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TMS3705DDRQ1

Texas Instruments

TMS3705DDRQ1 by Texas Instruments

TMS3705DDRQ1 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. This AEC-Q100 compliant IC is ideal for industrial applications requiring small outline packages and dual terminal positions.

Median Price

$6.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.360

2,200

-

-

-

$6.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.576

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$5.576

-

-

-

Digiode

USA . 2,386 parts In-Stock

1+ parts

$12.530

100+ parts

-

1k+ parts

-

10k+ parts

-

2,386

$12.530

-

-

-

Chip Stock

USA . 10,245 parts In-Stock

1+ parts

-

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10,245

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ComSIT Distribution GmbH

Germany . 9,375 parts In-Stock

1+ parts

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9,375

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-

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TME

Poland . 2,500 parts In-Stock

1+ parts

-

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$9.334

2,500

-

-

-

$9.334

Vyrian

USA . 1,640 parts In-Stock

1+ parts

-

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1,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,538 parts In-Stock

1+ parts

$5.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,538

$5.410

-

-

-

Semicontronic

India . 1,439 parts In-Stock

1+ parts

$5.410

100+ parts

$5.275

1k+ parts

$5.248

10k+ parts

-

1,439

$5.410

$5.275

$5.248

-

Continental Prestige Electronics

USA . 2,281 parts In-Stock

1+ parts

$5.576

100+ parts

-

1k+ parts

-

10k+ parts

$5.464

2,281

$5.576

-

-

$5.464

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.576

100+ parts

-

1k+ parts

$5.297

10k+ parts

$5.185

1,000

$5.576

-

$5.297

$5.185

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$5.687

100+ parts

$5.687

1k+ parts

$5.687

10k+ parts

-

2,500

$5.687

$5.687

$5.687

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Corohmni

South Africa . 85 parts In-Stock

1+ parts

$10.239

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85

$10.239

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Parana Technologies

USA . 818 parts In-Stock

1+ parts

$11.349

100+ parts

$1,053.953

1k+ parts

$10.214

10k+ parts

-

818

$11.349

$1,053.953

$10.214

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Corphita

USA . 2,027 parts In-Stock

1+ parts

$11.871

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2,027

$11.871

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DigiPath Technology Company

USA . 1,443 parts In-Stock

1+ parts

$12.497

100+ parts

$11.497

1k+ parts

-

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1,443

$12.497

$11.497

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-

ChromeModa Solutions

Germany . 5,907 parts In-Stock

1+ parts

$12.752

100+ parts

$10.457

1k+ parts

-

10k+ parts

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5,907

$12.752

$10.457

-

-

IDEA Electronic Components Group

UK . 2,248 parts In-Stock

1+ parts

$12.752

100+ parts

$12.114

1k+ parts

$11.477

10k+ parts

-

2,248

$12.752

$12.114

$11.477

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Kepictronics

USA . 17,500 parts In-Stock

1+ parts

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17,500

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A-Z Elektronik GmbH

Germany . 10,500 parts In-Stock

1+ parts

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100+ parts

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10,500

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-

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Futuretech Components

Singapore . 10,000 parts In-Stock

1+ parts

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10,000

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Argo Parts USA

USA . 4,114 parts In-Stock

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4,114

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Lixinc

USA . 1,081 parts In-Stock

1+ parts

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1,081

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Overview

Enhance your telecom devices with the TMS3705DDRQ1 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. This innovative telecom interface IC offers unparalleled quality and performance, making it ideal for a wide range of applications. With its compact package style and industrial temperature grade, this product provides exceptional value and benefits to customers seeking superior connectivity solutions. Upgrade your telecom systems today with the TMS3705DDRQ1 and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and facilitating automated assembly processes.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product ideal for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on the PCB and facilitates easy placement and soldering.

No. of Terminals: 16

16 terminals allow for a versatile range of connectivity options, enabling the product to be used in various telecom interface applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes footprint on the PCB, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of operating conditions.

Nominal Supply Voltage: 5 V

5V supply voltage is common in many electronic systems, ensuring compatibility with a wide range of devices.

Technical Specifications

Other Function Telecom Interface ICs TMS3705DDRQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TMS3705DDRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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