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TMS37145TEAIEG

Texas Instruments

TMS37145TEAIEG by Texas Instruments

TMS37145TEAIEG by Texas Instruments is an industrial-grade telecom IC with a max operating temp of 85°C and min of -40°C. It comes in a special shape package made of plastic/epoxy, suitable for telecom circuit applications. With peak reflow temp at 260°C for up to 30s, it ensures reliable performance in various telecom interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,354 parts In-Stock

1+ parts

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4,354

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Digiode

USA . 2,008 parts In-Stock

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2,008

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Distributors (Availability)

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AZTECH Wire

Italy . 832 parts In-Stock

1+ parts

$7.156

100+ parts

-

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832

$7.156

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Parana Technologies

USA . 747 parts In-Stock

1+ parts

$13.864

100+ parts

-

1k+ parts

$14.343

10k+ parts

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747

$13.864

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$14.343

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DigiPath Technology Company

USA . 550 parts In-Stock

1+ parts

$15.265

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550

$15.265

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ChromeModa Solutions

Germany . 4,064 parts In-Stock

1+ parts

$15.577

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$12.773

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4,064

$15.577

$12.773

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

1+ parts

$15.577

100+ parts

$14.798

1k+ parts

$14.019

10k+ parts

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1,681

$15.577

$14.798

$14.019

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One Stop Electronics

USA . 964 parts In-Stock

1+ parts

$568.000

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964

$568.000

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Corphita

USA . 1,808 parts In-Stock

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1,808

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Overview

Unlock the power of seamless connectivity with the TMS37145TEAIEG from Texas Instruments. This innovative telecom interface IC boasts top-notch quality and reliability, thanks to its renowned manufacturer. Whether you're looking to enhance your communication systems or streamline your operations, this product is designed to deliver exceptional performance in a variety of applications. Experience the value and benefits of superior technology with the TMS37145TEAIEG - your go-to solution for cutting-edge telecom circuitry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight and cost-effective solution, making it suitable for mass production and reducing overall product weight.

Package Style (Meter): SPECIAL SHAPE

The special shape of the package style may offer unique mechanical and thermal properties, enhancing the performance and reliability of the telecom interface ICs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, these ICs can withstand harsh operating conditions, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in extreme cold climates, making these ICs suitable for a wide range of temperature environments.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures efficient and reliable soldering during the manufacturing process, contributing to the overall product quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables robust soldering connections, ensuring long-term reliability and performance of the telecom interface ICs.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature range, these ICs are suitable for use in rugged industrial applications where temperature fluctuations are common, ensuring consistent performance in demanding conditions.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom circuit, these ICs are optimized for telecommunications applications, offering enhanced functionality and performance tailored to the needs of telecom systems.

Technical Specifications

Other Function Telecom Interface ICs TMS37145TEAIEG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-PXSS-X

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Peak Reflow Temperature (C):

260

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TMS37145TEAIEG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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