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AR0144CSSM00SUKA0-CPBR2

Onsemi

AR0144CSSM00SUKA0-CPBR2 by Onsemi

The Onsemi AR0144CSSM00SUKA0-CPBR2 is a 1/4 inch CMOS image sensor with 1280x800 resolution. It features a 2-WIRE INTERFACE output and is ideal for surface mount applications in various imaging systems. Measuring 5.545" x 0.77mm x 5.565mm, this rectangular sensor offers high-quality image capture capabilities.

Median Price

$13.975

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

AR0144CSSM00SUKA0-CPBR2 by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$15.100

1k+ parts

$14.580

10k+ parts

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50

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$15.100

$14.580

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Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$12.850

1k+ parts

$11.500

10k+ parts

$10.820

6

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$12.850

$11.500

$10.820

Distributors (In-Stock)

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Digiode

USA . 335 parts In-Stock

1+ parts

$13.566

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335

$13.566

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Vyrian

USA . 2,166 parts In-Stock

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Flip Electronics

USA . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 1,020 parts In-Stock

1+ parts

$12.840

100+ parts

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$12.840

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Corphita

USA . 2,177 parts In-Stock

1+ parts

$12.852

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2,177

$12.852

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Corohmni

South Africa . 411 parts In-Stock

1+ parts

$14.280

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411

$14.280

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 4,579 parts In-Stock

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Problanco Electronics

Mexico . 2,917 parts In-Stock

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2,917

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TANS Electronics

Latvia . 2,697 parts In-Stock

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UHIMA Technologies

Türkiye . 916 parts In-Stock

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916

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Native Components

USA . 387 parts In-Stock

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SupplyDigital Components

Austria . 145 parts In-Stock

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Northwest PG Solutions

USA . 63 parts In-Stock

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Overview

Elevate your imaging projects with the AR0144CSSM00SUKA0-CPBR2 by Onsemi. As a trusted manufacturer of cutting-edge image sensors, Onsemi delivers superior quality and reliability. This image sensor boasts a high-resolution CMOS technology, perfect for applications in automotive, surveillance, and consumer electronics. With its compact design, advanced features, and seamless integration, this sensor offers unparalleled value and performance. Upgrade your projects today with the AR0144CSSM00SUKA0-CPBR2 and experience the difference.

Feature Benefit Bullets

Body Width: 5.545 inch

The compact size of the body width makes this image sensor easily applicable in various devices with space constraints.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors provide high-quality images with low power consumption, making this product energy-efficient and effective for image capturing.

Body Height: 0.77 mm

The slim body height allows for a sleek design and integration into thin devices without adding bulk.

Package Shape or Style: RECTANGULAR

The rectangular package shape enables easy mounting and alignment within devices, ensuring proper functionality.

Horizontal Pixel: 1280

The high horizontal pixel count results in detailed and sharp images, suitable for various applications requiring high-resolution image capture.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finishes such as tin, silver, and copper ensures durability and reliable connections for optimal performance.

Vertical Pixel: 800

The vertical pixel count contributes to the overall image quality and clarity, meeting the requirements of different imaging tasks.

Body Length/Diameter: 5.565 mm

The compact body length/diameter allows for easy integration and placement within devices, maintaining a streamlined design.

Optical Format (inch): 1/4

The 1/4 inch optical format offers a standard size for compatibility with a wide range of lenses and imaging systems, ensuring versatility.

Termination Type: SOLDER

The solder termination type provides a secure connection, enhancing the durability and reliability of the image sensor during operation.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the communication between the image sensor and other components, facilitating integration and ease of use.

Array Type: SINGLE FRAME

The single frame array type offers straightforward image capture and processing, suitable for applications requiring simple imaging functionality.

Mounting Feature: SURFACE MOUNT

The surface mounting feature enables easy installation onto PCBs, saving space and simplifying the assembly process for manufacturers.

Technical Specifications

Image Sensors AR0144CSSM00SUKA0-CPBR2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

SINGLE FRAME

Body Width:

5.545 inch

Body Height:

.77 mm

Body Length/Diameter:

5.565 mm

Horizontal Pixel:

1280

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

800

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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