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PN512AA0HN1/C2,551

NXP Semiconductors

PN512AA0HN1/C2,551 by NXP Semiconductors

PN512AA0HN1/C2,551 by NXP Semiconductors is a versatile telecom interface IC with a quad terminal layout and operates b/w -30 °C to 85 °C. It supports power supplies of 1.8/3.3V and has a max supply current of 100mA. Ideal for automotive applications, it meets AEC-Q100 standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,211 parts In-Stock

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Vyrian

USA . 3,856 parts In-Stock

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Anansix

USA . 1,959 parts In-Stock

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AZTECH Wire

Italy . 106 parts In-Stock

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$20.410

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One Stop Electronics

USA . 484 parts In-Stock

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$183.000

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UNI Independent Distributors

Spain . 3,829 parts In-Stock

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Corphita

USA . 3,112 parts In-Stock

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Overview

Unlock the potential of your telecommunications projects with NXP Semiconductors' PN512AA0HN1/C2,551. Renowned for quality and innovation, NXP delivers a versatile interface IC designed for reliability in diverse applications. Its robust construction ensures optimal performance across varying temperatures, making it ideal for automotive and industrial solutions. Elevate your designs with a trusted partner that prioritizes excellence and offers unmatched value to propel your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a robust and durable package that can withstand various environmental conditions.

Surface Mount: YES

Being a surface mount component allows for easier integration into compact designs, making it suitable for modern telecom applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 signifies that the product meets stringent automotive quality standards, enhancing reliability in critical applications.

Package Shape: SQUARE

The square shape provides efficient use of board space and allows for symmetrical placement on the PCB, optimizing circuit layout.

Power Supplies (V): 1.8/3.3, 2.5/3.3

The multiple voltage supply options increase flexibility for diverse system designs and power management strategies.

No. of Terminals: 32

32 terminals facilitate complex connections and capabilities, making this IC suitable for advanced telecom functionalities.

Package Style (Meter): CHIP CARRIER

The chip carrier style supports robust electrical connections while maintaining low-profile characteristics ideal for compact devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in a variety of thermal conditions, crucial for telecom applications.

Minimum Operating Temperature: -30 °C

The capability to operate at temperatures as low as -30 °C broadens the scope for deployment in outdoor and harsh environments.

Terminal Position: QUAD

A quad terminal position configuration simplifies routing on PCBs and enables efficient layout designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates compatibility with lead-free solder processes, supporting environmentally friendly manufacturing practices.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of mechanical stress and enhances soldering reliability, contributing to the longevity of the component.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA allows sufficient power for high-performance operations, catering to demanding telecom applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density designs, enabling the use of smaller PCBs and components in modern electronics.

Moisture Sensitivity Level (MSL): 3

Being rated at MSL 3 suggests that the product has a moderate sensitivity to moisture, guiding storage and handling practices to prevent damage.

Technical Specifications

Other Function Telecom Interface ICs PN512AA0HN1/C2,551 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,2.5/3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

PN512AA0HN1/C2,551 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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