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TMS320SA32NL

Texas Instruments

TMS320SA32NL by Texas Instruments

TMS320SA32NL by Texas Instruments is a CMOS technology IC with 40 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for telecom interfaces. The rectangular PLASTIC/EPOXY body and DUAL terminal position make it ideal for commercial applications.

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Vyrian

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Digiode

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Manoshevitz Elec. Sales

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Odintec Ltd.

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ECAB

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LittleDiode

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AZTECH Wire

Italy . 897 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 138 parts In-Stock

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ChromeModa Solutions

Germany . 5,169 parts In-Stock

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IDEA Electronic Components Group

UK . 807 parts In-Stock

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One Stop Electronics

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Corphita

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Cyclops Electronics Ltd (Excess)

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Overview

Experience the superior quality and reliability of Texas Instruments with the TMS320SA32NL, a cutting-edge Telecom Interface IC designed to meet all your communication needs. Whether you're looking to enhance your network infrastructure or develop innovative telecommunication solutions, this product offers unmatched performance and versatility. With its advanced technology and commercial-grade temperature range, the TMS320SA32NL provides exceptional value and benefits for customers seeking top-tier connectivity solutions. Trust in Texas Instruments for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and long-lasting.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into various systems.

No. of Terminals: 40

Having 40 terminals provides a high degree of connectivity options for various telecommunications interfaces.

Package Style (Meter): IN-LINE

In-line package style simplifies the installation and connection process, making it user-friendly.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connectivity options.

Temperature Grade: COMMERCIAL

Commercial-grade temperature range ensures compatibility with standard operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it energy-efficient.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and reliable connections, suitable for telecommunications applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm allows for easy assembly and compatibility with various PCB designs.

Technical Specifications

Other Function Telecom Interface ICs TMS320SA32NL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS320SA32NL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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