Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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CRX14-MQP/1GE
STMicroelectronics
CRX14-MQP/1GE by STMicroelectronics is a 16-terminal IC with 5V supply, operating b/w -20 to 85 °C. It features CMOS technology, GULL WING terminals, and supports telecom circuits. The package is small outline, surface-mountable in plastic/epoxy material for telecom interface applications.
R-PDSO-G16
e4
3
16
85 Cel
-20 Cel
PLASTIC/EPOXY
SOP
SOP16,.25
RECTANGULAR
SMALL OUTLINE
260
5
Not Qualified
Other Telecom ICs
20 mA
5 V
YES
CMOS
TELECOM CIRCUIT
OTHER
NICKEL PALLADIUM GOLD
GULL WING
1.27 mm
DUAL
30
PN5120A0HN/C1,551
NXP Semiconductors
PN5120A0HN/C1,551 by NXP Semiconductors is a versatile telecom interface IC with a 40-terminal chip carrier design. It operates at power supplies of 1.8/3.3V and supports temperatures from -30 °C to 85 °C, making it ideal for various applications in communication systems. Its surface mount and no-lead features enhance integration in compact devices.
S-PQCC-N40
40
-30 Cel
QCCN
LCC40,.24SQ,20
SQUARE
CHIP CARRIER
1.8/3.3,2.5/3.3
NO LEAD
.5 mm
QUAD
PN5120A0HN/C1,557
PN5120A0HN/C1,557 by NXP Semiconductors is a versatile telecom interface IC with a 40-terminal chip carrier design. It operates at power supplies of 1.8/3.3V and withstands temperatures from -30 °C to 85 °C, making it ideal for robust applications in communication systems. Its surface mount and no-lead features enhance integration in compact devices.
PN5120A0HN/C2,518
PN5120A0HN/C2,518 by NXP Semiconductors is a 40-terminal IC with power supplies of 1.8/3.3V and 2.5/3.3V, operating b/w -30 to 85°C. It features a no-lead terminal form, nickel palladium gold finish, and is ideal for telecom interface applications due to its square package shape and moisture sensitivity level of 3.
PN5120A0HN/C2,551
PN5120A0HN/C2,551 by NXP Semiconductors is a 40-terminal IC with power supplies of 1.8/3.3V and 2.5/3.3V, operating b/w -30 to 85°C. Its no-lead terminal finish and quad position make it ideal for telecom interface applications requiring a moisture sensitivity level of 3 MSL.
PN512AA0HN1/C2,551
PN512AA0HN1/C2,551 by NXP Semiconductors is a versatile telecom interface IC with a quad terminal layout and operates b/w -30 °C to 85 °C. It supports power supplies of 1.8/3.3V and has a max supply current of 100mA. Ideal for automotive applications, it meets AEC-Q100 standards.
S-PQCC-N32
32
LCC32,.2SQ,20
AEC-Q100
100 mA
PRH601HL/C1,557
PRH601HL/C1,557 by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at 3.3V and 5V with a max temp of 70 °C, featuring a compact flatpack design with 100 terminals. Ideal for communication systems requiring reliable performance in varying conditions.
S-PQFP-G100
100
70 Cel
-25 Cel
QFP
QFP100,.63SQ,20
FLATPACK
3.3,5
HT1ICS3002W/V6F,00
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Equivalence Code: WAFER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 85 Cel;
WAFER
LA72910V-MPB-H
Onsemi
LA72910V-MPB-H by Onsemi is a 16-terminal IC with 5V supply voltage, operating b/w -30 to 70 °C. It features Gull Wing terminals, PLASTIC/EPOXY body material, and is surface mountable. Ideal for telecom interfaces due to its small outline package style and dual terminal position.
e6
SSOP
SSOP16,.25
SMALL OUTLINE, SHRINK PITCH
TIN BISMUTH
.635 mm
LA72910V-TLM-H
LA72910V-TLM-H by Onsemi is a 16-terminal IC with 5V supply voltage, operating from -30 to 70°C. It features Gull Wing terminals, PLASTIC/EPOXY body material, and is surface mountable. Ideal for telecom interfaces due to its small outline package style and dual terminal position.
LA72912V-MPB-H
LA72912V-MPB-H by Onsemi is a 24-terminal IC with 5V supply voltage, operating b/w -30 to 70°C. It features Gull Wing terminals, BIPOLAR technology, and a small outline package shape. Ideal for telecom interfaces due to its low supply current and high reflow temperature of 260°C.
R-PDSO-G24
24
SSOP24,.3
.032 mA
BIPOLAR
PN5120A0ET/C2J
PN5120A0ET/C2J by NXP Semiconductors is a telecom interface IC with 64 terminals in a square package. Operating at -30 to 85°C, it requires 3/3.3V power supply and has a peak reflow temp of 260°C. Ideal for applications requiring fine pitch grid array style packages.
S-PBGA-B64
1
64
FBGA
BGA64,8X8,25
GRID ARRAY, FINE PITCH
3/3.3
BALL
BOTTOM
PN5120A0ET/C2EL
PN5120A0ET/C2EL by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at 3/3.3V with a max current of 100mA and supports temperatures from -30 °C to 85 °C. Ideal for compact, high-performance electronic devices.
PN5120A0ET/C2QL
NXP Semiconductors' PN5120A0ET/C2QL is a telecom interface IC with 64 terminals, operating at temperatures from -30 to 85°C. It has a power supply of 3/3.3V and peak reflow temperature of 260°C. This square-shaped IC in plastic/epoxy package is ideal for applications requiring fine pitch grid array style components.
BQ51011YFFR
Texas Instruments
BQ51011YFFR by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from 0 to 125°C. It features TIN SILVER COPPER finish, 0.4mm pitch, and 5V supply voltage. Ideal for TELECOM CIRCUITS due to its compact size and fine pitch design.
R-XBGA-B28
e1
2.76 mm
28
125 Cel
0 Cel
UNSPECIFIED
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.625 mm
TIN SILVER COPPER
.4 mm
1.56 mm
BQ51013YFFT
BQ51013YFFT by Texas Instruments is a Telecom Interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with peak reflow temperature of 260°C. With a nominal voltage of 5V, it is ideal for telecom circuit applications.
ACPM-5001-TR1
Broadcom
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: HTSON; Package Shape: SQUARE;
S-PDSO-N10
3 mm
10
HTSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
3.4 V
.6 mm
AMIS49587C5871G
AMIS49587C5871G by Onsemi is a 28-terminal telecom IC with 3.3V supply, operating b/w -40 to 80 °C. It features J BEND terminals, PLASTIC/EPOXY body, and is surface mountable in a square chip carrier package. Ideal for telecom circuits requiring low power consumption and compact design.
S-PQCC-J28
e3
11.506 mm
80 Cel
-40 Cel
QCCJ
LDCC28,.5SQ
3.3
4.572 mm
Modems
.08 mA
3.3 V
TIN
J BEND
AMIS49587C5872G
AMIS49587C5872G by Onsemi is a 52-terminal telecom IC with 3.3V supply, operating from -40 to 80 °C. It features a square chip carrier package style and 0.5mm terminal pitch, suitable for telecom circuit applications requiring low power consumption at a max current of 0.08mA.
S-XQCC-N52
8 mm
52
HVQCCN
LCC52,.31SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
NOT SPECIFIED
1 mm
AMIS49587C5872RG
AMIS49587C5872RG by Onsemi is a 52-terminal telecom IC with 3.3V supply, operating from -40 to 80 °C. It features a square chip carrier package style and 0.5mm terminal pitch, suitable for telecom circuit applications requiring low power consumption at a max seated height of 1mm.
AFEM-S102-BLKG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 13; Package Code: VQCCN; Package Shape: SQUARE;
S-XQCC-N13
2.2 mm
13
VQCCN
CHIP CARRIER, VERY THIN PROFILE
.65 mm
AFEM-S102-TR1G
MFRC53001T/0FE,112
NXP Semiconductors' MFRC53001T/0FE,112 is a telecom IC with 32 terminals in a small outline package. Operating b/w -25°C to 85°C, it has a nominal voltage of 5V and terminal pitch of 1.27mm. Ideal for telecom circuits, this IC is surface mountable and features gull wing terminals.
R-PDSO-G32
20.5 mm
250
2.65 mm
7.5 mm
BQ51013AYFPR
BQ51013AYFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.
.002 Mbps
R-PBGA-B28
Tin/Silver/Copper (Sn/Ag/Cu)
1.88 mm
BQ51013AYFPT
BQ51013AYFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.
RI-I02-112A-03
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Maximum Operating Temperature: 70 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
AFEM-S106-BLKG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Code: HBCC; Package Shape: SQUARE;
S-XBCC-B14
3.2 mm
14
HBCC
CHIP CARRIER, HEAT SINK/SLUG
BUTT
AFEM-S106-TR1G
SKY16406-381LF
Skyworks Solutions
SKY16406-381LF by Skyworks Solutions is a telecom IC with 6 terminals in a small outline package. Operating temperature ranges from -55°C to 105°C, making it suitable for telecom circuit applications. The package body material is plastic/epoxy, and it has a terminal pitch of 0.5mm.
R-PDSO-N6
2 mm
6
105 Cel
-55 Cel
HVSON
.8 mm
1.5 mm
TCP-3012H-QT
TCP-3012H-QT by Onsemi is a small outline, very thin profile telecom IC with 6 terminals. It operates b/w -30 °C to 85°C and has a terminal pitch of 0.5mm. Ideal for telecom circuit applications due to its compact size and surface mount capability.
R-XDSO-N6
1.6 mm
VSON
SMALL OUTLINE, VERY THIN PROFILE
1.2 mm
TCP-3027H-QT
TCP-3027H-QT by Onsemi is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.
R-XQCC-N6
TCP-3082H-QT
TCP-3082H-QT by Onsemi is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.
TCP-3033H-QT
The Onsemi TCP-3033H-QT is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.
TCP-3068H-QT
The Onsemi TCP-3068H-QT is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.
TDA5102XUMA1
Infineon Technologies
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
5 mm
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
3 V
4.4 mm
TDA5100XUMA1
TDA5101XUMA1
TDA5103AHTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
S-PDSO-G10
TSSOP10,.19,20
1.1 mm
.0095 mA
TDA7100HTMA1
TDA7100HTMA1 by Infineon Technologies is a telecom interface IC with 10 terminals in a small outline package. Operating temperature range from -20 to 70°C, suitable for telecom circuits with a nominal voltage of 3V. Features matte tin finish, gull wing terminal form, and shrink pitch package style.
MATTE TIN
HPA02286ARLL
Texas Instruments' HPA02286ARLL is a 24-terminal telecom interface IC in a square chip carrier package. With a supply voltage of 3.3V, it operates b/w 0-85°C and has a terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface-mountable and features nickel palladium gold terminal finish.
S-PQCC-N24
2
SST12LF02-QXCE
Microchip Technology
SST12LF02-QXCE by Microchip: Telecom IC with 16 terminals, 3.3V supply voltage, -20 to 85°C operating temp. Ideal for telecom circuits, surface mountable in a square chip carrier package with 0.5mm terminal pitch.
S-XQCC-N16
XWL1801MODGAMOCT
XWL1801MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm x 13.4mm and terminal pitch of 0.7mm. Ideal for telecom interface applications requiring surface mount technology.
R-PBGA-N100
13.4 mm
LGA
GRID ARRAY
.7 mm
13.3 mm
XWL1805MODGAMOCT
XWL1805MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm width and 13.4mm length. Ideal for telecom circuits, this IC is surface mountable and has a terminal pitch of 0.7mm for various applications.
XWL1831MODGAMOCT
XWL1831MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a grid array package. It operates b/w -20°C to 70°C, making it suitable for various telecom circuit applications. The compact rectangular design with bottom terminals and no-lead form factor ensures easy surface mount installation.
XWL1835MODGAMOCT
XWL1835MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a nominal voltage of 3.7V. This IC is designed for telecom circuit applications requiring surface mount installation and has a compact size of 13.3mm x 13.4mm x 2mm.
3.7 V
TCC-106A-RT
TCC-106A-RT by Onsemi is a Telecom Circuit IC with 20 terminals in a very thin profile grid array package. Operating temperature ranges from -30 to 85 °C, suitable for telecom interface applications. It has a nominal voltage of 3.3V and terminal pitch of 0.4mm, making it ideal for compact electronic devices.
R-PBGA-B20
2.58 mm
20
2.23 mm
TCP-3027N-QT
TCP-3027N-QT by Onsemi is a RECTANGULAR CHIP CARRIER with 6 terminals, suitable for TELECOM CIRCUIT applications. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for surface mount installations due to its very thin profile design.
BGA711N7E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;
2.8 V
1.3 mm
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