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AP22811BW5-7

Diodes Incorporated

AP22811BW5-7 by Diodes Incorporated

Diodes Inc.'s AP22811BW5-7 is a 5-terminal, telecom interface IC with matte tin finish. Operating temp range -40 to 85°C. Telecom circuit type with nominal voltage of 5V. Ideal for industrial applications requiring small outline, low profile package style.

Median Price

$0.259

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 155,895 parts In-Stock

1+ parts

$0.390

100+ parts

$0.209

1k+ parts

$0.176

10k+ parts

-

155,895

$0.390

$0.209

$0.176

-

Mouser Electronics

USA . 5,022 parts In-Stock

1+ parts

$0.390

100+ parts

$0.208

1k+ parts

$0.193

10k+ parts

-

5,022

$0.390

$0.208

$0.193

-

Newark

USA . 284 parts In-Stock

1+ parts

$0.402

100+ parts

$0.215

1k+ parts

$0.181

10k+ parts

-

284

$0.402

$0.215

$0.181

-

RS (Exports)

UK . 6,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,930

-

-

-

-

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.131

3,000

-

-

-

$0.131

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.131

3,000

-

-

-

$0.131

Element14

Singapore . 1,954 parts In-Stock

1+ parts

-

100+ parts

$0.259

1k+ parts

$0.229

10k+ parts

$0.220

1,954

-

$0.259

$0.229

$0.220

Farnell

UK . 419 parts In-Stock

1+ parts

-

100+ parts

$0.212

1k+ parts

$0.144

10k+ parts

$0.140

419

-

$0.212

$0.144

$0.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.200

-

-

-

TME

Poland . 203 parts In-Stock

1+ parts

$0.364

100+ parts

$0.192

1k+ parts

$0.169

10k+ parts

$0.157

203

$0.364

$0.192

$0.169

$0.157

Vyrian

USA . 33,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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33,893

-

-

-

-

Chip Stock

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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18,000

-

-

-

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,000

-

-

-

-

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.140

3,000

-

-

-

$0.140

VNN

France . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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200

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 33,210 parts In-Stock

1+ parts

$0.117

100+ parts

-

1k+ parts

-

10k+ parts

-

33,210

$0.117

-

-

-

Semicontronic

India . 33,047 parts In-Stock

1+ parts

$0.117

100+ parts

$0.114

1k+ parts

$0.113

10k+ parts

-

33,047

$0.117

$0.114

$0.113

-

Argo Parts USA

USA . 3,203 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

$0.194

3,203

$0.200

-

-

$0.194

Corohmni

South Africa . 98 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

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98

$0.200

-

-

-

Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.180

10k+ parts

$0.178

40

$0.200

$0.190

$0.180

$0.178

Continental Prestige Electronics

USA . 4,079 parts In-Stock

1+ parts

$0.482

100+ parts

$0.246

1k+ parts

$0.164

10k+ parts

$0.126

4,079

$0.482

$0.246

$0.164

$0.126

Aztec Data Supply Inc.

USA . 2,342 parts In-Stock

1+ parts

$17.350

100+ parts

-

1k+ parts

-

10k+ parts

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2,342

$17.350

-

-

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Perfect Parts

USA . 196,405 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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196,405

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-

-

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Lixinc

USA . 18,925 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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18,925

-

-

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,000

-

-

-

-

Overview

Unlock seamless communication with the AP22811BW5-7 by Diodes Incorporated. As a leader in the industry of Other Function Telecom Interface ICs, Diodes Incorporated delivers unparalleled quality and reliability. Perfect for a wide range of applications, this product offers customers exceptional value and benefits. Experience improved connectivity and efficiency with this innovative solution. Trust Diodes Incorporated to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight and durable construction, making the product suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and making assembly simpler.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB designs, facilitating integration into different systems.

No. of Terminals: 5

Having 5 terminals provides sufficient connectivity options for the interface IC, allowing for versatility in networking setups.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch design enables a compact footprint, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the IC can withstand demanding operational conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable functionality even in harsh environments or temperature fluctuations.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, enhancing the overall reliability and longevity of the product.

Terminal Position: DUAL

The dual terminal position offers flexibility in connectivity and placement, allowing for easier installation and improved signal transmission.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to a sleek and streamlined design, beneficial for applications where space optimization is crucial.

Width: 1.6 mm

The narrow width dimension enhances compatibility with compact PCB layouts, enabling efficient use of board space in electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper solder melting and joint formation, essential for durable connections.

Length: 3 mm

The compact length dimension aids in achieving a space-efficient design, advantageous for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the IC is suitable for operation in harsh industrial environments, offering reliable performance under tough conditions.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical support and easy PCB mounting, ensuring stable connections and robust installation.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, it is specifically designed for telecommunications applications, ensuring optimized performance and compatibility in networking systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage requirement makes the product compatible with standard power sources, simplifying integration into various electronic systems.

Terminal Pitch: 0.95 mm

The narrow terminal pitch allows for high-density mounting on PCBs, facilitating a more compact and efficient circuit layout.

Technical Specifications

Other Function Telecom Interface ICs AP22811BW5-7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Diodes Incorporated

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

AP22811BW5-7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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