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AR0143ATSC00XUEA0-TPBR

Onsemi

AR0143ATSC00XUEA0-TPBR by Onsemi

Onsemi's AR0143ATSC00XUEA0-TPBR is a 1/4 inch CMOS image sensor with 1344x968 pixels, offering 30 fps frame rate. Ideal for surface mount applications, it features a 2-wire interface and tin/silver/copper terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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1k+

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Vyrian

USA . 7,792 parts In-Stock

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Digiode

USA . 1,027 parts In-Stock

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Native Components

USA . 44 parts In-Stock

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$1.570

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Northwest PG Solutions

USA . 976 parts In-Stock

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$1.727

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AZTECH Wire

Italy . 49 parts In-Stock

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$16.630

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TANS Electronics

Latvia . 7,996 parts In-Stock

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SupplyDigital Components

Austria . 3,968 parts In-Stock

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Kulean Microsystems

USA . 1,931 parts In-Stock

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Kepictronics

USA . 912 parts In-Stock

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Problanco Electronics

Mexico . 734 parts In-Stock

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UHIMA Technologies

Türkiye . 477 parts In-Stock

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Corohmni

South Africa . 177 parts In-Stock

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Corphita

USA . 161 parts In-Stock

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Overview

Capture every detail with the AR0143ATSC00XUEA0-TPBR image sensor by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology that guarantees top-notch performance in a variety of applications. This CMOS image sensor offers exceptional value with its high resolution and fast frame rate, ensuring crisp and clear images every time. Whether you're in automotive, surveillance, or consumer electronics, this sensor is the perfect choice for capturing stunning visuals with ease. Elevate your projects to new heights with the AR0143ATSC00XUEA0-TPBR and experience the difference today.

Feature Benefit Bullets

Body Width: 9 inch

The compact size of 9 inches makes it easy to integrate into various devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption, making them ideal for portable devices.

Body Height: 1.55 mm

The slim profile of 1.55mm allows for sleek designs in electronic devices.

Package Shape or Style: SQUARE

Square package shape provides easy integration and alignment within devices.

Horizontal Pixel: 1344

High horizontal pixel count enables detailed image capture.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Various terminal finish options provide flexibility for different assembly processes.

Vertical Pixel: 968

High vertical pixel count contributes to producing high-resolution images.

Body Length/Diameter: 9 mm

The small body length of 9mm enhances the overall compactness of the product.

Optical Format (inch): 1/4

1/4 inch optical format provides a good balance between image quality and sensor size.

Termination Type: SOLDER

Solder termination offers a reliable and durable connection for the sensor.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connectivity setup for the sensor.

Frame Rate: 30 fps

High frame rate of 30 fps allows for smooth video recording and real-time imaging.

Array Type: FRAME

Frame array type provides efficient image capture and processing capabilities.

Mounting Feature: SURFACE MOUNT

Surface mounting feature offers easy and secure installation of the sensor on PCBs.

Technical Specifications

Image Sensors AR0143ATSC00XUEA0-TPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

Frame Rate:

30 fps

Horizontal Pixel:

1344

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

968

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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