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TMS37122

Texas Instruments

TMS37122 by Texas Instruments

TMS37122 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a small outline package style, suitable for industrial applications. With a nominal voltage of 3V and gull wing terminal form, it's ideal for telecom interface circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,463 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,463

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-

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Digiode

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,040

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,545 parts In-Stock

1+ parts

$9.797

100+ parts

-

1k+ parts

$10.369

10k+ parts

-

1,545

$9.797

-

$10.369

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ChromeModa Solutions

Germany . 1,793 parts In-Stock

1+ parts

$11.008

100+ parts

$9.027

1k+ parts

-

10k+ parts

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1,793

$11.008

$9.027

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IDEA Electronic Components Group

UK . 21 parts In-Stock

1+ parts

$11.008

100+ parts

$10.458

1k+ parts

$9.907

10k+ parts

-

21

$11.008

$10.458

$9.907

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$15.394

100+ parts

-

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639

$15.394

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One Stop Electronics

USA . 903 parts In-Stock

1+ parts

$302.000

100+ parts

-

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903

$302.000

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Corphita

USA . 3,054 parts In-Stock

1+ parts

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3,054

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DigiPath Technology Company

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$9.925

1k+ parts

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78

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$9.925

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Overview

Discover the cutting-edge TMS37122 by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. This telecom interface IC is perfect for a wide range of applications, offering seamless connectivity and enhanced performance. With a compact design and industrial temperature grade, this product delivers exceptional value and efficiency. Elevate your projects with the TMS37122 and experience unmatched benefits like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and lightweight properties, ensuring reliability in various environmental conditions.

Surface Mount: YES

Surface mount components are easier to assemble and more cost-effective than through-hole components, making this product suitable for efficient manufacturing processes.

No. of Terminals: 16

With a sufficient number of terminals, this product offers versatility in connectivity options for different applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to function effectively in demanding industrial environments without compromising performance.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is commonly used in many electronic devices, making this product compatible with a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs TMS37122 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TMS37122 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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