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ASX342ATSC00XPED0-TR

Onsemi

ASX342ATSC00XPED0-TR by Onsemi

ASX342ATSC00XPED0-TR by Onsemi is an image sensor with 5.6x5.6 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates b/w -40 to 105 °C and has a dynamic range of 87 dB. Ideal for applications requiring high-resolution imaging at a fast frame rate such as surveillance cameras or industrial machine vision systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,439 parts In-Stock

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Digiode

USA . 332 parts In-Stock

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Native Components

USA . 788 parts In-Stock

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$1.000

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Northwest PG Solutions

USA . 756 parts In-Stock

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$1.101

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AZTECH Wire

Italy . 771 parts In-Stock

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$19.860

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Kulean Microsystems

USA . 5,897 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,741 parts In-Stock

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TANS Electronics

Latvia . 3,056 parts In-Stock

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Corphita

USA . 1,400 parts In-Stock

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Problanco Electronics

Mexico . 990 parts In-Stock

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UHIMA Technologies

Türkiye . 880 parts In-Stock

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Corohmni

South Africa . 263 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the ASX342ATSC00XPED0-TR Image Sensor by Onsemi. Designed with precision and quality in mind, this sensor offers unparalleled performance and reliability for a wide range of applications. From security cameras to medical imaging devices, this product delivers crisp and clear images with a dynamic range of 87 dB. With a compact design and easy integration, the ASX342ATSC00XPED0-TR is the perfect solution for your imaging needs. Experience the difference that Onsemi can make in your next project.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

Small pixel size allows for detailed and high-resolution image capture.

Maximum Supply Voltage: 1.95 V

Higher supply voltage ensures stable and efficient operation of the image sensor.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and efficient performance.

Body Width: 7.5 inch

Compact body width makes the sensor easy to integrate into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS type sensor offers low power consumption and high sensitivity for accurate image capturing.

Body Height: 1.28 mm

Low body height allows for slim and compact design integration in electronic devices.

Package Shape or Style: SQUARE

Square package shape provides ease of mounting and secure placement within devices.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in energy efficiency and extends battery life of devices.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures the sensor can function in various environmental conditions.

Horizontal Pixel: 728

High horizontal pixel count allows for wider image capture and detailed scenes.

Output Range: 0.84-1.96V

Digital voltage output range provides flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital devices.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures functionality even in extreme cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish material for long-lasting and reliable connections.

Maximum Operating Current: 50 mA

Low operating current for energy efficiency and minimal power consumption.

Housing: PLASTIC

Durable plastic housing provides lightweight and cost-effective protection to the sensor.

Dynamic Range: 87 dB

High dynamic range ensures accurate representation of both bright and dark areas in images.

Vertical Pixel: 560

Vertical pixel count for capturing detailed and clear images in various orientations.

Body Length/Diameter: 7.5 mm

Compact body length/diameter for easy integration and placement in devices.

Optical Format (inch): 1/4

Standard optical format for compatibility with existing camera systems and lenses.

Data Rate: 27 Mbps

High data rate enables fast transfer of image data for real-time processing and display.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections for the sensor.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface for easy communication and control integration with external devices.

Frame Rate: 60 fps

High frame rate for smooth and fluid video capture without motion blur.

Array Type: FRAME

Frame array type offers efficient and organized pixel arrangement for image capture.

Mounting Feature: SURFACE MOUNT

Surface mount feature for easy and secure installation on PCBs or devices.

Technical Specifications

Image Sensors ASX342ATSC00XPED0-TR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG VOLTAGE FROM 2.66 TO 2.94V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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