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PN5120A0HN/C2

NXP Semiconductors

PN5120A0HN/C2 by NXP Semiconductors

PN5120A0HN/C2 by NXP Semiconductors is a 40-terminal telecom IC with a 3V supply voltage. It features a chip carrier package style, quad terminal position, and measures 6mm x 6mm in width and length. Ideal for telecom circuits, this surface-mount IC has a max seated height of 1mm and terminal pitch of 0.5mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,112 parts In-Stock

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Digiode

USA . 1,965 parts In-Stock

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Vyrian

USA . 1,213 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Corohmni

South Africa . 6 parts In-Stock

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$4.950

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6

$4.950

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AZTECH Wire

Italy . 801 parts In-Stock

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$13.292

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801

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Semicontronic

India . 1,274 parts In-Stock

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$71.000

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$69.225

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$68.870

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$71.000

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$68.870

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One Stop Electronics

USA . 773 parts In-Stock

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$255.000

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773

$255.000

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Ampacity Inc.

Singapore . 1,135 parts In-Stock

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$690.000

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A-Z Elektronik GmbH

Germany . 7,238 parts In-Stock

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Continental Prestige Electronics

USA . 5,866 parts In-Stock

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Lixinc

USA . 5,607 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 780 parts In-Stock

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780

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Argo Parts USA

USA . 458 parts In-Stock

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458

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UNI Independent Distributors

Spain . 160 parts In-Stock

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160

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Experience seamless connectivity and communication with the PN5120A0HN/C2 by NXP Semiconductors. Known for their high-quality products, NXP Semiconductors delivers cutting-edge solutions that provide reliable performance in various applications. This telecom interface IC offers exceptional value with its compact size, ease of installation, and low power consumption. Elevate your projects with the PN5120A0HN/C2 and enjoy the benefits of superior connectivity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides good durability and protection for the internal circuitry of the telecom interface IC.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving time and effort during production.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various telecommunications applications, making this IC versatile and adaptable.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a compact and space-saving design in electronic devices where size constraints are a concern.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in many electronic systems, making this IC compatible with a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs PN5120A0HN/C2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

PN5120A0HN/C2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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