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CC1190RGVR

Texas Instruments

CC1190RGVR by Texas Instruments

The Texas Instruments CC1190RGVR is a telecom IC with 16 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. With surface mount capability, it is ideal for industrial telecom applications requiring a compact design and high reliability.

Median Price

$3.710

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 95,102 parts In-Stock

1+ parts

$2.301

100+ parts

$2.016

1k+ parts

$1.139

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-

95,102

$2.301

$2.016

$1.139

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DigiKey

USA . 3,323 parts In-Stock

1+ parts

$3.710

100+ parts

$2.788

1k+ parts

$2.445

10k+ parts

-

3,323

$3.710

$2.788

$2.445

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Mouser Electronics

USA . 2,791 parts In-Stock

1+ parts

$3.710

100+ parts

$2.570

1k+ parts

$2.250

10k+ parts

$2.160

2,791

$3.710

$2.570

$2.250

$2.160

Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$13.533

100+ parts

$12.857

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$12.857

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100

$13.533

$12.857

$12.857

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Farnell

UK . 430 parts In-Stock

1+ parts

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$1.800

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$1.320

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430

-

$1.800

$1.320

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Element14

Singapore . 425 parts In-Stock

1+ parts

-

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$3.950

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$3.200

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425

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$3.950

$3.200

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.709

100+ parts

-

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500

$1.709

-

-

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Digiode

USA . 406 parts In-Stock

1+ parts

$2.186

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406

$2.186

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Chip Stock

USA . 176,040 parts In-Stock

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Vyrian

USA . 18,265 parts In-Stock

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Semtec, LLC

USA . 12,550 parts In-Stock

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12,550

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Cyclops Electronics Ltd

UK . 8,101 parts In-Stock

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LWI Electronics Inc

India . 47 parts In-Stock

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47

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Classic Components Corporation

USA . 46 parts In-Stock

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46

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Prism Electronics

USA . 43 parts In-Stock

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43

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Semi Source

USA . 33 parts In-Stock

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33

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Velocity Electronics

USA . 24 parts In-Stock

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24

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ComSIT Distribution GmbH

Germany . 21 parts In-Stock

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21

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,821 parts In-Stock

1+ parts

$1.709

100+ parts

-

1k+ parts

-

10k+ parts

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2,821

$1.709

-

-

-

Bastille Electronics

Australia . 550 parts In-Stock

1+ parts

$1.709

100+ parts

$1.624

1k+ parts

$1.542

10k+ parts

$1.521

550

$1.709

$1.624

$1.542

$1.521

Ampacity Inc.

Singapore . 18,251 parts In-Stock

1+ parts

$1.960

100+ parts

-

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-

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18,251

$1.960

-

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Semicontronic

India . 18,149 parts In-Stock

1+ parts

$1.960

100+ parts

$1.911

1k+ parts

$1.901

10k+ parts

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18,149

$1.960

$1.911

$1.901

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Corphita

USA . 2,762 parts In-Stock

1+ parts

$2.071

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2,762

$2.071

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Continental Prestige Electronics

USA . 2,337 parts In-Stock

1+ parts

$2.990

100+ parts

$1.960

1k+ parts

$1.460

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2,337

$2.990

$1.960

$1.460

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Parana Technologies

USA . 2,201 parts In-Stock

1+ parts

$7.042

100+ parts

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1k+ parts

$7.584

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2,201

$7.042

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$7.584

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DigiPath Technology Company

USA . 988 parts In-Stock

1+ parts

$7.754

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988

$7.754

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ChromeModa Solutions

Germany . 6,350 parts In-Stock

1+ parts

$7.912

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$6.488

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6,350

$7.912

$6.488

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IDEA Electronic Components Group

UK . 265 parts In-Stock

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$7.912

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$7.121

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265

$7.912

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Corohmni

South Africa . 414 parts In-Stock

1+ parts

$12.756

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414

$12.756

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$13.533

100+ parts

$12.857

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$12.857

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100

$13.533

$12.857

$12.857

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Epart123

USA . 50,000 parts In-Stock

1+ parts

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$1.080

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$1.080

Lixinc

USA . 14,752 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,023 parts In-Stock

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7,023

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Alle Elektronik GmbH

Germany . 3,002 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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Kepictronics

USA . 1,200 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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150

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Overview

Enhance your telecommunications projects with the CC1190RGVR by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge solutions in the Other Function Telecom Interface ICs category. This versatile chip carrier offers a wide range of applications and is designed to operate efficiently in industrial settings. With a nominal supply voltage of 3V and a compact square package shape, this telecom circuit ensures reliable performance at temperatures ranging from -40 to 85°C. Trust Texas Instruments to provide the value, benefits, and advantages you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good insulation properties and durability, making the product suitable for various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs.

Power Supplies (V): 2.5/3.3

Supporting multiple power supplies provides flexibility in design and compatibility with different systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Ni/Pd/Au finish offers excellent corrosion resistance and solderability for long-term functionality.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.

Technical Specifications

Other Function Telecom Interface ICs CC1190RGVR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

CC1190RGVR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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