High vertical pixel count contributes to the overall image quality and sharpness.

Body Length/Diameter: 10 mm

Compact body length or diameter makes it suitable for small form factor applications or devices.

Optical Format (inch): 1/2.5

Optical format size is compatible with various lenses and optics, offering flexibility in system design.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connection during assembly or installation.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface offers compatibility with standard communication protocols for seamless integration.

Frame Rate: 15 fps

Decent frame rate allows for smooth video recording or capturing of moving objects without blurring.

Array Type: FRAME

Frame array type enables efficient image capture and processing for various applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies the installation process and ensures secure attachment.

Technical Specifications

Image Sensors MT9P401I12STC-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT 2.60-3.10 V ANALOG SUPPLY VOLATGE

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

70.1 dB

Frame Rate:

15 fps

Horizontal Pixel:

2592

Master Clock:

96 MHz

Mounting Feature:

Maximum Operating Current:

80 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20