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CC1175RHMR

Texas Instruments

CC1175RHMR by Texas Instruments

The Texas Instruments CC1175RHMR is a telecom IC with 32 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with power supplies of 2.5/3.3V. Ideal for telecom circuits, it has a terminal pitch of 0.5mm and is suitable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,034 parts In-Stock

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6,034

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Digiode

USA . 4,117 parts In-Stock

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4,117

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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Parana Technologies

USA . 327 parts In-Stock

1+ parts

$6.918

100+ parts

-

1k+ parts

$7.517

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327

$6.918

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$7.517

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DigiPath Technology Company

USA . 929 parts In-Stock

1+ parts

$7.618

100+ parts

$7.008

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-

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929

$7.618

$7.008

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ChromeModa Solutions

Germany . 3,869 parts In-Stock

1+ parts

$7.773

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$6.374

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3,869

$7.773

$6.374

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IDEA Electronic Components Group

UK . 1,440 parts In-Stock

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$7.773

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$6.996

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1,440

$7.773

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$6.996

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AZTECH Wire

Italy . 667 parts In-Stock

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$9.626

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667

$9.626

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Ampacity Inc.

Singapore . 1,501 parts In-Stock

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$10.000

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$10.000

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$12.264

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$11.160

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$10.056

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870

$12.264

$11.160

$10.056

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One Stop Electronics

USA . 1,358 parts In-Stock

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$181.000

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1,358

$181.000

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A-Z Elektronik GmbH

Germany . 6,176 parts In-Stock

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Argo Parts USA

USA . 4,954 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,117 parts In-Stock

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Continental Prestige Electronics

USA . 3,902 parts In-Stock

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Corphita

USA . 1,988 parts In-Stock

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1,988

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Kepictronics

USA . 793 parts In-Stock

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793

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Bastille Electronics

Australia . 21 parts In-Stock

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Overview

Upgrade your telecom interface systems with the CC1175RHMR by Texas Instruments. Manufactured with top-quality materials and advanced technology, this square-shaped chip carrier offers a wide range of applications in the telecom industry. With a low profile and high reliability, this IC provides customers with exceptional value and performance. Trust in Texas Instruments to deliver cutting-edge solutions for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

With surface mount capability, this product is easy to install and provides a compact and space-saving design for efficient PCB layouts.

Package Shape: SQUARE

The square package shape allows for easy handling and integration into existing circuitry, making this product versatile and user-friendly.

Power Supplies (V): 2.5/3.3

With multiple power supply options, this product can be compatible with a variety of systems and voltage requirements, offering flexibility and adaptability.

No. of Terminals: 32

The high number of terminals provides ample connectivity options, allowing for complex and advanced telecom interfaces to be supported.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style offers efficient heat dissipation and space-saving features, ensuring optimal performance in compact electronics.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain stable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making this product suitable for a wide range of temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance and signal integrity.

Terminal Position: QUAD

The quad terminal position enhances signal transmission and connection stability, making this product reliable and suitable for high-speed telecom applications.

Technical Specifications

Other Function Telecom Interface ICs CC1175RHMR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1175RHMR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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